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    PREDICTIVE CONTROL SYSTEMS AND METHODS
    1.
    发明申请
    PREDICTIVE CONTROL SYSTEMS AND METHODS 审中-公开
    预测控制系统和方法

    公开(公告)号：US20160357232A1

    公开(公告)日：2016-12-08

    申请号：US14871526

    申请日：2015-09-30

    Applicant: Apple Inc.

    Inventor： Nagarajan Kalyanasundaram ,  Jay S. Nigen ,  James S. Ismail ,  Richard H. Tan

    IPC: G06F1/20 ,  G06F1/32

    Abstract: Systems and methods are disclosed for determining a current machine state of a processing device, predicting a future processing task to be performed by the processing device at a future time, and predicting a list of intervening processing tasks to be performed by a first time (e.g. a current time) and the start of the future processing task. The future processing task has an associated initial state. A feed-forward thermal prediction model determines a predicted future machine state at the time for starting the future processing task. Heat mitigation processes can be applied in advance of the starting of the future processing task, to meet the future initial machine state for starting the future processing task.

    Abstract translation: 公开了用于确定处理装置的当前机器状态的系统和方法，预测未来处理装置将来执行的未来处理任务，并预测第一次执行的中间处理任务列表（例如， 当前时间）和未来处理任务的开始。 未来的处理任务具有相关的初始状态。 前馈热预测模型确定在开始未来处理任务时的预测未来机器状态。 可以在未来的处理任务开始之前应用减热过程，以满足未来开始未来处理任务的初始机状态。

    GASKETS FOR THERMAL DUCTING AROUND HEAT PIPES
    2.
    发明申请
    GASKETS FOR THERMAL DUCTING AROUND HEAT PIPES 有权
    用于热管道上的热引导的垫圈

    公开(公告)号：US20130329357A1

    公开(公告)日：2013-12-12

    申请号：US13719022

    申请日：2012-12-18

    Applicant: APPLE INC.

    Inventor： Brett W. Degner ,  William F. Leggett ,  Jay S. Nigen ,  Frank F. Liang ,  Richard H. Tan

    IPC: H05K5/02 ,  G06F1/20 ,  H05K7/20 ,  F28D15/02 ,  B23P15/26

    CPC classification number: G06F1/203 ,  B23P15/26 ,  F28D1/024 ,  F28D15/02 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/04 ,  H05K5/02 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336 ,  Y10T29/49826

    Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

    Abstract translation: 所公开的实施例提供了用于便携式电子设备的部件。 该部件包括垫圈，其包含围绕热管的底部设置的刚性部分，其中刚性部分在电子设备的风扇和排气口之间形成管道。 垫圈还包括结合到刚性部分的第一柔性部分，其中第一柔性部分包括在热管在电子装置中组装期间打开并且封闭在热管和刚性部分上以将管道密封 热管组装后。

    Solid-state drive with passive heat transfer
    3.
    发明授权
    Solid-state drive with passive heat transfer 有权
    具有被动热传递的固态驱动器

    公开(公告)号：US09408328B2

    公开(公告)日：2016-08-02

    申请号：US13683955

    申请日：2012-11-21

    Applicant: Apple Inc.

    Inventor： Jay S. Nigen ,  Ron A. Hopkinson ,  Derek J. Yap ,  Eric A. Knopf ,  William F. Leggett ,  Richard H. Tan

    IPC: H05K7/20 ,  F28F21/00 ,  G06F1/20 ,  H05K1/02 ,  H01L23/373 ,  H05K1/14 ,  H05K3/00

    CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

    Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

    Abstract translation: 所公开的实施例涉及一种促进系统中的热传导的系统，该系统包括具有诸如固态驱动器的集成电路的电路板的模块。 使用电路板一侧和相邻基板之间的热耦合材料来增加电路板和基板之间的热传导。 此外，模块可以包括在基板和壳体之间的另外的热耦合材料，其至少部分地围绕电路板，从而增加基板和壳体之间的热传导。 以这些方式，底板和/或壳体可以用作传热表面或散热器，其减少与集成电路的操作相关联的热点。

    Predictive control systems and methods
    5.
    发明授权
    Predictive control systems and methods 审中-公开

    公开(公告)号：US10671131B2

    公开(公告)日：2020-06-02

    申请号：US14871526

    申请日：2015-09-30

    Applicant: Apple Inc.

    Inventor： Nagarajan Kalyanasundaram ,  Jay S. Nigen ,  James S. Ismail ,  Richard H. Tan

    IPC: G06F1/20 ,  G06F1/329 ,  G06F1/3296

    Abstract: Systems and methods are disclosed for determining a current machine state of a processing device, predicting a future processing task to be performed by the processing device at a future time, and predicting a list of intervening processing tasks to be performed by a first time (e.g. a current time) and the start of the future processing task. The future processing task has an associated initial state. A feed-forward thermal prediction model determines a predicted future machine state at the time for starting the future processing task. Heat mitigation processes can be applied in advance of the starting of the future processing task, to meet the future initial machine state for starting the future processing task.

    Gaskets for thermal ducting around heat pipes
    7.
    发明授权
    Gaskets for thermal ducting around heat pipes 有权
    用于热管周围热管的垫圈

    公开(公告)号：US09423841B2

    公开(公告)日：2016-08-23

    申请号：US15012661

    申请日：2016-02-01

    Applicant: Apple Inc.

    Inventor： Brett W. Degner ,  William F. Leggett ,  Jay S. Nigen ,  Frank F. Liang ,  Richard H. Tan

    IPC: G06F1/16 ,  H05K7/00 ,  G06F1/20 ,  F28D15/04

    CPC classification number: G06F1/203 ,  B23P15/26 ,  F28D1/024 ,  F28D15/02 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/04 ,  H05K5/02 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336 ,  Y10T29/49826

    Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

    Abstract translation: 所公开的实施例提供了用于便携式电子设备的部件。 该部件包括垫圈，其包含围绕热管的底部设置的刚性部分，其中刚性部分在电子设备的风扇和排气口之间形成管道。 垫圈还包括结合到刚性部分的第一柔性部分，其中第一柔性部分包括在热管在电子装置中组装期间打开并且封闭在热管和刚性部分上以将管道密封 热管组装后。

    SOLID-STATE DRIVE WITH PASSIVE HEAT TRANSFER
    8.
    发明申请
    SOLID-STATE DRIVE WITH PASSIVE HEAT TRANSFER 有权
    固态传动与无源传热

    公开(公告)号：US20130329352A1

    公开(公告)日：2013-12-12

    申请号：US13683955

    申请日：2012-11-21

    Applicant: APPLE INC.

    Inventor： Jay S. Nigen ,  Ron A. Hopkinson ,  Derek J. Yap ,  Eric A. Knopf ,  William F. Leggett ,  Richard H. Tan

    IPC: H05K7/20 ,  F28F21/00 ,  G06F1/20

    CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

    Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

    Abstract translation: 所公开的实施例涉及一种促进系统中的热传导的系统，该系统包括具有诸如固态驱动器的集成电路的电路板的模块。 使用电路板一侧和相邻基板之间的热耦合材料来增加电路板和基板之间的热传导。 此外，模块可以包括在基板和壳体之间的另外的热耦合材料，其至少部分地围绕电路板，从而增加基板和壳体之间的热传导。 以这些方式，底板和/或壳体可以用作传热表面或散热器，其减少与集成电路的操作相关联的热点。

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