公开(公告)号：US20250080895A1

公开(公告)日：2025-03-06

申请号：US18241206

申请日：2023-08-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kai Hung WANG ,  Kuei-Hao TSENG ,  Chih Lung LIN

IPC: H04R1/10

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element and a deformable element configured to convert energy from one form to make the flexible element compliant with a user's skin.

公开(公告)号：US20240395784A1

公开(公告)日：2024-11-28

申请号：US18202243

申请日：2023-05-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuei-Hao TSENG ,  Kai Hung WANG ,  Chih Lung LIN

IPC: H01L25/16 ,  A61B5/256 ,  H01L23/00 ,  H01L23/31

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible carrier, an electronic component disposed over the flexible carrier, and a first flexible connection element configured to connect the flexible carrier and the electronic component. The first flexible connection element is configured to extend along a deformation direction of the electronic device. An interconnection structure is also provided.

公开(公告)号：US20230017424A1

公开(公告)日：2023-01-19

申请号：US17374748

申请日：2021-07-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pang Yuan LEE ,  Kuei-Hao TSENG ,  Chih Lung LIN

IPC: H01L23/31 ,  H01L23/528

Abstract: The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.

公开(公告)号：US20170363682A1

公开(公告)日：2017-12-21

申请号：US15183253

申请日：2016-06-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Jung CHANG ,  Wei-Kai LIAO ,  Ming-Ching LIN ,  Kuei-Hao TSENG

IPC: G01R31/28

CPC classification number: G01R31/2896 ,  G01R31/046 ,  G01R31/2853 ,  G01R31/31715

Abstract: A testing system includes a subtractor and a divider. The subtractor is configured to receive a first voltage of a circuit being tested and a second voltage of the circuit, and to derive a difference between the first voltage and the second voltage. The divider is configured to receive the difference between the first voltage and the second voltage, and to derive a resistance of the circuit by dividing (i) the difference between the first voltage and the second voltage by (ii) a difference between a first current applied to the circuit and a second current applied to the circuit. The first voltage is corresponding to the first current, and the second voltage is corresponding to the second current.

公开(公告)号：US20240197176A1

公开(公告)日：2024-06-20

申请号：US18083447

申请日：2022-12-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuei-Hao TSENG ,  Kai Hung WANG ,  Kai-Di LU ,  Yu-Chih LEE ,  Cheng-Tsao PENG ,  Pang Yuan LEE

IPC: A61B5/00 ,  H05K1/02

CPC classification number: A61B5/0002 ,  H05K1/0277

Abstract: The present disclosure provides a sensing device. The sensing device includes a flexible element having a first sensing area, an electronic component embedded within the flexible element, and an adjustable conductive element disposed in the flexible element and configured to electrically connect the first sensing area of the flexible element with the electronic component.

公开(公告)号：US20220345812A1

公开(公告)日：2022-10-27

申请号：US17242093

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Kai Hung WANG

IPC: H04R1/40 ,  H04R3/12 ,  H04R1/24 ,  H04R1/26 ,  G02C11/00

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

公开(公告)号：US20220345811A1

公开(公告)日：2022-10-27

申请号：US17242060

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Kai Hung WANG

IPC: H04R1/40 ,  H04R3/12 ,  H04R1/26 ,  H04R1/24

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. A location of the first transducer is configured to be adjustable with respect to the second transducer.

公开(公告)号：US20250080894A1

公开(公告)日：2025-03-06

申请号：US18240324

申请日：2023-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuei-Hao TSENG ,  Kai Hung WANG ,  Chih Lung LIN

IPC: H04R1/10 ,  H04R1/02

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element having a channel, a first cover at least covering the channel, and a transducing element connected with the flexible element. The transducing element is configured to convert energy from one form to another to deform and affect the flexible element to adjust a dimension of the first cover.

公开(公告)号：US20230199378A1

公开(公告)日：2023-06-22

申请号：US18109792

申请日：2023-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Kai Hung WANG

IPC: H04R1/40 ,  H04R3/12 ,  H04R1/26 ,  G02C11/00 ,  H04R1/24

CPC classification number: H04R1/403 ,  G02C11/10 ,  H04R1/24 ,  H04R1/26 ,  H04R3/12 ,  H04R2201/401

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

公开(公告)号：US20230039552A1

公开(公告)日：2023-02-09

申请号：US17968725

申请日：2022-10-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Tau HUANG ,  Kuei-Hao TSENG ,  Hung-I LIN

IPC: H04R1/10 ,  B81B7/00

Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.