公开(公告)号：US20090251119A1

公开(公告)日：2009-10-08

申请号：US12228476

申请日：2008-08-13

申请人： Goran Stojcic ,  Primitivo A. Palasi

发明人： Goran Stojcic ,  Primitivo A. Palasi

IPC分类号： G05F1/10 ,  H01L23/48

CPC分类号： H01L24/83 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A multi-chip package that includes two power semiconductor devices coupled in a half-bridge arrangement and a driver for driving the two power semiconductor devices.

摘要翻译： 包括以半桥装置耦合的两个功率半导体器件和用于驱动两个功率半导体器件的驱动器的多芯片封装。

公开(公告)号：US07183630B1

公开(公告)日：2007-02-27

申请号：US10459230

申请日：2003-06-11

申请人： Harry J. Fogelson ,  Ludcvico Estrada Bancod ,  Ahmer Syed ,  Terry Davis ,  Primitivo A. Palasi ,  William M. Anderson

发明人： Harry J. Fogelson ,  Ludcvico Estrada Bancod ,  Ahmer Syed ,  Terry Davis ,  Primitivo A. Palasi ,  William M. Anderson

IPC分类号： H01L23/495

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00

摘要： A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Each of the leads defines opposed top and bottom surfaces, an inner end, an outer end, and an opposed pair of side surfaces. The bottom surface and the outer end collectively define a corner region of the lead. Formed within the corner region is a recess which is sized and configured to accommodate the flow of reflow solder thereinto.

摘要翻译： 引线框架，其包括限定中心开口的框架。 设置在中央开口内的是与框架连接的管芯焊盘。 还连接到框架的是在开口内朝向管芯焊盘延伸的多个引线。 每个引线限定相对的顶表面和底表面，内端，外端和相对的一对侧表面。 底表面和外端共同限定引线的拐角区域。 形成在拐角区域内的是凹槽，其尺寸和构造适于容纳回流焊料的流动。

公开(公告)号：US06885086B1

公开(公告)日：2005-04-26

申请号：US10093267

申请日：2002-03-05

申请人： Harry J. Fogelson ,  Ludovico E. Bancod ,  Gregorio G. dela Cruz ,  Primitivo A. Palasi ,  William M. Anderson ,  Ahmer Syed

发明人： Harry J. Fogelson ,  Ludovico E. Bancod ,  Gregorio G. dela Cruz ,  Primitivo A. Palasi ,  William M. Anderson ,  Ahmer Syed

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L24/97 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00

摘要： A lead frame strip for use in the manufacture of integrated circuit chip packages. The strip comprises at least one array defining a multiplicity of lead frames. The lead frames each include an outer frame defining a central opening having a die pad disposed therein. Attached to the outer frame and extending toward the die pad in spaced relation to each other are a plurality of leads. The outer frames are integrally connected to each other such that the lead frames are arranged in a matrix wherein the leads thereof extend in multiple rows and columns. The leads of the lead frames within each of the rows and columns are arranged in sets which are disposed in spaced relation to each other. A plurality of openings are formed within the strip between and in alignment with the leads of each of the lead frames within each of the rows and columns. The leads of each of the lead frames within each of the rows and columns and the openings collectively define saw streets for cutting the strip in a manner separating the lead frames from each other.

摘要翻译： 用于制造集成电路芯片封装的引线框架条。 条带包括限定多个引线框架的至少一个阵列。 引线框架各自包括限定中心开口的外框架，其中设置有管芯焊盘。 连接到外框架并且彼此间隔开地朝向管芯焊盘延伸的是多个引线。 外框架彼此一体地连接，使得引线框架布置成矩阵，其中引线以多行和多列延伸。 每行和列中的引线框架的引线以彼此间隔开的关系设置成一组。 在每个行和列内的每个引线框架的引线之间并与之对齐地形成多个开口。 每个行和列中的每个引线框架的引线和开口共同地限定用于以将引线框架彼此分离的方式切割条带的锯条。

公开(公告)号：US06608366B1

公开(公告)日：2003-08-19

申请号：US10122598

申请日：2002-04-15

申请人： Harry J. Fogelson ,  Ludovico Estrada Bancod ,  Ahmer Syed ,  Terry Davis ,  Primitivo A. Palasi ,  William M. Anderson

发明人： Harry J. Fogelson ,  Ludovico Estrada Bancod ,  Ahmer Syed ,  Terry Davis ,  Primitivo A. Palasi ,  William M. Anderson

IPC分类号： H01L23495

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00

摘要： A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Each of the leads defines opposed top and bottom surfaces, an inner end, an outer end, and an opposed pair of side surfaces. The bottom surface and the outer end collectively define a corner region of the lead. Formed within the corner region is a recess which is sized and configured to accommodate the flow of reflow solder thereinto.

摘要翻译： 引线框架，其包括限定中心开口的框架。 设置在中央开口内的是与框架连接的管芯焊盘。 还连接到框架的是在开口内朝向管芯焊盘延伸的多个引线。 每个引线限定相对的顶表面和底表面，内端，外端和相对的一对侧表面。 底表面和外端共同限定引线的拐角区域。 形成在拐角区域内的是凹槽，其尺寸和构造适于容纳回流焊料的流动。

公开(公告)号：US5949138A

公开(公告)日：1999-09-07

申请号：US962159

申请日：1997-10-31

申请人： Primitivo A. Palasi ,  Ronaldo M. Arguelles ,  Philip B. Simon

发明人： Primitivo A. Palasi ,  Ronaldo M. Arguelles ,  Philip B. Simon

IPC分类号： H01L23/433 ,  H01L23/34 ,  H01L23/10

CPC分类号： H01L23/4334 ,  H01L2924/0002

摘要： A heat spreader (10) is provided for dissipating heat from a semiconductor die (32). The heat spreader (10) comprises a thermally conductive sheet (12) having an aperture (14) formed therein. At least one set of opposing members (20) extends inwardly, but do not contact, within the aperture (14). The opposing members (20) can receive adhesive material for securing the semiconductor die (32) to the heat spreader (10) such that the semiconductor die (32) is disposed over the aperture (14).

摘要翻译： 散热器（10）用于从半导体管芯（32）散热。 散热器（10）包括其中形成有孔（14）的导热片（12）。 至少一组相对的构件（20）在孔（14）内向内延伸但不接触。 相对的构件（20）可以接收用于将半导体管芯（32）固定到散热器（10）的粘合材料，使得半导体管芯（32）设置在孔（14）上方。