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Patent Agency Ranking
公开(公告)号：US20170181268A1
公开(公告)日：2017-06-22
申请号：US15352862
申请日：2016-11-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Chun-Ming Chiu , Wei-Yu Chen , I-Liang Lee
CPC classification number: H05K1/0216 , H05K1/0203 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K9/003 , H05K9/0088 , H05K2201/0715 , H05K2201/10522 , H05K2203/1311 , H05K2203/1322
Abstract: A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer. When the multilayer shielding film is placed on an electronic device mounted on a circuit board and under application of one or more of heat, vacuum, and pressure, the multilayer shielding film conforms to the electronic device and the electrically conductive adhesive layer adheres to the circuit board providing a seal between the multilayer shielding film and the circuit board.
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公开(公告)号：US20160120068A1
公开(公告)日：2016-04-28
申请号：US14890389
申请日：2014-05-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Pei Tien , Mihee Lee , Chao-Yuan Wang , Han-Yi Chung , Ching-Yi Liu , Kuo-Chung Lin , Wei-Yu Chen
CPC classification number: H05K7/20481 , B32B3/30 , B32B5/18 , B32B7/02 , B32B7/12 , B32B9/007 , B32B15/08 , B32B15/20 , B32B2266/0214 , B32B2266/0257 , B32B2266/14 , B32B2307/302 , B32B2307/304 , B32B2405/00 , B32B2457/00
Abstract: The present invention provides a heat spreading tape including at least one heat spreading layer adapted for heat dissipation and at least one heat insulating layer adhesively attached to the heat spreading layer. Void regions are formed in the at least one heat insulating layer and are adapted for acting as heat transfer barriers in a direction perpendicular to the major surfaces of the heat spreading tape, i.e. the thickness tape.
Abstract translation: 本发明提供了一种散热带，其包括至少一个适于散热的散热层和至少一个粘附在散热层上的绝热层。 在至少一个隔热层中形成空隙区域，并且适于在垂直于散热带的主表面即厚度带的方向上用作传热阻挡层。
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公开(公告)号：US20160046791A1
公开(公告)日：2016-02-18
申请号：US14461753
申请日：2014-08-18
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Pei Tien , Chao-Yuan Wang , Mei-Chin Liao , Wei-Yu Chen
CPC classification number: C08K5/521 , C08K3/08 , C08K3/22 , C08K5/01 , C08K2003/0812 , C08K2003/2296 , C09K5/14 , G06F1/206
Abstract: The present invention is a thermally conductive clay including a carrier oil, a dispersant, a styrene polyolefin copolymer and thermally conductive particles.
Abstract translation: 本发明是一种导热粘土，其包括载体油，分散剂，苯乙烯聚烯烃共聚物和导热颗粒。
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公开(公告)号：US10652996B2
公开(公告)日：2020-05-12
申请号：US15352862
申请日：2016-11-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Chun-Ming Chiu , Wei-Yu Chen , I-Liang Lee
Abstract: A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer. When the multilayer shielding film is placed on an electronic device mounted on a circuit board and under application of one or more of heat, vacuum, and pressure, the multilayer shielding film conforms to the electronic device and the electrically conductive adhesive layer adheres to the circuit board providing a seal between the multilayer shielding film and the circuit board.
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公开(公告)号：US09353245B2
公开(公告)日：2016-05-31
申请号：US14461753
申请日：2014-08-18
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Pei Tien , Chao-Yuan Wang , Mei-Chin Liao , Wei-Yu Chen
CPC classification number: C08K5/521 , C08K3/08 , C08K3/22 , C08K5/01 , C08K2003/0812 , C08K2003/2296 , C09K5/14 , G06F1/206
Abstract: The present invention is a thermally conductive clay including a carrier oil, a dispersant, a styrene polyolefin copolymer and thermally conductive particles.
Abstract translation: 本发明是一种导热粘土，其包括载体油，分散剂，苯乙烯聚烯烃共聚物和导热颗粒。
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