公开(公告)号：US10141252B2

公开(公告)日：2018-11-27

申请号：US15435143

申请日：2017-02-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuan-Fu Sung ,  Shin-Hua Chao ,  Ming-Chi Liu ,  Hung-Sheng Chen

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor package includes: a passivation layer having a first surface and a second surface opposite to the first surface, the passivation layer defining a through hole extending from the first surface to the second surface, the through hole being further defined by a first sidewall and a second sidewall of the passivation layer; a first conductive layer on the first surface of the passivation layer and the first sidewall; a second conductive layer on the second surface of the passivation layer and the second sidewall; and a third conductive layer between the first conductive layer and the second conductive layer.

公开(公告)号：US11804461B2

公开(公告)日：2023-10-31

申请号：US17473829

申请日：2021-09-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Ping Tsai ,  Ming-Chi Liu ,  Yu-Ting Lu ,  Kai-Chiang Hsu ,  Che-Ting Liu

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H01L23/538

CPC classification number: H01L24/24 ,  H01L21/565 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/19 ,  H01L24/25 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68381 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/19102 ,  H01L2924/35121

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US11121111B2

公开(公告)日：2021-09-14

申请号：US16565158

申请日：2019-09-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin Tsai ,  Ming-Chi Liu ,  Yu-Ting Lu ,  Kai-Chiang Hsu ,  Che-Ting Liu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.