Semiconductor data processing device
    3.
    发明授权
    Semiconductor data processing device 有权
    半导体数据处理装置

    公开(公告)号:US07110295B2

    公开(公告)日:2006-09-19

    申请号:US11002802

    申请日:2004-12-03

    IPC分类号: G11C16/04

    CPC分类号: G11C16/16 G11C16/30

    摘要: An erasing current is distributed to reduce a load of an internal power circuit and to decrease the number of drivers for erase. A semiconductor data processing device has: a memory array having nonvolatile memory cells arrayed in a matrix and divided into a plurality of erase blocks each instructed to be erased together; and a control circuit, wherein the control circuit controls both of two kinds of erasing voltages applied to the nonvolatile memory cell in the erase block instructed to be erased together to select an erase sector from the erase block for performing erase for each erase sector, thereby performing the erase for each erase sector in time division. Time division erase can distribute an erasing current. Two kinds of erasing voltages are used to select the erase sector. No specific drivers need be provided for each erase sector.

    摘要翻译: 分配擦除电流以减少内部电源电路的负载并减少用于擦除的驱动器的数量。 一种半导体数据处理装置具有:存储阵列,其具有排列成矩阵状的非易失性存储单元,分为多个擦除块,分别被指示一起擦除; 以及控制电路,其中控制电路控制施加到擦除块中的非易失性存储单元的两种擦除电压,这些擦除块被一起擦除,以从擦除块中选择擦除扇区,以便为每个擦除扇区执行擦除,从而 按时间划分每个擦除扇区的擦除。 时分擦除可以分配擦除电流。 使用两种擦除电压来选择擦除扇区。 没有为每个擦除扇区提供特定的驱动程序。

    Nonvolatile semiconductor memory, data deletion method of nonvolatile semiconductor memory, information processing apparatus and nonvolatile semiconductor memory system
    6.
    发明授权
    Nonvolatile semiconductor memory, data deletion method of nonvolatile semiconductor memory, information processing apparatus and nonvolatile semiconductor memory system 失效
    非易失性半导体存储器,非易失性半导体存储器的数据删除方法,信息处理装置和非易失性半导体存储器系统

    公开(公告)号:US06747895B2

    公开(公告)日:2004-06-08

    申请号:US10083602

    申请日:2002-02-27

    IPC分类号: G11C1604

    摘要: This inventing is intended to shorten data deletion time of a nonvolatile semiconductor memory such as a flash memory (EEPROM). When deleting data written to a memory cell MC0 among flash memory cells MC0 to MC2 formed on a semiconductor substrate PSUB through a separation region NiSO, a voltage of p type well PWL0 in which the memory cell MC0 is formed is raised to 10V and a voltage of the separation region NiSO is raised to 12V by using a voltage application unit different from a voltage application unit applying a voltage to the p type well PWL0. As a result, parasitic capacitances Ca1 and Ca2 generated between p type wells PWL1 and PWL2 in which the unselected memory cells MC1 and MC2 are formed and the separation region NiSO, respectively, and a parasitic capacitance Cb generated between the separation region NiSO and the semiconductor substrate PSUB are charged by the voltage application units. It is, therefore, possible to shorten time required to charge the parasitic capacitances and to shorten the deletion time.

    摘要翻译: 本发明旨在缩短诸如闪速存储器(EEPROM)的非易失性半导体存储器的数据删除时间。 当通过分离区域NiSO删除在半导体衬底PSUB上形成的闪存单元MC0至MC2中写入存储单元MC0的数据时,形成存储单元MC0的p型阱PWL0的电压升高到10V, 通过使用与向p型阱PWL0施加电压的电压施加单元不同的电压施加单元将NiSO升高到12V。 结果,在形成未选择的存储单元MC1和MC2的p型阱PWL1和PWL2之间分别产生的寄生电容Ca1和Ca2分别与分离区NiSO和半导体之间产生的寄生电容Cb 基板PSUB由电压施加单元充电。 因此,可以缩短为寄生电容充电所需的时间并缩短删除时间。