公开(公告)号：US20240332192A1

公开(公告)日：2024-10-03

申请号：US18128988

申请日：2023-03-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I WU ,  Chun-Yen TING ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN

IPC: H01L23/538 ,  G02B6/12 ,  H01L23/00 ,  H01L23/36 ,  H01L25/16

CPC classification number: H01L23/5381 ,  G02B6/12004 ,  H01L23/36 ,  H01L24/16 ,  H01L25/167 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.

公开(公告)号：US20240264368A1

公开(公告)日：2024-08-08

申请号：US18105702

申请日：2023-02-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN ,  Chang Chi LEE ,  Chun-Yen TING

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B2006/12109 ,  H04B10/25891

Abstract: An optoelectronic device is provided. The optoelectronic device includes a plurality of first waveguides and a plurality of second waveguides. The plurality of first waveguides are configured to receive a first plurality of optical signals. The plurality of second waveguides are configured to transmit a second plurality of optical signals. The plurality of first waveguides extend substantially along a first direction and the plurality of second waveguides extend substantially along a second direction different from and non-parallel with the first direction.

公开(公告)号：US20240345341A1

公开(公告)日：2024-10-17

申请号：US18135076

申请日：2023-04-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Shih-Yuan SUN ,  Chiu-Wen LEE ,  Chang Chi LEE ,  Chun-Yen TING ,  Hung-Chun KUO

IPC: G02B6/42 ,  G02B6/43

CPC classification number: G02B6/4267 ,  G02B6/4257 ,  G02B6/43

Abstract: A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.

公开(公告)号：US20240329344A1

公开(公告)日：2024-10-03

申请号：US18129769

申请日：2023-03-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN ,  Chang Chi LEE ,  Hung-Chun KUO ,  Chun-Yen TING

IPC: G02B6/43 ,  G02B6/42 ,  H01L25/16

CPC classification number: G02B6/43 ,  G02B6/4206 ,  G02B6/4239 ,  H01L25/167

Abstract: Semiconductor packages and methods for manufacturing the semiconductor packages are provided. The semiconductor package includes a first electronic element disposed over a first substrate; a second electronic element disposed over a second substrate spaced apart from the first substrate; and a first interconnection element connected to the first electronic element and the second electronic element. The first electronic element extends beyond an edge of the first substrate. The second electronic element extends beyond an edge of the second substrate and towards the first electronic element. The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element.

公开(公告)号：US20240213205A1

公开(公告)日：2024-06-27

申请号：US18088498

申请日：2022-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Shih-Yuan SUN ,  Chieh-Chen FU

IPC: H01L23/00 ,  G02B6/42 ,  H01L23/31

CPC classification number: H01L24/29 ,  G02B6/4239 ,  G02B6/424 ,  G02B6/4253 ,  H01L23/3157 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A package is provided. The package includes a carrier, a component, and a first protective element. The component is disposed over the carrier and having a side surface configured for optically coupling. The first protective element is disposed between the carrier and the component. The side surface of the component is free from being in contact with the first protective element.

公开(公告)号：US20240345315A1

公开(公告)日：2024-10-17

申请号：US18135075

申请日：2023-04-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Yen TING ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN

IPC: G02B6/122 ,  G02B6/12

CPC classification number: G02B6/1225 ,  G02B6/12002 ,  G02B2006/12147

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.

公开(公告)号：US20240329300A1

公开(公告)日：2024-10-03

申请号：US18127624

申请日：2023-03-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I WU ,  Chun-Yen TING ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN

IPC: G02B6/12 ,  H04B10/50

CPC classification number: G02B6/12004 ,  H04B10/501

Abstract: A package device and an electronic device are provided. The package device includes a carrier and a die. The die is disposed over the carrier and has a first surface facing the carrier and a second surface opposite to the first surface. The first surface of the die is configured to electrically connect to the carrier and the second surface of the die is configured to optically connect to the carrier.

公开(公告)号：US20240038712A1

公开(公告)日：2024-02-01

申请号：US17876466

申请日：2022-07-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Shih-Yuan SUN ,  Chieh-Chen FU

IPC: H01L23/00 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L24/32 ,  H01L21/563 ,  H01L24/16 ,  H01L24/73 ,  H01L24/48 ,  H01L25/0655 ,  H01L23/3157 ,  H01L21/565 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/48229 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2924/35121 ,  H01L2924/37001 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/3201 ,  H01L2224/32053 ,  H01L2224/32054 ,  H01L2224/32059 ,  H01L2224/32058 ,  H01L2224/26175 ,  H01L2924/1811 ,  H01L2924/182 ,  H01L2924/183

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a first component, a second component, and a protective element. The first component and the second component are arranged side by side in a first direction over the carrier. The protective element is disposed over a top surface of the carrier and extending from space under the first component toward a space under the second component. The protective element includes a first portion and a second portion protruded oppositely from edges of the first component by different distances, and the first portion and the second portion are arranged in a second direction angled with the first direction.