公开(公告)号：US11811131B2

公开(公告)日：2023-11-07

申请号：US17133358

申请日：2020-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu Ho ,  Meng-Wei Hsieh

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01Q1/48 ,  H01L23/66

CPC classification number: H01Q1/2283 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/20 ,  H01Q1/48 ,  H01L2223/6677 ,  H01L2224/214

Abstract: The present disclosure provides an antenna module. The antenna module includes an antenna layer, a ground layer, and an electronic component. The ground layer is disposed over the antenna layer. The electronic component is disposed between the antenna layer and the ground layer.

公开(公告)号：US10186779B2

公开(公告)日：2019-01-22

申请号：US15348854

申请日：2016-11-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu Ho ,  Chen-Chao Wang ,  Chun-Yen Ting ,  Ming-Fong Jhong ,  Po-Chih Pan

IPC: H01L23/34 ,  H01Q9/04 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L25/065 ,  H01Q13/10 ,  H01Q19/30 ,  H01Q21/28 ,  H01L23/00

Abstract: Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. The electrical component is disposed over the top surface of the carrier. The antenna is disposed over the top surface of the carrier and spaced away from the electrical component. The conductive pad is disposed over the top surface of the carrier and beneath the antenna, wherein the conductive pad includes a resonant structure. The conductive line is electrically connected to the electrical component and extends within the carrier. A part of the conductive line is beneath the antenna and the resonant structure of the conductive pad.

公开(公告)号：US11777191B2

公开(公告)日：2023-10-03

申请号：US17133369

申请日：2020-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu Ho ,  Sheng-Chi Hsieh ,  Chih-Pin Hung

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/52 ,  H01Q25/00

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01Q1/523 ,  H01Q25/005 ,  H01L2223/6677

Abstract: The present disclosure relates to a wireless communication module. The wireless communication module includes a first antenna layer and a second antenna layer non-coplanar with the second antenna layer. An electromagnetic wave of the first antenna and the second antenna are configured to have far-field interference to each other.

公开(公告)号：US12132248B2

公开(公告)日：2024-10-29

申请号：US17894946

申请日：2022-08-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu Ho ,  Meng-Wei Hsieh ,  Chih-Pin Hung

IPC: H01Q1/22 ,  H01Q1/52 ,  H01Q21/06 ,  H01Q25/00

CPC classification number: H01Q1/2283 ,  H01Q1/523 ,  H01Q21/065 ,  H01Q25/00

Abstract: An electronic device is provided. The electronic device includes an antenna array including a plurality of antenna patterns collectively configured to provide a scan-angle coverage. Each of the antenna patterns includes a curved surface.

公开(公告)号：US11538772B2

公开(公告)日：2022-12-27

申请号：US16953261

申请日：2020-11-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu Ho ,  Meng-Wei Hsieh

IPC: H01L23/66 ,  H01L23/538 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01Q5/307 ,  H01Q1/48 ,  H01L23/31 ,  H01Q1/22 ,  H01Q21/06

Abstract: The present disclosure provides an antenna module. The antenna module includes a first layer, a second layer, a first antenna, and a second antenna. The first layer has a first dielectric constant. The second layer is adjacent to the first layer. The second layer has a second Dk lower than the first Dk. The first antenna is disposed on the first layer and is configured for operating at a first frequency. The second antenna is disposed on the second layer and is configured for operating at a second frequency higher than the first frequency.

公开(公告)号：US20220200130A1

公开(公告)日：2022-06-23

申请号：US17133369

申请日：2020-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu Ho ,  Sheng-Chi Hsieh ,  Chih-Pin Hung

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q25/00 ,  H01Q1/52

Abstract: The present disclosure relates to a wireless communication module. The wireless communication module includes a first antenna layer and a second antenna layer non-coplanar with the second antenna layer. An electromagnetic wave of the first antenna and the second antenna are configured to have far-field interference to each other.