公开(公告)号：US09960102B2

公开(公告)日：2018-05-01

申请号：US15181072

申请日：2016-06-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chung-Hsi Wu ,  Min Lung Huang

IPC: H01L23/48 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L23/481 ,  H01L21/78 ,  H01L24/09 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/02371

Abstract: A semiconductor package includes a first semiconductor component, a second semiconductor component, and a connecting element. The first semiconductor component includes a first substrate, and a first bonding pad disposed adjacent to a first surface of the first substrate, and at least one conductive via structure extending from a second surface of the first substrate to the first bonding pad. The second semiconductor component includes a second substrate, a redistribution layer disposed adjacent to a first surface of the second substrate, and a second bonding pad disposed on the redistribution layer. The connecting element is disposed between the first bonding pad and the second bonding pad.

公开(公告)号：US09947635B1

公开(公告)日：2018-04-17

申请号：US15294594

申请日：2016-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long Lu ,  Yuan-Feng Chiang ,  Chi-Chang Lee ,  Chung-Hsi Wu

IPC: H01L23/02 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L24/17 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/33 ,  H01L2224/1705 ,  H01L2224/175 ,  H01L2224/33104 ,  H01L2224/335

Abstract: A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first main body, at least one first columnar portion and at least one first conductive layer. The first columnar portion protrudes from a bottom surface of the first main body. The first conductive layer is disposed on a side surface of the first columnar portion. The second semiconductor device includes a second main body, at least one second columnar portion and at least one second conductive layer. The second columnar portion protrudes from a top surface of the second main body. The second conductive layer is disposed on a side surface of the second columnar portion. The first conductive layer is electrically coupled to the second conductive layer.

公开(公告)号：US11424212B2

公开(公告)日：2022-08-23

申请号：US16514966

申请日：2019-07-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Wei Chang ,  Shang-Wei Yeh ,  Chung-Hsi Wu ,  Min Lung Huang

IPC: H01L23/00 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L25/11

Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.

公开(公告)号：US12040312B2

公开(公告)日：2024-07-16

申请号：US17893037

申请日：2022-08-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Wei Chang ,  Shang-Wei Yeh ,  Chung-Hsi Wu ,  Min Lung Huang

IPC: H01L25/065 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L25/04 ,  H01L25/07 ,  H01L25/075 ,  H01L25/11 ,  H01L25/16

CPC classification number: H01L25/0652 ,  H01L21/566 ,  H01L21/76871 ,  H01L23/3107 ,  H01L23/3192 ,  H01L24/09 ,  H01L24/49 ,  H01L24/85 ,  H01L25/071 ,  H01L25/112 ,  H01L25/042 ,  H01L25/043 ,  H01L25/0756 ,  H01L25/162 ,  H01L2224/02371

Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.

公开(公告)号：US20180108634A1

公开(公告)日：2018-04-19

申请号：US15294594

申请日：2016-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU ,  Yuan-Feng Chiang ,  Chi-Chang Lee ,  Chung-Hsi Wu

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/17 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/33 ,  H01L2224/1705 ,  H01L2224/175 ,  H01L2224/33104 ,  H01L2224/335

Abstract: A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first main body, at least one first columnar portion and at least one first conductive layer. The first columnar portion protrudes from a bottom surface of the first main body. The first conductive layer is disposed on a side surface of the first columnar portion. The second semiconductor device includes a second main body, at least one second columnar portion and at least one second conductive layer. The second columnar portion protrudes from a top surface of the second main body. The second conductive layer is disposed on a side surface of the second columnar portion. The first conductive layer is electrically coupled to the second conductive layer.