INTERCONNECTIONS BETWEEN FLEXIBLE AND RIGID COMPONENTS
    3.
    发明申请
    INTERCONNECTIONS BETWEEN FLEXIBLE AND RIGID COMPONENTS 审中-公开
    柔性和刚性组件之间的互连

    公开(公告)号:US20130344712A1

    公开(公告)日:2013-12-26

    申请号:US13632135

    申请日:2012-09-30

    Applicant: APPLE INC.

    Abstract: A low-height connectorless interconnection system includes a first substrate, the first substrate having a first plurality of exposed portions of underlying circuit traces and a second substrate, the second substrate having a second plurality of exposed portions of underlying circuit traces. The system further includes a plurality of conductive formations formed on at least one of the first and second pluralities of exposed portions of underlying circuit traces and a clamping member arranged to join the first and second substrate such that the first and second pluralities of exposed portions of circuit traces are in severable electrical communication.

    Abstract translation: 低高度无连接器互连系统包括第一基板,第一基板具有下面的电路迹线的第一多个暴露部分和第二基板,第二基板具有第二多个底层电路迹线的暴露部分。 该系统还包括形成在下面的电路迹线的第一和第二多个暴露部分中的至少一个上的多个导电结构,以及被布置成接合第一和第二基板的夹持构件,使得第一和第二多个暴露部分 电路迹线处于可分离的电气通信中。

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