公开(公告)号：US20220236649A1

公开(公告)日：2022-07-28

申请号：US17613972

申请日：2020-05-11

Applicant: ASML HOLDING N.V.

Inventor： Matthew LIPSON ,  Eric Justin MONKMAN ,  Victor Antonio PEREZ-FALCON

IPC: G03F7/20 ,  H01L21/683

Abstract: An electrostatic clamp and a method for fabricating the same. The electrostatic clamp includes a first stack and a second stack, wherein the first stack is joined with the second stack. Each of the first and second stacks includes a clamp body, one or more electrodes disposed on the clamp body, a dielectric plate disposed on the electrodes, and a plurality of channels inside the clamp body.

公开(公告)号：US20230031443A1

公开(公告)日：2023-02-02

申请号：US17788806

申请日：2020-12-08

Applicant: ASML Holding N.V.

Inventor： Matthew LIPSON ,  Mehmet Ali AKBAS ,  Tammo UITTERDIJK ,  Fei ZHAO

IPC: G03F7/20

Abstract: Systems, apparatuses, and methods are provided for manufacturing a wafer clamp having hard burls. The method can include providing a first layer that includes a first surface. The method can further include forming a plurality of burls over the first surface of the first layer. The forming of the plurality of burls can include forming a subset of the plurality of burls to a hardness of greater than about 6.0 gigapascals (GPa).

公开(公告)号：US20210405539A1

公开(公告)日：2021-12-30

申请号：US17291086

申请日：2019-10-22

Applicant: ASML Holding N.V.

Inventor： Mehmet Ali AKBAS ,  Tammo UITTERDIJK ,  Christopher John MASON ,  Matthew LIPSON ,  David Hart PETERSON ,  Michael PERRY ,  Peter HELMUS ,  Jerry Jianguo DENG ,  Damoon SOHRABIBABAHEIDARY

IPC: G03F7/20 ,  H01L21/687

Abstract: A method for reducing sticking of an object to a surface used in a lithography process includes receiving, at a control computer, instructions for a tool configured to modify the surface and forming, in a deterministic manner based on the instructions received at the control computer, a modified surface having a furrow and a ridge, wherein the ridge reduces the sticking by reducing a contact surface area of the modified surface. Another apparatus includes a modified surface that includes furrows and ridges forming a reduced contact surface area to reduce a sticking of an object to the modified surface, the ridges having an elastic property that causes the reduced contact surface area to increase when the plurality of ridges is elastically deformed.

公开(公告)号：US20230021360A1

公开(公告)日：2023-01-26

申请号：US17790341

申请日：2020-12-04

Applicant: ASML Holding N.V.

Inventor： Matthew LIPSON ,  Mehmet Ali AKBAS

IPC: G03F7/20 ,  C03C27/00 ,  H01L21/683

Abstract: Systems, apparatuses, and methods are provided for manufacturing an electrostatic clamp. An example method can include forming, during a first duration of time comprising a first time, a top clamp comprising a first set of electrodes and a plurality of burls. The method can further include forming, during a second duration of time comprising a second time that overlaps the first time, a core comprising a plurality of fluid channels configured to carry a thermally conditioned fluid. The method can further include forming, during a third duration of time comprising a third time that overlaps the first time and the second time, a bottom clamp comprising a second set of electrodes. In some aspects, the example method can include manufacturing the electrostatic clamp without an anodic bond.

公开(公告)号：US20200073262A1

公开(公告)日：2020-03-05

申请号：US16610103

申请日：2018-05-01

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： Matthew LIPSON ,  Christopher John MASON ,  Damoon SOHRABIBABAHEIDARY ,  Jimmy Matheus Wilhelmus VAN DE WINKEL ,  Bert Dirk SCHOLTEN

IPC: G03F7/20 ,  B08B1/00

Abstract: A method of dislodging contamination from a part of an apparatus used in a patterning process, the method including: providing a cleaning substrate into contact with the part of the apparatus while the part is attached to the apparatus, the cleaning substrate comprising a material configured to chemically react with the contamination; and dislodging contamination on the part of the apparatus by chemical reaction between the material and the contamination.

公开(公告)号：US20170242345A1

公开(公告)日：2017-08-24

申请号：US15504749

申请日：2015-07-09

Applicant: ASML Holding N.V.

Inventor： Matthew LIPSON ,  Vincent DIMILIA ,  Ronald Peter TOTILLO ,  Tammo UITTERDIJK ,  Steven Michael ZIMMERMAN

IPC: G03F7/20 ,  H01L21/67 ,  H01L21/683

CPC classification number: G03F7/70708 ,  C03B23/20 ,  C03B25/02 ,  G03F7/70783 ,  G03F7/70875 ,  G03F7/7095 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833

Abstract: An electrostatic clamp (300) and a method for manufacturing the same is disclosed. The electrostatic clamp includes a first layer (302) having a first ultra-low expansion (ULE) material, a second layer (304) coupled to the first layer, having a second ULE material, and a third layer (306), coupled to the second layer, having a third ULE material. The electrostatic clamp further includes a plurality of fluid channels (316) located between the first layer and the second layer and a composite layer (308) interposed between the second layer and the third layer. The method for manufacturing the electrostatic clamp includes forming the plurality of fluid channels, disposing the composite layer on the third layer, and coupling the third layer to the second layer. The plurality of fluid channels is configured to carry a thermally conditioned fluid for temperature regulation of a clamped object.

公开(公告)号：US20240369947A1

公开(公告)日：2024-11-07

申请号：US18773176

申请日：2024-07-15

Applicant: ASML Holding N.V.

Inventor： Mehmet Ali AKBAS ,  Tammo UITTERDIJK ,  Christopher John MASON ,  Matthew LIPSON ,  David Hart PETERSON ,  Michael PERRY ,  Peter HELMUS ,  Jerry Jianguo DENG ,  Damoon SOHRABIBABAHEIDARY

IPC: G03F7/00 ,  H01L21/687

Abstract: A method for reducing sticking of an object to a surface used in a lithography process includes receiving, at a control computer, instructions for a tool configured to modify the surface and forming, in a deterministic manner based on the instructions received at the control computer, a modified surface having a furrow and a ridge, wherein the ridge reduces the sticking by reducing a contact surface area of the modified surface. Another apparatus includes a modified surface that includes furrows and ridges forming a reduced contact surface area to reduce a sticking of an object to the modified surface, the ridges having an elastic property that causes the reduced contact surface area to increase when the plurality of ridges is elastically deformed.

公开(公告)号：US20240248415A1

公开(公告)日：2024-07-25

申请号：US18562770

申请日：2022-04-28

Applicant: ASML Holding N.V. ,  ASML Netherlands B.V.

Inventor： Shahab SHERVIN ,  Tammo UITTERDIJK ,  Matthew LIPSON ,  Marcus Martinus Petrus Adrianus VERMEULEN

IPC: G03F7/00 ,  H01L21/687

CPC classification number: G03F7/707 ,  G03F7/7095 ,  G03F7/70975 ,  H01L21/6875

Abstract: The present disclosure is directed to a modular wafer table and methods for refurbishing a scrapped wafer to manufacture the modular wafer table. The method comprises removing one or more burls from a surface of a wafer table; polishing the surface of the wafer table after removing the one or more burls to form a core module; forming a burl module having a plurality of burls thereon; and bonding the core module to the burl module.

公开(公告)号：US20220082953A1

公开(公告)日：2022-03-17

申请号：US17612679

申请日：2020-05-05

Applicant: ASML HOLDING N.V ,  ASML NETHERLANDS B.V.

Inventor： Matthew LIPSON ,  Satish ACHANTA ,  Benjamin David DAWSON ,  Matthew Anthony SORNA ,  IIiya SIGAL ,  Tammo UITTERDIJK

IPC: G03F7/20

Abstract: A substrate table for supporting a substrate includes a surface and coarse burls. Each of the coarse burls includes a burl-top surface and fine burls. The coarse burls are disposed on the surface of the substrate table. The fine burls are disposed on the burl-top surface. The fine burls contact the substrate when the substrate table supports the substrate.

公开(公告)号：US20210173312A1

公开(公告)日：2021-06-10

申请号：US16768766

申请日：2018-11-29

Applicant: ASML HOLDING N.V.

Inventor： Matthew LIPSON ,  David Allen HEALD ,  Iliya SIGAL

IPC: G03F7/20 ,  H01L21/687

Abstract: Methods and systems are described for reducing adhesion and controlling friction between a wafer and a wafer table during semiconductor photolithography wherein the tops of burls on the wafer table have a layer with a nanoscale topography.