公开(公告)号：US20250038084A1

公开(公告)日：2025-01-30

申请号：US18227887

申请日：2023-07-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying KUO ,  Chun-Yen TING ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chang Chi LEE

IPC: H01L23/498 ,  H01L23/00

Abstract: An electronic device is disclosed. The electronic device includes an electronic component, an input/output (I/O) signal delivery circuit, and a power delivery circuit. The electronic component has a first surface and a second surface opposite to the first surface. The I/O signal delivery circuit is disposed under the first surface of the electronic component. The power delivery circuit is disposed over the second surface of the electronic component and configured to balance a warpage of the electronic device.

公开(公告)号：US20240264368A1

公开(公告)日：2024-08-08

申请号：US18105702

申请日：2023-02-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN ,  Chang Chi LEE ,  Chun-Yen TING

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B2006/12109 ,  H04B10/25891

Abstract: An optoelectronic device is provided. The optoelectronic device includes a plurality of first waveguides and a plurality of second waveguides. The plurality of first waveguides are configured to receive a first plurality of optical signals. The plurality of second waveguides are configured to transmit a second plurality of optical signals. The plurality of first waveguides extend substantially along a first direction and the plurality of second waveguides extend substantially along a second direction different from and non-parallel with the first direction.

公开(公告)号：US20240345341A1

公开(公告)日：2024-10-17

申请号：US18135076

申请日：2023-04-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Shih-Yuan SUN ,  Chiu-Wen LEE ,  Chang Chi LEE ,  Chun-Yen TING ,  Hung-Chun KUO

IPC: G02B6/42 ,  G02B6/43

CPC classification number: G02B6/4267 ,  G02B6/4257 ,  G02B6/43

Abstract: A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.

公开(公告)号：US20240329344A1

公开(公告)日：2024-10-03

申请号：US18129769

申请日：2023-03-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN ,  Chang Chi LEE ,  Hung-Chun KUO ,  Chun-Yen TING

IPC: G02B6/43 ,  G02B6/42 ,  H01L25/16

CPC classification number: G02B6/43 ,  G02B6/4206 ,  G02B6/4239 ,  H01L25/167

Abstract: Semiconductor packages and methods for manufacturing the semiconductor packages are provided. The semiconductor package includes a first electronic element disposed over a first substrate; a second electronic element disposed over a second substrate spaced apart from the first substrate; and a first interconnection element connected to the first electronic element and the second electronic element. The first electronic element extends beyond an edge of the first substrate. The second electronic element extends beyond an edge of the second substrate and towards the first electronic element. The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element.

公开(公告)号：US20230420418A1

公开(公告)日：2023-12-28

申请号：US17846642

申请日：2022-06-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Yen TING ,  Pao-Nan LEE ,  Jung Jui KANG ,  Chang Chi LEE

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L2225/06544 ,  H01L2225/06558 ,  H01L2225/06589

Abstract: An electronic device is provided. The electronic device includes a first die and a second die. The second die is disposed over the first die. A backside surface of the second die faces a backside surface of the first die. An active surface of the second die is configured to receive a first power. The second die is configured to provide the first die with a second power through the backside surface of the second die and the backside surface of the first die.

公开(公告)号：US20250096073A1

公开(公告)日：2025-03-20

申请号：US18369109

申请日：2023-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying KUO ,  Jung Jui KANG ,  Hung-Chun KUO ,  Chun-Yen TING

IPC: H01L23/48 ,  H01L23/552 ,  H05K1/02

Abstract: An electronic device is disclosed. The electronic component has a front side and a backside opposite to the front side. The front side is configured to receive a first power. The backside is configured to receive a second power greater than the first power.

公开(公告)号：US20240332192A1

公开(公告)日：2024-10-03

申请号：US18128988

申请日：2023-03-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I WU ,  Chun-Yen TING ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN

IPC: H01L23/538 ,  G02B6/12 ,  H01L23/00 ,  H01L23/36 ,  H01L25/16

CPC classification number: H01L23/5381 ,  G02B6/12004 ,  H01L23/36 ,  H01L24/16 ,  H01L25/167 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.

公开(公告)号：US20180131094A1

公开(公告)日：2018-05-10

申请号：US15348854

申请日：2016-11-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu HO ,  Chen-Chao WANG ,  Chun-Yen TING ,  Ming-Fong JHONG ,  Po-Chih PAN

IPC: H01Q9/04 ,  H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/552

CPC classification number: H01Q9/045 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1421 ,  H01L2924/3025 ,  H01Q9/0457 ,  H01Q13/10 ,  H01Q19/30 ,  H01Q21/28

Abstract: Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. The electrical component is disposed over the top surface of the carrier. The antenna is disposed over the top surface of the carrier and spaced away from the electrical component. The conductive pad is disposed over the top surface of the carrier and beneath the antenna, wherein the conductive pad includes a resonant structure. The conductive line is electrically connected to the electrical component and extends within the carrier. A part of the conductive line is beneath the antenna and the resonant structure of the conductive pad.

公开(公告)号：US20250029970A1

公开(公告)日：2025-01-23

申请号：US18223526

申请日：2023-07-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Chang Chi LEE ,  Hung-Chun KUO ,  Chun-Yen TING

IPC: H01L25/18 ,  H10B80/00

Abstract: The present disclosure provides an electronic device, which includes a circuit structure, a processing component, a first storage unit, and a second storage unit. The processing component is disposed over the circuit structure. The first storage unit is supported by the circuit structure, and electrically connected to the processing component. The second storage unit is disposed under the circuit structure and electrically connected to the processing component via the circuit structure.

公开(公告)号：US20240345315A1

公开(公告)日：2024-10-17

申请号：US18135075

申请日：2023-04-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Yen TING ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN

IPC: G02B6/122 ,  G02B6/12

CPC classification number: G02B6/1225 ,  G02B6/12002 ,  G02B2006/12147

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.