公开(公告)号：US20180226348A1

公开(公告)日：2018-08-09

申请号：US15428069

申请日：2017-02-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Tun-Ching PI

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L23/5387 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/5386 ,  H01L25/0655 ,  H01L25/50

Abstract: A semiconductor device package includes a flexible substrate, an electronic component, at least one flexible member, and a package body. The electronic component is disposed on the flexible substrate. The at least one flexible member is disposed on the flexible substrate. The package body encapsulates the electronic component and has a first part and a second part separated from the first part by the at least one flexible member.

公开(公告)号：US20220238457A1

公开(公告)日：2022-07-28

申请号：US17719281

申请日：2022-04-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Tzu-Cheng LIN ,  Chun-Jen CHEN

IPC: H01L23/552 ,  H01L23/48 ,  H01L23/538

Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.

公开(公告)号：US20200083172A1

公开(公告)日：2020-03-12

申请号：US16560862

申请日：2019-09-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Tun-Ching PI ,  Sung-Hung CHIANG ,  Yu-Chang CHEN

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/13 ,  H01L25/16 ,  H01L23/552

Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.

公开(公告)号：US20210257311A1

公开(公告)日：2021-08-19

申请号：US16791946

申请日：2020-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Tzu-Cheng LIN ,  Chun-Jen CHEN

IPC: H01L23/552 ,  H01L23/538 ,  H01L23/48

Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.

公开(公告)号：US20210043527A1

公开(公告)日：2021-02-11

申请号：US16537371

申请日：2019-08-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Tun-Ching PI ,  Sung-Hung CHIANG ,  Yu-Chang CHEN

IPC: H01L23/13 ,  H01L23/14 ,  H01L23/498

Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.

公开(公告)号：US20220367308A1

公开(公告)日：2022-11-17

申请号：US17876468

申请日：2022-07-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tun-Ching PI ,  Yen-Chi HUANG ,  Hao-Chih HSIEH ,  Jin Han SHIH

IPC: H01L23/31 ,  H01L21/56 ,  H05K1/18

Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.

公开(公告)号：US20200083132A1

公开(公告)日：2020-03-12

申请号：US16409665

申请日：2019-05-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yen-Chi HUANG ,  Hao-Chih HSIEH ,  Jin Han SHIH ,  Yung I. YEH ,  Tun-Ching PI

IPC: H01L23/31 ,  H01L21/56 ,  H05K1/18

Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.

公开(公告)号：US20250105161A1

公开(公告)日：2025-03-27

申请号：US18976228

申请日：2024-12-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Tun-Ching PI ,  Sung-Hung CHIANG ,  Yu-Chang CHEN

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/31 ,  H01L23/552 ,  H01L25/16

Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.

公开(公告)号：US20250079308A1

公开(公告)日：2025-03-06

申请号：US18239726

申请日：2023-08-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Chun-Kai CHANG ,  Chao Wei LIU

IPC: H01L23/528 ,  H01L23/498 ,  H01L25/16

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a first interposer. The first electronic component is disposed under the interposer and includes a logic circuit and a power delivery circuit disposed between the interposer and the logic circuit. The interposer and the power delivery circuit are collectively configured to function as a power delivery structure which is electrically connected to the logic circuit.

公开(公告)号：US20220415810A1

公开(公告)日：2022-12-29

申请号：US17903921

申请日：2022-09-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Tun-Ching PI ,  Sung-Hung CHIANG ,  Yu-Chang CHEN

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/31 ,  H01L25/16 ,  H01L23/552

Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.