公开(公告)号：US20200332154A1

公开(公告)日：2020-10-22

申请号：US16768936

申请日：2018-12-17

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Taehoon Noh ,  Mihee Lee ,  Jiwoong Kong

IPC: C09J7/38 ,  C09K5/14 ,  C09J11/04 ,  C09J7/25 ,  H01M10/655 ,  B32B27/30 ,  B32B27/40 ,  B32B27/08 ,  B32B27/20 ,  B32B27/22

Abstract: Multi-layer thermally conductive sheets include at least two layers, a core layer and a surface layer. The core layer and the surface layer are simultaneously cured to form a multi-layer sheet where the core layer is tacky, and the surface layer is non-tacky. In some embodiments, the core layer is relatively soft. In other embodiments, the core layer is relatively hard.

公开(公告)号：US20160120068A1

公开(公告)日：2016-04-28

申请号：US14890389

申请日：2014-05-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Pei Tien ,  Mihee Lee ,  Chao-Yuan Wang ,  Han-Yi Chung ,  Ching-Yi Liu ,  Kuo-Chung Lin ,  Wei-Yu Chen

IPC: H05K7/20 ,  B32B7/12 ,  B32B15/20 ,  B32B3/30 ,  B32B9/00 ,  B32B15/08 ,  B32B7/02 ,  B32B5/18

CPC classification number: H05K7/20481 ,  B32B3/30 ,  B32B5/18 ,  B32B7/02 ,  B32B7/12 ,  B32B9/007 ,  B32B15/08 ,  B32B15/20 ,  B32B2266/0214 ,  B32B2266/0257 ,  B32B2266/14 ,  B32B2307/302 ,  B32B2307/304 ,  B32B2405/00 ,  B32B2457/00

Abstract: The present invention provides a heat spreading tape including at least one heat spreading layer adapted for heat dissipation and at least one heat insulating layer adhesively attached to the heat spreading layer. Void regions are formed in the at least one heat insulating layer and are adapted for acting as heat transfer barriers in a direction perpendicular to the major surfaces of the heat spreading tape, i.e. the thickness tape.

Abstract translation: 本发明提供了一种散热带，其包括至少一个适于散热的散热层和至少一个粘附在散热层上的绝热层。 在至少一个隔热层中形成空隙区域，并且适于在垂直于散热带的主表面即厚度带的方向上用作传热阻挡层。

公开(公告)号：US10104763B2

公开(公告)日：2018-10-16

申请号：US15328535

申请日：2015-10-07

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Mihee Lee ,  Jung-Ju Suh

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K9/00 ,  G06F1/20 ,  H01L23/473 ,  H04M1/02

Abstract: Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.

公开(公告)号：US20170251549A1

公开(公告)日：2017-08-31

申请号：US15328535

申请日：2015-10-07

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Mihee Lee ,  Jung-Ju Suh

IPC: H05K1/02 ,  H05K9/00 ,  G06F1/20 ,  H05K1/18

CPC classification number: H05K1/0216 ,  G06F1/203 ,  H04M1/0277 ,  H05K1/0203 ,  H05K1/181 ,  H05K7/20454 ,  H05K9/0032 ,  H05K9/0035 ,  H05K2201/10371 ,  H05K2201/10522

Abstract: Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.

公开(公告)号：US20160076829A1

公开(公告)日：2016-03-17

申请号：US14785651

申请日：2014-04-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Mihee Lee ,  Hun Jeong

IPC: F28F21/02 ,  F28F21/08 ,  B32B15/09

CPC classification number: F28F21/02 ,  B32B15/09 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2307/30 ,  C09J7/29 ,  C09J2203/326 ,  C09J2400/163 ,  F28F13/00 ,  F28F13/18 ,  F28F21/08 ,  F28F2013/006

Abstract: Provided is a heat dissipating sheet. The heat dissipating sheet includes a metal layer having a first surface and a second surface, at least one graphene layer having a first surface and a second surface, wherein the second surface of the graphene layer comes in contact with the first surface of the metal layer, a protective layer comprising (a) a substrate layer having a first surface and a second surface, wherein the second surface of substrate layer comes in contact with the first surface of the graphene layer, and (b) a pigment layer coming in contact with the first surface of the substrate layer, an adhesive layer having a first surface and a second surface, wherein the first surface of the adhesive layer comes in contact with the second surface of the metal layer, and a release layer coming in contact with the second surface of the adhesive layer, wherein the heat dissipating sheet has a thermal conductivity of 70 W/m·K or more in a horizontal direction.

Abstract translation: 提供了一种散热片。 散热片包括具有第一表面和第二表面的金属层，至少一个具有第一表面和第二表面的石墨烯层，其中石墨烯层的第二表面与金属层的第一表面接触 保护层，包括（a）具有第一表面和第二表面的基底层，其中基底层的第二表面与石墨烯层的第一表面接触，和（b）与 基材层的第一表面，具有第一表面和第二表面的粘合剂层，其中粘合剂层的第一表面与金属层的第二表面接触，并且与第二表面接触的剥离层 表面，其中散热片在水平方向上的热导率为70W / m·K以上。