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公开(公告)号：US12076835B2
公开(公告)日：2024-09-03
申请号：US17483943
申请日：2021-09-24
申请人： SK Siltron Co., LTD.
发明人： Yong Choi
CPC分类号： B24B55/06 , B01D46/0027 , B01D46/58 , B01D53/265 , B01D2279/35
摘要： Disclosed are an air circulation system and a final polishing apparatus including the same. The air circulation system improves the degree of contamination in a final polishing apparatus including a housing formed to accommodate a load unit, an unload unit, and a plurality of polishing units. The air circulation system includes air purification units mounted at positions corresponding to the positions of the load unit, the unload unit, and the plurality of polishing units. The air purification units discharge contaminated air in the housing to the outside of the housing, purify the discharged air, and supply the purified air again into the housing.
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公开(公告)号：US12051598B2
公开(公告)日：2024-07-30
申请号：US16981228
申请日：2019-03-11
申请人： SK SILTRON CO., LTD.
发明人： Se Geun Ha
IPC分类号： H01L21/67 , B08B3/04 , B08B3/08 , H01L21/673 , H01L21/687
CPC分类号： H01L21/67057 , B08B3/048 , B08B3/08 , H01L21/67326 , H01L21/68742
摘要： The present invention relates to a wafer cleaning device which can prevent a cleaning solution from leaking and enables prompt treatment. The present invention provides a wafer cleaning device comprising: a cleaning bath which receives a cleaning solution and from which the cleaning solution overflows according to the dipping of wafers; a plurality of lift parts arranged at the outside of the cleaning bath and dipping the cassette into the cleaning solution in the cleaning bath; an external water tank having the cleaning bath and the lift parts received therein and including a drain hole through which the cleaning solution is drained; and a tray which can be detachably attached to the inner bottom surface of the external water tank and collects the cleaning solution to guide same to the drain hole.
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公开(公告)号：US11780050B2
公开(公告)日：2023-10-10
申请号：US17199163
申请日：2021-03-11
申请人： SK SILTRON CO., LTD.
发明人： Ji Hwan Cho
IPC分类号： B24B53/017 , B24B53/00
CPC分类号： B24B53/017 , B24B53/003
摘要： An apparatus of cleaning a polishing pad includes: a first gas nozzle for spraying gas onto the pores of the polishing pad; and a first liquid nozzle for spraying a liquid to the pores of the polishing pad.
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公开(公告)号：US20230287593A1
公开(公告)日：2023-09-14
申请号：US18172900
申请日：2023-02-22
申请人： SK SILTRON CO., LTD.
发明人： Hyun Woo PARK
CPC分类号： C30B15/206 , G06N3/08
摘要： An ingot growing apparatus is composed of a neck portion, a shoulder portion, a body portion, and a tail portion. The ingot growing apparatus comprises a memory configured to store an artificial neural network and a processor.
The processor learns the artificial neural network to obtain a primary shoulder shape model corresponding to training data, updates the obtained primary shoulder shape model based on shoulder information obtained during the growth of a shoulder portion of a first ingot to obtain a secondary shoulder shape model, sets a target tail temperature for growth a tail portion of the first ingot based on the secondary shoulder shape model, and controls the growth of the tail portion of the first ingot according to the set target tail temperature.-
5.发明公开公开(公告)号：US20230219258A1
公开(公告)日：2023-07-13
申请号：US17679285
申请日：2022-02-24
申请人： SK Siltron Co., LTD.
发明人： Ah Reum KIM
IPC分类号： B28D7/04
CPC分类号： B28D7/04
摘要： Disclosed is a workplate for Y-axis compensation of an ingot and a Y-axis compensation method of the ingot using the same, which is configured to facilitate Y-axis compensation of the ingot in a state in which the ingot is attached to the workplate at a cutting-plane angle so as to be cut using a wire-cutting apparatus. More particularly, the workplate includes a bottom plate, having an upper surface formed to be curved downwards with respect to a longitudinal direction of the ingot attached to the workplate, and a top plate, coupled to the bottom plate such that a lower surface thereof is movable along the upper surface of the bottom plate and configured to enable the ingot to be coupled to an upper portion thereof at an X-axis cutting-plane angle.
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公开(公告)号：US20220410432A1
公开(公告)日：2022-12-29
申请号：US17780162
申请日：2020-05-08
申请人： SK Siltron Co., LTD.
发明人： Young Il JIN
摘要： Provided is a wire sawing device comprising an ingot temperature controller, the wire sawing device comprising: a chamber; an ingot clamp supporting an ingot inside the chamber; a first roller and a second roller; a wire which is wound around the first roller and the second roller and cuts the ingot into a plurality of wafers by rotating; a temperature measuring unit which is mounted inside the chamber, in which the ingot is cut, and measures the temperature of the ingot; and a heater unit mounted inside the chamber.
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公开(公告)号：US20220219288A1
公开(公告)日：2022-07-14
申请号：US17483943
申请日：2021-09-24
申请人： SK Siltron Co., LTD.
发明人： Yong Choi
摘要： Disclosed are an air circulation system and a final polishing apparatus including the same. The air circulation system improves the degree of contamination in a final polishing apparatus including a housing formed to accommodate a load unit, an unload unit, and a plurality of polishing units. The air circulation system includes air purification units mounted at positions corresponding to the positions of the load unit, the unload unit, and the plurality of polishing units. The air purification units discharge contaminated air in the housing to the outside of the housing, purify the discharged air, and supply the purified air again into the housing.
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公开(公告)号：US20220161390A1
公开(公告)日：2022-05-26
申请号：US17199163
申请日：2021-03-11
申请人： SK SILTRON CO., LTD.
发明人： Ji Hwan CHO
IPC分类号： B24B53/017 , B24B53/00
摘要： An apparatus of cleaning a polishing pad includes: a first gas nozzle for spraying gas onto the pores of the polishing pad; and a first liquid nozzle for spraying a liquid to the pores of the polishing pad.
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9.发明授权公开(公告)号：US11255023B2
公开(公告)日：2022-02-22
申请号：US16652301
申请日：2018-12-05
申请人： SK SILTRON CO., LTD.
发明人： Jung Hyun Kong , Seong Hun Yun , Ho Jun Lee
摘要： An embodiment provides a silicon supply part including: a silicon supply chamber; a holder provided on an inner wall of a lower region of the silicon supply chamber; a tube elevating vertically by a first cable inside the silicon supply chamber; a guide provided outside the tube and overlapped with the holder vertically; and a stopper elevating vertically by a second cable and inserted into a lower portion of the tube to open and close the lower portion of the tube.
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公开(公告)号：US10818526B2
公开(公告)日：2020-10-27
申请号：US16040401
申请日：2018-07-19
申请人： SK SILTRON CO., LTD
发明人： Se Geun Ha
IPC分类号： H01L21/30 , H01L21/67 , H01L21/304
摘要： The present invention relates to an apparatus of controlling a temperature of a wafer cleaning equipment capable of quickly and accurately determining a detection abnormality of a temperature sensor located inside a cleaning tank, and a method of controlling a temperature using the same.The apparatus of controlling a temperature of a wafer cleaning equipment and the method of controlling a temperature using the same according to the present invention may determine an abnormal operation of a first temperature sensor installed at an inner side of an inner tank by comparing a measurement value of the first temperature sensor installed at the inner side of the inner tank and a measurement value of a second temperature sensor installed at a transfer robot configured to transfer wafers to the inner side of the inner tank.Meanwhile, a method of controlling a temperature of a wafer cleaning equipment according to the present invention may determine an abnormal operation of temperature sensors by comparing measurement values of the temperature sensors installed at an inner side of each of inner tanks in a state of supplying deionized water of a set temperature to each of the inner tanks after discharging a cleaning solution accommodated in each of the inner tanks of a plurality of cleaning tanks.
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