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公开(公告)号：US20170181268A1
公开(公告)日：2017-06-22
申请号：US15352862
申请日：2016-11-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Chun-Ming Chiu , Wei-Yu Chen , I-Liang Lee
CPC classification number: H05K1/0216 , H05K1/0203 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K9/003 , H05K9/0088 , H05K2201/0715 , H05K2201/10522 , H05K2203/1311 , H05K2203/1322
Abstract: A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer. When the multilayer shielding film is placed on an electronic device mounted on a circuit board and under application of one or more of heat, vacuum, and pressure, the multilayer shielding film conforms to the electronic device and the electrically conductive adhesive layer adheres to the circuit board providing a seal between the multilayer shielding film and the circuit board.
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公开(公告)号：US20160303838A1
公开(公告)日：2016-10-20
申请号：US15102866
申请日：2014-12-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Wan-Chun Chen , Chun-Ming Chiu , Hui Luo , Tze Yuan Wang , Ta-Hua Yu
CPC classification number: B32B27/36 , B32B7/02 , B32B7/12 , B32B9/00 , B32B15/00 , B32B15/04 , B32B15/08 , B32B27/00 , B32B27/06 , B32B27/18 , B32B27/308 , B32B27/325 , B32B27/365 , B32B2250/00 , B32B2250/05 , B32B2255/10 , B32B2255/20 , B32B2255/205 , B32B2255/26 , B32B2255/28 , B32B2264/00 , B32B2264/102 , B32B2307/202 , B32B2307/40 , B32B2307/412 , B32B2307/418 , B32B2307/42 , B32B2307/546 , B32B2457/00 , B32B2457/20 , B32B2457/208 , C23C14/086 , C23C14/185 , C23C14/34 , G06F3/041 , G06F3/044 , G06F2203/04102 , G06F2203/04103 , G06F2203/04107
Abstract: A transparent multilayer assembly, including a transparent organic polymeric flexible substrate, a transparent conductive layer on the first major surface of the substrate and an antireflective layer on the second major surface of the substrate.
Abstract translation: 一种透明多层组件，包括透明有机聚合物柔性衬底，在衬底的第一主表面上的透明导电层和在衬底的第二主表面上的抗反射层。
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公开(公告)号：US10652996B2
公开(公告)日：2020-05-12
申请号：US15352862
申请日：2016-11-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Chun-Ming Chiu , Wei-Yu Chen , I-Liang Lee
Abstract: A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer. When the multilayer shielding film is placed on an electronic device mounted on a circuit board and under application of one or more of heat, vacuum, and pressure, the multilayer shielding film conforms to the electronic device and the electrically conductive adhesive layer adheres to the circuit board providing a seal between the multilayer shielding film and the circuit board.
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