公开(公告)号：US20240360309A1

公开(公告)日：2024-10-31

申请号：US18765407

申请日：2024-07-08

Applicant: AGC Inc.

Inventor： Mai NISHI ,  Yousuke OCHI ,  Masatoshi ABE ,  Toru SASAKI ,  Masahide YODOGAWA

IPC: C08L71/00

CPC classification number: C08L71/00

Abstract: A resin composition that yields a molded article excellent in impact resistance and exhibits excellent moldability. The resin composition includes at least one type of melt-moldable thermoplastic resin A selected from a polyarylate, a polyether sulfone, a polyaryl sulfone, an aromatic polyetheramide, an aromatic polyetherimide, a polyphenylene sulfide, a polyaryletherketone, a polyamideimide, and a liquid crystal polyester, and a fluorine-containing elastomer B having a terminal functional group. The volume ratio of the thermoplastic resin A and the fluorine-containing elastomer B is from 99:1 to 50:50, and the fluorine-containing elastomer B is dispersed in the thermoplastic resin A. A molded article or the like can be obtained from the resin composition.

公开(公告)号：US20230128396A1

公开(公告)日：2023-04-27

申请号：US18069624

申请日：2022-12-21

Applicant: AGC Inc.

Inventor： Masatoshi ABE ,  Mizuna TOYODA ,  Tsuyoshi KAWAI ,  Shotaro BEPPU

IPC: C09D127/18 ,  C09D7/20 ,  C08F214/26 ,  C08F210/06 ,  C08F2/38 ,  C08K5/14 ,  C08K5/29 ,  C08J3/24 ,  C08J3/28

Abstract: A coating material of the present invention is a coating material containing: a fluorine-containing polymer having at least one of an iodine atom and a bromine atom; and a solvent, wherein a storage elastic modulus G′ of the fluorine-containing polymer is less than 360 kPa, and a total light transmittance of a mixed liquid obtained by mixing and stirring the fluorine-containing polymer and the solvent contained in the coating material is 1.0% or more, the mixed liquid being left to stand for 3 days, stirred again, and left to stand for 30 minutes to measure the total light transmittance.

公开(公告)号：US20240093029A1

公开(公告)日：2024-03-21

申请号：US18522845

申请日：2023-11-29

Applicant: AGC Inc.

Inventor： Masatoshi ABE ,  Toru SASAKI ,  Eiichi NISHI ,  Masahide YODOGAWA

IPC: C08L77/00 ,  B29C48/00

CPC classification number: C08L77/00 ,  B29C48/022 ,  C08L2205/22

Abstract: To provide a poiyamide type composition excellent in impact resistance. A composition comprising a polyamide and a fluorinated polymer, wherein the fluorinated polymer has a glass transition temperature of less than 30° C. and has no melting point, and the fluorinated polymer is dispersed in the polyarnide, and the average dispersed particle diameter of the fluorinated polymer is less than 12 μm.

公开(公告)号：US20250101150A1

公开(公告)日：2025-03-27

申请号：US18977669

申请日：2024-12-11

Applicant: AGC Inc.

Inventor： Masatoshi ABE ,  Kosuke SHIBASAKI ,  Toru SASAKI

IPC: C08F14/26 ,  C09D127/18

Abstract: The present invention provides a crosslinkable fluororesin composition with which it is possible to obtain a molded body, a crosslinked molded body, and a coated wire which have excellent heat resistance and are less likely to have a problem of staining. A crosslinkable fluororesin composition according to the present invention comprises: a fluororesin having a unit based on ethylene and a unit based on tetrafluoroethylene, is melt-moldable, and has a melting point of 210° C. or higher; a crosslinking agent having a plurality of unsaturated carbon bonds; and an antioxidant having at least one of a phenol group and a phosphorus atom and has a molecular weight 10 of 600 or more. A molded body, a crosslinked molded body, and a coated wire according to the present invention are obtained from the crosslinkable fluororesin composition according to the present invention.

公开(公告)号：US20240409741A1

公开(公告)日：2024-12-12

申请号：US18810634

申请日：2024-08-21

Applicant: AGC Inc.

Inventor： Yousuke OCHI ,  Masatoshi ABE ,  Toru SASAKI ,  Masahide YODOGAWA

IPC: C08L77/06

Abstract: To provide a resin composition formable into a molded body excellent in friction properties and heat resistance and a molded body.
A resin composition including: a non-fluorinated thermoplastic resin; a first tetrafluoroethylene polymer; and a second tetrafluoroethylene polymer having a melting point higher than or equal to 260° C. and lower than a melting point of the first tetrafluoroethylene polymer, wherein, relative to the total mass of the non-fluorinated thermoplastic resin, the first tetrafluoroethylene polymer and the second tetrafluoroethylene polymer, the content of the first tetrafluoroethylene polymer is from 4.0 to 32.0 mass %, and the content of the second tetrafluoroethylene polymer is from 0.5 to 10.0 mass %, and wherein the resin composition is obtained by melt-mixing a mixed powder of first particles of the first tetrafluoroethylene polymer and second particles of the second tetrafluoroethylene polymer with a powder of the non-fluorinated thermoplastic resin.

公开(公告)号：US20240067795A1

公开(公告)日：2024-02-29

申请号：US18501345

申请日：2023-11-03

Applicant: AGC Inc.

Inventor： Masatoshi ABE ,  Toru SASAKI ,  Masahide YODOGAWA

IPC: C08K3/04 ,  C08F14/26

CPC classification number: C08K3/041 ,  C08F14/26 ,  B29B7/48

Abstract: To provide resin compositions excellent in electrical conductivity and flexibility. A resin composition comprising a fluororesin and a carbon nanostructure, wherein the carbon nanostructure includes a plurality of carbon nanotubes that are branched and share a common wall with each other.

公开(公告)号：US20210040252A1

公开(公告)日：2021-02-11

申请号：US17070132

申请日：2020-10-14

Applicant: AGC Inc.

Inventor： Tomoya HOSODA ,  Wataru KASAI ,  Toru SASAKI ,  Masatoshi ABE

IPC: C08F214/26 ,  B32B27/30 ,  C09J135/00 ,  C09J7/35 ,  C09J7/25 ,  H05K3/38 ,  C09J127/18 ,  B32B7/12 ,  B32B15/08 ,  B32B37/06 ,  C09J5/06 ,  C23F1/00 ,  H05K1/03 ,  H05K3/06

Abstract: A material for a printed circuit board, which is a film composed of a fluorinated resin layer, where the fluorinated resin layer contains a composition containing a fluorinated copolymer having at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372° C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.

公开(公告)号：US20240174804A1

公开(公告)日：2024-05-30

申请号：US18433745

申请日：2024-02-06

Applicant: AGC Inc.

Inventor： Masatoshi ABE ,  Toru SASAKI ,  Masahide YODOGAWA

IPC: C08G65/48 ,  C08J7/12

CPC classification number: C08G65/48 ,  C08J7/123 ,  C08J2371/08

Abstract: Provided is a composition including a fluorine-containing polymer and a polyaryletherketone, in which the fluorine-containing polymer is dispersed in the polyaryletherketone, and a storage elastic modulus G′ of the composition at a melting point of the polyaryletherketone is 0.1 MPa or more.

公开(公告)号：US20240279461A1

公开(公告)日：2024-08-22

申请号：US18642996

申请日：2024-04-23

Applicant: AGC Inc.

Inventor： Masatoshi ABE ,  Toru SASAKI ,  Mai NISHI ,  Masahide YODOGAWA

IPC: C08L71/02 ,  C08K3/22

CPC classification number: C08L71/02 ,  C08K2003/222 ,  C08K2201/006

Abstract: To provide a resin composition which can reduce the HF gas generation amount at the time of heat forming, which is excellent in heat resistance and which will not be colored; a formed product obtained by heat-forming the resin composition; a composite comprising the formed product, and use thereof.
A resin composition comprising a fluorinated polymer, a non-fluorinated thermoplastic resin and an inorganic compound, wherein the inorganic compound has an average particle size D50 of less than 4.5 μm, and the inorganic compound has neither carbon atom nor hydrogen atom; and a formed product obtained by heat-forming the resin composition.

公开(公告)号：US20230167295A1

公开(公告)日：2023-06-01

申请号：US18158678

申请日：2023-01-24

Applicant: AGC Inc.

Inventor： Norio OZAWA ,  Toru SASAKI ,  Masatoshi ABE

IPC: C08L61/16

CPC classification number: C08L61/16 ,  C08L2201/08 ,  C08L2205/03

Abstract: To provide a molded product which has a high flexural modulus and is excellent in heat resistance and impact resistance at a low temperature; and a resin composition from which the molded product can be obtained.
A resin composition comprising a polyaryl ether ketone, a fluorinated elastomer and an inorganic filler, wherein the proportion of the fluorinated elastomer to the total of the volume of the polyaryl ether ketone and the volume of the fluorinated elastomer, is from 1 to 45 vol %, the proportion of the inorganic filler is from 1 to 50 mass %, and the deflection temperature under load measured in accordance with ASTM D648 under a load of 1.82 MPa is higher than that of the following comparative composition; and a molded product of the resin composition:
comparative composition: a resin composition comprising a polyaryl ether ketone and a fluorinated elastomer and not containing an inorganic filler, wherein the type of the polyaryl ether ketone, the type of the fluorinated elastomer and the proportion of the volume of the fluorinated elastomer to the total of the volume of the polyaryl ether ketone and the volume of the fluorinated elastomer are the same as those of the above resin composition, except that the inorganic filler is not contained.