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    Laminate type ceramic electronic component and manufacturing method therefor
    1.
    发明授权
    Laminate type ceramic electronic component and manufacturing method therefor 有权
    层压陶瓷电子元件及其制造方法

    公开(公告)号：US08503160B2

    公开(公告)日：2013-08-06

    申请号：US13208416

    申请日：2011-08-12

    Applicant: Masahito Saruban ,  Makoto Ogawa ,  Akihiro Motoki ,  Takehisa Sasabayashi ,  Takayuki Kayatani

    Inventor： Masahito Saruban ,  Makoto Ogawa ,  Akihiro Motoki ,  Takehisa Sasabayashi ,  Takayuki Kayatani

    IPC: H01G4/228 ,  H01G7/00

    CPC classification number: H01G4/005 ,  H01G4/30 ,  Y10T29/43 ,  Y10T29/435

    Abstract: In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.

    Abstract translation: 在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度 。 为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积 组件主体的端面。 然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。 优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。

    LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
    2.
    发明申请
    LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
    层压型陶瓷电子元件及其制造方法

    公开(公告)号：US20120039015A1

    公开(公告)日：2012-02-16

    申请号：US13208416

    申请日：2011-08-12

    Applicant: Masahito SARUBAN ,  Makoto OGAWA ,  Akihiro MOTOKI ,  Takehisa SASABAYASHI ,  Takayuki KAYATANI

    Inventor： Masahito SARUBAN ,  Makoto OGAWA ,  Akihiro MOTOKI ,  Takehisa SASABAYASHI ,  Takayuki KAYATANI

    IPC: H01G4/30 ,  H01G7/00

    CPC classification number: H01G4/005 ,  H01G4/30 ,  Y10T29/43 ,  Y10T29/435

    Abstract: In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.

    Abstract translation: 在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度 。 为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积 组件主体的端面。 然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。 优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。

    ELECTRONIC COMPONENT
    8.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20110267736A1

    公开(公告)日：2011-11-03

    申请号：US13092996

    申请日：2011-04-25

    Applicant: Takehisa SASABAYASHI ,  Takumi TANIGUCHI

    Inventor： Takehisa SASABAYASHI ,  Takumi TANIGUCHI

    IPC: H01G4/002

    CPC classification number: H01G4/005 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30

    Abstract: A laminate includes insulating layers laminated to each other. Capacitor conductors are embedded in the laminate and have exposed portions exposed between the insulating layers at respective surfaces of the laminate. The capacitor conductors define a capacitor. External electrodes are provided by plating on the respective surfaces of the laminate so as to directly cover the respective exposed portions. When the laminate is viewed in plan in a y axis direction, the length of each of the exposed portions is approximately 35% to approximately 45% of the length of an outer periphery of the insulating layer.

    Abstract translation: 层压体包括彼此层叠的绝缘层。 电容器导体嵌入在层叠体中，并且暴露在层压体的相应表面处的绝缘层之间的暴露部分。 电容器导体定义电容器。 通过电镀在层叠体的各个表面上以直接覆盖各个露出部分来提供外部电极。 当在y轴方向上平面地观察层压体时，每个暴露部分的长度约为绝缘层外周长度的35％至约45％。

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