公开(公告)号：US06748289B2

公开(公告)日：2004-06-08

申请号：US09765667

申请日：2001-01-22

申请人： Noboru Nishikawa ,  Akihiko Wachi ,  Hiroyoshi Saito

发明人： Noboru Nishikawa ,  Akihiko Wachi ,  Hiroyoshi Saito

IPC分类号： G06F1900

CPC分类号： B41F35/005 ,  B41F15/0813 ,  H05K1/0269 ,  H05K3/1233 ,  H05K3/26 ,  H05K2203/163 ,  Y10T29/53004

摘要： The present invention relates to a control method for improving the productivity of a screen printer for an electronics-mounting machine. Thus, a screen printer according to this invention uses a recognition camera to inspect the results of printing of a circuit board concurrently with a cleaning operation of the rear surface of a screen, thereby enabling the effective use of time. This screen printer also enables cream solder to be automatically supplied to reduce the operation time by determining whether the next screen to be used is unused. During automatic screen replacement, this screen printer enables a desired screen stored in the corresponding stocker to be automatically specified in order to replace the current screen in response to a selected NC program.

摘要翻译： 本发明涉及一种用于提高电子安装机的丝网印刷机的生产率的控制方法。 因此，根据本发明的丝网印刷机使用识别照相机来与屏幕后表面的清洁操作同时检查电路板的打印结果，从而能够有效地利用时间。 该屏幕打印机还可以通过确定下一个要使用的屏幕是否未使用，自动提供膏状焊料以减少操作时间。 在自动屏幕更换期间，该屏幕打印机使得能够自动指定存储在相应储存器中的所需屏幕，以便响应于所选择的NC程序来替换当前屏幕。

公开(公告)号：US20050077340A1

公开(公告)日：2005-04-14

申请号：US10952641

申请日：2004-09-29

申请人： Nobuyasu Nagafuku ,  Noboru Nishikawa ,  Takeshi Kuribayashi

发明人： Nobuyasu Nagafuku ,  Noboru Nishikawa ,  Takeshi Kuribayashi

IPC分类号： H05K13/04 ,  H05K13/08 ,  B23K37/00

CPC分类号： H05K13/0465 ,  H05K13/0817 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49149

摘要： This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. This invention further provides apparatus, devices, and system using the method. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

摘要翻译： 本发明提供一种能够有效地利用自对准效果的电子部件安装方法，即使电子部件的安装间隔小。 该方法包括检测焊膏在电路板上的打印位置和安装电子部件的步骤。 本发明还提供了使用该方法的装置，装置和系统。 印刷具有形成在其上的焊盘的电路板上的焊膏，并且安装电子部件时，通过包括在检查装置中的打印位置检测装置检测电路板的焊膏的打印位置。 然后，通过使用检测到的焊膏的打印位置作为参考，通过电子部件安装装置来安装电子部件。

公开(公告)号：US6119592A

公开(公告)日：2000-09-19

申请号：US240485

申请日：1999-01-29

申请人： Noboru Nishikawa ,  Hiroki Yamamoto ,  Takeshi Kuribayashi

发明人： Noboru Nishikawa ,  Hiroki Yamamoto ,  Takeshi Kuribayashi

IPC分类号： B41F15/08 ,  H01L21/48 ,  H05K3/12 ,  B41L13/08 ,  B05C17/08 ,  B41L39/02

CPC分类号： H01L21/4867 ,  B41F15/0809 ,  H05K3/1225 ,  B41P2215/12

摘要： A belt-like screen carrying a row of printing patterns is held between two roller screen holders. The printing patterns are advanced one by one to a printing position by the rotation of the roller screen holders. This allows the printing patterns to be changed from one to another. Frames are provided for locking and unlocking the printing patterns at the printing position. The completion of a run of printed circuit boards can be monitored to automatically change the printing patterns.

摘要翻译： 带有一排印刷图案的带状屏幕被保持在两个滚筒筛架之间。 通过滚筒丝杠支架的旋转，打印图案逐个前进到打印位置。 这允许打印图案从一个改变到另一个。 提供框架，用于在打印位置锁定和解锁打印图案。 可以监控印刷电路板的运行情况，自动更改印刷图案。

公开(公告)号：US06609806B2

公开(公告)日：2003-08-26

申请号：US09871901

申请日：2001-06-04

申请人： Toshiaki Asakawa ,  Shigeyuki Adachi ,  Shinichi Niwa ,  Noboru Nishikawa

发明人： Toshiaki Asakawa ,  Shigeyuki Adachi ,  Shinichi Niwa ,  Noboru Nishikawa

IPC分类号： F21V704

CPC分类号： G02B6/0028 ,  G02B6/0038 ,  G02B6/005 ,  G02B6/0061

摘要： A clear image can be achieved by preventing dusts from collecting in grooves formed in a transparent substrate and by improving contrast as well. A film is provided in such a manner as to cover a light reflection pattern formed in the surface of the transparent substrate. The film is sealingly fixed to the transparent substrate for preventing dusts from entering the light reflection pattern (particularly the grooves) during the process of assembling the spread illuminating apparatus. Also, the surface of the transparent substrate can be protected from scratches thanks to the film fixed. The amount of interface reflection can be reduced by using resin or the like as the film material, and contrast can be improved by setting the thickness of the film to a value smaller than prescribed.

摘要翻译： 可以通过防止灰尘聚集在形成在透明基板中的凹槽中并通过改善对比度来实现清晰的图像。 以覆盖在透明基板的表面上形成的光反射图案的方式设置膜。 在组装展开的照明装置的过程中，膜密封地固定到透明基板上，以防止灰尘进入光反射图案（特别是凹槽）。 此外，由于膜固定，可以保护透明基板的表面免受划痕。 通过使用树脂等作为膜材料可以减少界面反射量，并且可以通过将膜的厚度设定为小于规定值的值来提高对比度。

公开(公告)号：US5361968A

公开(公告)日：1994-11-08

申请号：US70716

申请日：1993-06-01

申请人： Keizou Tanaka ,  Noboru Nishikawa ,  Tsuyoshi Kawase ,  Masami Watanabe

发明人： Keizou Tanaka ,  Noboru Nishikawa ,  Tsuyoshi Kawase ,  Masami Watanabe

IPC分类号： B23K33/00 ,  B23K35/30 ,  B23K31/02

CPC分类号： B23K33/004 ,  B23K35/308

摘要： A metallic press die having an edge portion or high pressure portion for processing a workpiece therewith is made by overlaying a welding material to that portion of a base material for the metallic press die which forms the edge portion or high pressure portion, and then machining an overlaid portion into a predetermined shape of the edge portion or high pressure portion. The welding material has a hardness after welding of HRC 45 or below. After the machining step, the overlaid portion is subjected to a subzero treatment to increase the hardness of the overlaid portion. The welding material contains, as a basic composition thereof, 0.5-1.5% by weight of carbon (C), 0.2 -2.0% by weight of silicon (Si), 0.3-6.0% by weight of manganese (Mn), 0.3-10.0% by weight of chromium (Cr), 0.3-10.0% by weight of cobalt (Co), and the remaining parts of iron (Fe) inclusive of unavoidable impurities, and wherein a starting temperature of martensitic transformation is 150 .degree. C. or below.

摘要翻译： 具有用于加工工件的边缘部分或高压部分的金属压模通过将焊接材料覆盖在形成边缘部分或高压部分的金属压模的基材的那部分上，然后机加工 覆盖部分形成边缘部分或高压部分的预定形状。 焊接材料在HRC 45或以下的焊接后具有硬度。 在加工步骤之后，重叠的部分经受亚零处理以增加重叠部分的硬度。 作为其基本组成，焊接材料含有0.5-1.5重量％的碳（C），0.2-2.0重量％的硅（Si），0.3-6.0重量％的锰（Mn），0.3-10.0 铬（Cr）重量％，钴（Co）0.3〜10.0重量％，剩余部分铁（Fe）为不可避免的杂质，马氏体相变的起始温度为150℃以下 。

公开(公告)号：US06904672B2

公开(公告)日：2005-06-14

申请号：US10092053

申请日：2002-03-05

申请人： Nobuyasu Nagafuku ,  Noboru Nishikawa ,  Takeshi Kuribayashi

发明人： Nobuyasu Nagafuku ,  Noboru Nishikawa ,  Takeshi Kuribayashi

IPC分类号： H05K13/04 ,  H05K13/08 ,  H05K3/34

CPC分类号： H05K13/0465 ,  H05K13/0817 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49149

摘要： This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

摘要翻译： 本发明提供一种能够有效地利用自对准效果的电子部件安装方法，即使电子部件的安装间隔小。 该方法包括检测焊膏在电路板上的打印位置和安装电子部件的步骤。 印刷具有形成在其上的焊盘的电路板上的焊膏，并且安装电子部件时，通过包括在检查装置中的打印位置检测装置检测电路板的焊膏的打印位置。 然后，通过使用检测到的焊膏的打印位置作为参考，通过电子部件安装装置来安装电子部件。