THERMAL MANAGEMENT MODULE OF AN INTEGRATED CIRCUIT ASSEMBLY

    公开(公告)号:US20240395660A1

    公开(公告)日:2024-11-28

    申请号:US18200365

    申请日:2023-05-22

    Applicant: Apple Inc.

    Abstract: A thermal management module for an integrated circuit assembly includes a housing defining a configured to receive a fluid and having a variable cross-sectional area. The thermal management module also includes a wick disposed within the sealed passage, where the wick forms pores configured to convey a liquid form of the fluid toward an evaporator section of the thermal management module. The thermal management module also includes a void formed within the sealed passage between the wick and a wall of the housing, wherein the void is configured to convey a vapor form of the fluid toward a condenser section of the thermal management module.

    Integrated fan and heat sink for head-mountable device

    公开(公告)号:US11716829B1

    公开(公告)日:2023-08-01

    申请号:US17165763

    申请日:2021-02-02

    Applicant: Apple Inc.

    CPC classification number: H05K7/20136 H05K7/2039

    Abstract: A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.

    SYSTEMS AND METHODS FOR NONVOLATILE MEMORY PERFORMANCE THROTTLING
    5.
    发明申请
    SYSTEMS AND METHODS FOR NONVOLATILE MEMORY PERFORMANCE THROTTLING 有权
    非易失性存储器性能曲线的系统和方法

    公开(公告)号:US20140101371A1

    公开(公告)日:2014-04-10

    申请号:US13648375

    申请日:2012-10-10

    Applicant: APPLE INC.

    Abstract: Systems and methods for nonvolatile memory (“NVM”) performance throttling are disclosed. Performance of an NVM system may be throttled to achieve particular data retention requirements. In particular, because higher storage temperatures tend to reduce the amount of time that data may be reliably stored in an NVM system, performance of the NVM system may be throttled to reduce system temperatures and increase data retention time.

    Abstract translation: 公开了用于非易失性存储器(“NVM”)性能调节的系统和方法。 NVM系统的性能可能受到限制,以实现特定的数据保留要求。 特别地,因为更高的存储温度倾向于减少数据可以可靠地存储在NVM系统中的时间量,所以可以限制NVM系统的性能以降低系统温度并增加数据保留时间。

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