-
公开(公告)号：US20090033443A1
公开(公告)日：2009-02-05
申请号：US11596559
申请日：2006-06-14
申请人： Robert Brian Greed
发明人： Robert Brian Greed
CPC分类号： B81B7/007 , H01P3/10 , H05K1/0237 , H05K1/0306 , H05K3/107 , H05K3/4611 , H05K3/4629 , H05K2201/0376 , H05K2201/0715 , Y10T29/49155
摘要： A circuit board is provided, and a method for manufacturing the same, suitable for use in high frequency circuits, and comprising a planar pattern of transmission line conductors for linking components formed on or within the circuit board, the transmission line conductors being formed within a corresponding pattern of trenches arranged so that the conductors lie beneath a finished surface of the circuit board which is polished flat to permit one or more cover boards to be bonded thereto.
摘要翻译： 提供一种电路板及其制造方法，适用于高频电路，并且包括用于连接形成在电路板上或电路板内的部件的传输线导体的平面图案，传输线导体形成在 沟槽的相应图案被布置成使得导体位于电路板的精加工表面之下，抛光平面以允许一个或多个盖板结合到其上。
-
2.发明授权Microwave circuit assembly comprising a microwave component suspended in a gas or vacuum region 有权微波电路组件包括悬浮在气体或真空区域中的微波组件公开(公告)号：US07999638B2
公开(公告)日：2011-08-16
申请号：US12304995
申请日：2008-06-13
IPC分类号： H01P3/08
CPC分类号： H01P1/203 , H01P3/08 , Y10T29/49117
摘要： A microwave circuit assembly includes a Liquid Crystalline Polymer (LCP) layer that supports at least one microwave circuit component. First and second ground plane layers form the outer surfaces of the assembly and these are spaced apart at least partially by a gas, a mixture of gases, or a vacuum, from the LCP supporting layer and the at least one microwave circuit.
摘要翻译： 微波电路组件包括支持至少一个微波电路部件的液晶聚合物（LCP）层。 第一和第二接地平面层形成组件的外表面，并且它们至少部分地由来自LCP支撑层和至少一个微波电路的气体，气体或真空的混合物间隔开。
-
3.发明授权Circuit board defined by transmission line patterns disposed within trenches and covered by a conformal layer 失效电路板由设置在沟槽内并由保形层覆盖的传输线图案限定公开(公告)号：US07852175B2
公开(公告)日：2010-12-14
申请号：US11596559
申请日：2006-06-14
申请人： Robert Brian Greed
发明人： Robert Brian Greed
CPC分类号： B81B7/007 , H01P3/10 , H05K1/0237 , H05K1/0306 , H05K3/107 , H05K3/4611 , H05K3/4629 , H05K2201/0376 , H05K2201/0715 , Y10T29/49155
摘要： A circuit board is provided, and a method for manufacturing the same, suitable for use in high frequency circuits, and comprising a planar pattern of transmission line conductors for linking components formed on or within the circuit board, the transmission line conductors being formed within a corresponding pattern of trenches arranged so that the conductors lie beneath a finished surface of the circuit board which is polished flat to permit one or more cover boards to be bonded thereto.
摘要翻译： 提供一种电路板及其制造方法，适用于高频电路，并且包括用于连接形成在电路板上或电路板内的元件的传输线导体的平面图案，传输线导体形成在 沟槽的相应图案被布置成使得导体位于电路板的精加工表面之下，抛光平面以允许一个或多个盖板结合到其上。
-
公开(公告)号：US06184757B2
公开(公告)日：2001-02-06
申请号：US09089447
申请日：1998-06-03
IPC分类号： H01P308
CPC分类号： H01P1/30 , H01L23/445 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48472 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/14 , H01L2924/3011 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/85399
摘要： A number of electronic modules 82, 82′, 83, 83′ are mounted on a cold finger 100 disposed within a sealed housing 104, 110, the interior 210 of which is evacuated. To minimize heat transfer by conduction, gaps are provided in the dielectric substrates carrying the input and output transmission lines providing signal paths between the modules and electrical connectors on the exterior sidewalls 106, 108 of the housing. The gaps are bridged by thin conductive wires, thereby providing low electrical, but high thermal, impedance at the gaps. A number of module assemblies may be stacked on a single cold finger. To allow modules to be adjusted under actual operating conditions, a cover having a number of spring-loaded screwdrivers extending through vacuum tight seals and aligned with adjustable components of the modules, may be temporarily substituted for the enclosure lid 110. The springs urge the screwdrivers out of engagement when no adjustment is being made to minimize heat transfer.
摘要翻译： 许多电子模块82,82'，83,83'安装在设置在密封壳体104,110内的冷指状物100上，其内部210被抽真空。 为了通过传导最小化热传递，在承载输入和输出传输线的电介质基板中提供间隙，从而提供模块之间的信号路径和外壳的外侧壁106,108上的电连接器。 间隙由细导线桥接，从而在间隙处提供低电，但高热阻。 多个模块组件可以堆叠在单个冷手指上。 为了允许在实际操作条件下调节模块，可以暂时取代具有延伸穿过真空密封并与模块的可调部件对准的多个弹簧加载的螺丝刀的盖子。弹簧推动螺丝刀 在不进行调整以尽量减少传热的情况下脱离接合。
-
公开(公告)号：US20100237966A1
公开(公告)日：2010-09-23
申请号：US12304995
申请日：2008-06-13
CPC分类号： H01P1/203 , H01P3/08 , Y10T29/49117
摘要： A microwave circuit assembly includes a Liquid Crystalline Polymer (LCP) layer that supports at least one microwave circuit component. First and second ground plane layers form the outer surfaces of the assembly and these are spaced apart at least partially by a gas, a mixture of gases, or a vacuum, from the LCP supporting layer and the at least one microwave circuit.
摘要翻译： 微波电路组件包括支持至少一个微波电路部件的液晶聚合物（LCP）层。 第一和第二接地平面层形成组件的外表面，并且它们至少部分地由来自LCP支撑层和至少一个微波电路的气体，气体或真空的混合物间隔开。
-
-
-
-
搜索结果
5 条记录 (耗时 0.014 秒)