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    METHODS AND SYSTEMS FOR A SPECTRAL LIBRARY AT A MANUFACTURING SYSTEM
    2.
    发明公开
    METHODS AND SYSTEMS FOR A SPECTRAL LIBRARY AT A MANUFACTURING SYSTEM 审中-公开

    公开(公告)号：US20240128100A1

    公开(公告)日：2024-04-18

    申请号：US18485009

    申请日：2023-10-11

    Applicant: Applied Materials, Inc.

    Inventor： Hsinyi Tsai ,  Thomas Li ,  Zhaozhao Zhu ,  Michael Kutney ,  Upendra V. Ummethala

    IPC: H01L21/67 ,  H01L21/66

    CPC classification number: H01L21/67253 ,  H01L21/67294 ,  H01L22/26

    Abstract: Spectral data associated with one or more regions of a surface of a substrate is identified. The substrate has been processed according to one or more first operations of a process recipe that is unknown to a system controller for the manufacturing system. The spectral data is provided as input to a machine learning model that is trained to predict, based on given spectral data, a respective process recipe associated with the substrate and one or more operations of the respective process recipe that have already been performed. A determination is made, based on one or more outputs of the machine learning model, that the substrate is associated with the process recipe and that one or more second operations are yet to be performed. The substrate is caused to be processed according to the one or more second operations of the process recipe.

    Motor torque endpoint during polishing with spatial resolution
    5.
    发明授权
    Motor torque endpoint during polishing with spatial resolution 有权

    公开(公告)号：US11980995B2

    公开(公告)日：2024-05-14

    申请号：US17674757

    申请日：2022-02-17

    Applicant: Applied Materials, Inc.

    Inventor： Thomas Li

    IPC: B24B49/16 ,  B24B7/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/24 ,  B24B49/04

    CPC classification number: B24B49/16 ,  B24B7/228 ,  B24B37/013 ,  B24B37/042 ,  B24B37/24 ,  B24B49/04

    Abstract: During polishing of a substrate a sequence of measured values is received from an in-situ motor torque monitoring system. Positions on the substrate of the region of lower coefficient of friction are calculated for at least two measured values from the sequence of measured values. A first measured value from the sequence of measured values at which the region of different coefficient of friction is at a first position in a first zone on the substrate is compared to a second measured value from the sequence of measured values at which the region of different coefficient of friction is at a second position in a different second zone on the substrate or is not below the substrate. Based on the comparison, which of the first zone or the second zone the overlying layer is clearing first to expose the underlying layer can be determined.

    DETERMINING SUBSTRATE PROFILE PROPERTIES USING MACHINE LEARNING
    6.
    发明申请
    DETERMINING SUBSTRATE PROFILE PROPERTIES USING MACHINE LEARNING 有权

    公开(公告)号：US20230062206A1

    公开(公告)日：2023-03-02

    申请号：US18046872

    申请日：2022-10-14

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Thomas Li ,  Upendra V. Ummethala ,  Blake Erickson ,  Prashanth Kumar ,  Michael Kutney ,  Steven Trey Tindel ,  Zhaozhao Zhu

    IPC: G03F7/20

    Abstract: Spectral data associated with a first prior substrate and/or a second prior substrate is obtained. A metrology measurement value associated with the first portion of the first prior substrate is determined based on one or more metrology measurement values measured for at least one of a second portion of the first prior substrate or a third portion of a second prior substrate. Training data for training a machine learning model to predict metrology measurement values of a current substrate is generated. Generating the training data includes generating a first training input including the spectral data associated with the first prior substrate and generating a first target output for the first training input, the first target output including the determined metrology measurement value associated with the first portion of the first prior substrate. The training data is provided to train the machine learning model.

    DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE OF IMAGES
    8.
    发明申请
    DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE OF IMAGES 有权

    公开(公告)号：US20240378718A1

    公开(公告)日：2024-11-14

    申请号：US18781609

    申请日：2024-07-23

    Applicant: Applied Materials, Inc.

    Inventor： Sidney P. Huey ,  Thomas Li ,  Benjamin Cherian

    IPC: G06T7/00 ,  B24B37/005 ,  G06T7/20 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/66 ,  H04N5/272 ,  H04N7/18

    Abstract: Monitoring operations of a polishing system includes obtaining a time-based sequence of reference images of a component of the polishing system performing operations during a test operation of the polishing system, receiving from a camera a time-based sequence of monitoring images of an equivalent component of an equivalent polishing system performing operations during polishing of a substrate, determining a difference value for the time-based sequence of monitoring images by comparing the time-based sequence of reference images to the time-based sequence of monitoring image using an image processing algorithm, determining whether the difference value exceeds a threshold, and in response to determining the difference value exceeds the threshold, indicating an excursion.

    CHAMBER MATCHING BY EQUIPMENT CONSTANT UPDATES
    9.
    发明公开
    CHAMBER MATCHING BY EQUIPMENT CONSTANT UPDATES 审中-公开

    公开(公告)号：US20240176336A1

    公开(公告)日：2024-05-30

    申请号：US18070456

    申请日：2022-11-28

    Applicant: Applied Materials, Inc.

    Inventor： Sidharth Bhatia ,  Roger Lindley ,  Upendra Ummethala ,  Thomas Li ,  Michael Howells ,  Steven Babayan ,  Mimi-Diemmy Dao

    IPC: G05B19/418

    CPC classification number: G05B19/41875 ,  G05B2219/32368

    Abstract: A method includes receiving, by a processing device, data indicative of performance of a plurality of process chambers. The method further includes providing the data indicative of performance of the plurality of process chambers to a model. The method further includes receiving as output from the model a first recommended equipment constant update associated with a first process chamber of the plurality of process chambers and a second recommended equipment constant update associated with a second process chamber of the plurality of process chambers. The method further includes updating a first equipment constant of the first process chamber and a second equipment constant of the second process chamber in view of the first recommended equipment constant update and the second recommended equipment constant update.

    DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE OF IMAGES AND MACHINE LEARNING
    10.
    发明申请
    DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE OF IMAGES AND MACHINE LEARNING 有权

    公开(公告)号：US20220284561A1

    公开(公告)日：2022-09-08

    申请号：US17678939

    申请日：2022-02-23

    Applicant: Applied Materials, Inc.

    Inventor： Sidney P. Huey ,  Thomas Li ,  Benjamin Cherian

    IPC: G06T7/00 ,  G06T7/20 ,  H04N5/272 ,  H04N7/18

    Abstract: Monitoring operations of a polishing system includes obtaining a time-based sequence of reference images of a component of the polishing system performing operations during a test operation of the polishing system, receiving from a camera a time-based sequence of monitoring images of an equivalent component of an equivalent polishing system performing operations during polishing of a substrate, determining a difference value for the time-based sequence of monitoring images by comparing the time-based sequence of reference images to the time-based sequence of monitoring image using an image processing algorithm, determining whether the difference value exceeds a threshold, and in response to determining the difference value exceeds the threshold, indicating an excursion.

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