公开(公告)号：US11240928B2

公开(公告)日：2022-02-01

申请号：US17032956

申请日：2020-09-25

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US09326391B2

公开(公告)日：2016-04-26

申请号：US13969378

申请日：2013-08-16

Applicant: APPLE INC.

Inventor： Charles B. Woodhull ,  Jason S. Sloey

IPC: H05K5/00 ,  H04M1/02

CPC classification number: H01R24/58 ,  H01R13/50 ,  H01R2105/00 ,  H01R2107/00 ,  H04M1/0274 ,  H05K5/0004

Abstract: Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.

Abstract translation: 提供电子设备外壳。 这些外壳可以与完全或部分的插座连接器外壳整体形成，用于接收诸如音频连接器或插头的电连接器。 例如，由聚合物制成的外壳可以在注射成型工艺中与音频插座外壳一体形成。 作为另一示例，外壳可以与音频插座外壳的一个或多个全部或部分壁整体形成，以形成单片聚合物或金属，并且音频插座外壳的其余壁可以包覆成型或组装到聚合物或 音频插座的金属壁和外壳的最近部分，以形成完整或完整的音频插孔外壳。

公开(公告)号：US09288928B2

公开(公告)日：2016-03-15

申请号：US14318346

申请日：2014-06-27

Applicant: APPLE INC.

Inventor： Albert J. Golko ,  Eric S. Jol ,  Charles B. Woodhull

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/14 ,  H02G15/007 ,  H04M1/02 ,  H01R13/516 ,  H01R13/74 ,  H05K5/02

CPC classification number: H05K7/14 ,  H01R13/516 ,  H01R13/748 ,  H02G15/007 ,  H04M1/0274 ,  H05K5/0217

Abstract: A bracket configured to be interposed between the housing of a mobile electronic device and an electrical receptacle that is disposed in the mobile electronic device. The bracket includes a bracket body, an elongated opening through the bracket and a sheath surrounding portions of the bracket body. The bracket body includes an elongated protrusion extending in a front direction from the front face of the bracket body and a pair of fastener accommodations extending through the bracket body, each fastener accommodation disposed on opposite sides of the elongated protrusion. The sheath includes a first portion surrounding a portion of the bracket body elongated protrusion and a second portion including a pair of fastener openings.

Abstract translation: 一种被配置为插入在移动电子设备的壳体和设置在移动电子设备中的电插座之间的支架。 支架包括支架主体，穿过支架的细长开口和环绕支架主体部分的护套。 托架主体包括从支架主体的前表面沿前方延伸的细长突起和延伸穿过支架主体的一对紧固件住座，每个紧固件住宿设置在细长突起的相对侧上。 护套包括围绕支架主体细长突起的一部分的第一部分和包括一对紧固件开口的第二部分。

公开(公告)号：USD733146S1

公开(公告)日：2015-06-30

申请号：US29441670

申请日：2013-01-08

Applicant: Apple Inc.

Designer： Jody Akana ,  Bartley K. Andre ,  Jeremy Bataillou ,  Sawyer Issac Cohen ,  Daniel J. Coster ,  Daniele De Iuliis ,  M. Evans Hankey ,  Julian Hoenig ,  Richard P. Howarth ,  Jonathan P. Ive ,  Duncan Robert Kerr ,  Shin Nishibori ,  David A. Pakula ,  Matthew Dean Rohrbach ,  Peter Russell-Clarke ,  Ashutosh Y. Shukla ,  Christopher J. Stringer ,  Tang Yew Tan ,  Eugene Antony Whang ,  Michael Benjamin Wittenberg ,  Charles B. Woodhull ,  Rico Zörkendörfer

公开(公告)号：US11653466B2

公开(公告)日：2023-05-16

申请号：US17645709

申请日：2021-12-22

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11 ,  C25D11/24

CPC classification number: H05K5/04 ,  B23C5/00 ,  B23C5/1081 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/022 ,  C25D11/12 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/243 ,  H01Q1/42 ,  H04M1/0254 ,  H04M1/11 ,  H05K5/02 ,  H05K5/0217 ,  H05K5/0243 ,  H05K5/0247 ,  H05K5/03 ,  H05K13/00 ,  B23C2220/04 ,  B23C2220/16 ,  B23C2220/20 ,  B23C2220/28 ,  B23C2220/48 ,  B23C2226/31 ,  B23C2226/315 ,  C25D11/246 ,  H04M1/0249 ,  Y10T29/47 ,  Y10T29/49002 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T407/1906 ,  Y10T409/300896 ,  Y10T409/30952 ,  Y10T409/303752

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US10034402B2

公开(公告)日：2018-07-24

申请号：US15832606

申请日：2017-12-05

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23P17/00 ,  H05K5/02 ,  G03F1/38 ,  H04M1/02 ,  H01Q1/24 ,  B23C5/10 ,  H04M1/11 ,  B23C5/00 ,  B23P17/02 ,  C25D11/34 ,  C25D11/12 ,  C25D11/02 ,  H01Q1/42 ,  H05K5/03 ,  C25D7/00 ,  H05K13/00 ,  B23P11/00 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20140069713A1

公开(公告)日：2014-03-13

申请号：US13833224

申请日：2013-03-15

Applicant: APPLE INC.

Inventor： Albert J. Golko ,  Eric S. Jol ,  Charles B. Woodhull

IPC: H02G15/007

CPC classification number: H05K7/14 ,  H01R13/516 ,  H01R13/748 ,  H02G15/007 ,  H04M1/0274 ,  H05K5/0217

Abstract: A bracket configured to be interposed between the housing of a mobile electronic device and an electrical receptacle that is disposed in the mobile electronic device. The bracket includes a bracket body, an elongated opening through the bracket and a sheath surrounding portions of the bracket body. The bracket body includes an elongated protrusion extending in a front direction from the front face of the bracket body and a pair of fastener accommodations extending through the bracket body, each fastener accommodation disposed on opposite sides of the elongated protrusion. The sheath includes a first portion surrounding a portion of the bracket body elongated protrusion and a second portion including a pair of fastener openings.

Abstract translation: 一种被配置为插入在移动电子设备的壳体和设置在移动电子设备中的电插座之间的支架。 支架包括支架主体，穿过支架的细长开口和环绕支架主体部分的护套。 托架主体包括从支架主体的前表面沿前方延伸的细长突起和延伸穿过支架主体的一对紧固件住座，每个紧固件住宿设置在细长突起的相对侧上。 护套包括围绕支架主体细长突起的一部分的第一部分和包括一对紧固件开口的第二部分。

公开(公告)号：US12137529B2

公开(公告)日：2024-11-05

申请号：US18183825

申请日：2023-03-14

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23C5/00 ,  B23C5/10 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/12 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H04M1/11 ,  H05K5/02 ,  H05K5/03 ,  H05K13/00 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US11540408B2

公开(公告)日：2022-12-27

申请号：US15217605

申请日：2016-07-22

Applicant: Apple Inc.

Inventor： Lucy Elizabeth Browning ,  Charles B. Woodhull ,  Bryan Patrick Kiple ,  David A. Pakula ,  Tang Yew Tan ,  Julie Hanchak-Connors ,  John Murray Thornton, III ,  Thomas Johannessen ,  Peter Russell-Clarke ,  Masashige Tatebe ,  Napthaneal Y. Tan

IPC: H05K5/04 ,  H05K5/02 ,  C25D11/02 ,  C25D11/12 ,  C25D11/24 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K13/00 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11

Abstract: Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

公开(公告)号：US10667418B2

公开(公告)日：2020-05-26

申请号：US15958915

申请日：2018-04-20

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan ,  Michael P. Coleman ,  Thomas Johannessen ,  Richard W. Heley

IPC: G06F1/16 ,  H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.