Electronic material filler, high-frequency substrate, and electronic material slurry

    公开(公告)号:US10851246B2

    公开(公告)日:2020-12-01

    申请号:US16715204

    申请日:2019-12-16

    Abstract: A production method for an electronic material filler includes: a preparation step of preparing a silica particle material produced by a dry method; and a first surface treatment step of performing surface treatment on the silica particle material with a silane compound having a vinyl group, a phenyl group, a phenylamino group, an alkyl group having four or more carbon atoms, a methacryl group, or an epoxy group, to obtain a first surface treatment-processed particle material. After the silica particle material is produced by the dry method, the silica particle material is not brought into contact with liquid water, and has a particle diameter of 100 nm to 600 nm or a specific surface area of 5 m2/g to 35 m2/g.

    Surface-modified particle material and slurry composition

    公开(公告)号:US12187903B2

    公开(公告)日:2025-01-07

    申请号:US17953430

    申请日:2022-09-27

    Abstract: A particle material that has high dispersibility in a dispersion medium such as toluene having high hydrophobicity, and a slurry composition in which the particle material is used, are provided for solving the problem. A surface-modified particle material of the present invention includes: a particle material formed of an inorganic material; and a surface treatment agent formed of a silane compound having a first functional group that has any of C, N, and O atoms away over five or more atoms from Si to which an alkoxide is bound, the surface treatment agent allowing surface treatment of the particle material in such an amount that a degree of hydrophobicity becomes not less than 30%. Dispersibility is enhanced also in a dispersion medium having high hydrophobicity in a case where a functional group having a predetermined structure is introduced so as to impart predetermined or higher hydrophobicity.

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