中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

33 records (took 0.017 seconds)

    Thermal module for a circuit board
    1.
    发明授权
    Thermal module for a circuit board 有权

    公开(公告)号：US11963288B2

    公开(公告)日：2024-04-16

    申请号：US17843884

    申请日：2022-06-17

    Applicant: Apple Inc.

    Inventor： Trevor J. Edmonds ,  Jay S. Nigen ,  Richard D. Kosoglow ,  Ron A. Hopkinson

    IPC: H05K1/02 ,  G06F1/20 ,  H05K7/20

    CPC classification number: H05K1/0203 ,  G06F1/203 ,  H05K7/2039 ,  H05K2201/10128

    Abstract: An assembly for heat-generating components includes a metal and a non-metal layer. To secure to a circuit board that carries a heat-generating component, a metal standoff is secured on a perimeter of the circuit board. Multiple protruding elements of the metal layer of the assembly secure within a respective opening of the standoff. The assembly secures, through metal-to-metal contact, to the standoff by multiple mechanical couplings. The assembly not only covers the circuit board, but also extends laterally beyond the circuit board (and the circuit board components). As a result, the assembly receives thermal energy from a heat-generating component(s) on the circuit board and allows the thermal energy to flow through assembly from one portion of the assembly covering the heat-generating component(s) to the lateral portion of the assembly that does not cover the heat-generating component(s).

    Internal architecture of a computing device
    4.
    发明授权
    Internal architecture of a computing device 有权

    公开(公告)号：US11950354B2

    公开(公告)日：2024-04-02

    申请号：US17653634

    申请日：2022-03-04

    Applicant: Apple Inc.

    Inventor： Kristopher P. Laurent ,  Brett W. Degner ,  Jay S. Nigen ,  Eric R. Prather ,  David H. Narajowski

    IPC: H05K1/02 ,  G06F1/20

    CPC classification number: H05K1/0209 ,  G06F1/203 ,  G06F2200/201 ,  H05K2201/064 ,  H05K2201/066

    Abstract: This application relates to a layout of components within an electronic device. The electronic device includes a circuit board and one or more thermal components located on or proximate to each surface of the circuit board. As a result, thermal energy generated by components of the circuit board are drawn away from the circuit board in a more efficient manner. Additionally, the electronic device may include one or more air movers designed to draw ambient air into the electronic device in a manner that causes the ambient air to cool components upstream from the air movers. Further, the electronic device includes a fin stack that is thermally coupled to the aforementioned thermal components, and further receives air driven in by the air mover(s). Also, the electronic device is designed to receive the ambient air through openings that define a 360-degree air inlet.

Patent Agency Ranking