公开(公告)号：US08861217B2

公开(公告)日：2014-10-14

申请号：US13668692

申请日：2012-11-05

Applicant: Apple Inc.

Inventor： Gloria Lin ,  William Bryson Gardner, Jr. ,  Joseph Fisher, Jr. ,  Dennis Pyper ,  Amir Salehi

IPC: H05K7/20 ,  H01R43/00 ,  H05K1/14 ,  H05K1/11 ,  H05K3/22

CPC classification number: H05K1/145 ,  H05K1/115 ,  H05K1/141 ,  H05K3/222 ,  H05K2201/0919 ,  H05K2201/09627 ,  H05K2201/10446 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.

Abstract translation: 这涉及用于通过电气系统的模块提供一个或多个通孔的系统和方法。 例如，在一些实施例中，模块可以包括电气系统的一个或多个无源元件和/或主动元件，其中包装已经被塑料模制。 该模块可以堆叠在电气系统的另一个部件下。 然后可以提供通过模块延伸的通孔。 通孔可以包括例如导电通路。 以这种方式，通孔可以提供用于将堆叠在模块顶部上的部件耦合到包括电气系统的电子设备的其他实体的电路径。 例如，组件可以耦合到诸如其他组件，其他模块，印刷电路板，其他电气系统或任何其它合适实体的其他实体。

公开(公告)号：US08664656B1

公开(公告)日：2014-03-04

申请号：US13644280

申请日：2012-10-04

Applicant: Apple Inc.

Inventor： Shawn X. Arnold ,  Dennis Pyper

IPC: H01L23/58 ,  H01L27/15 ,  H01L29/84 ,  H01L23/48

CPC classification number: H01L22/10 ,  H01L23/48 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/58 ,  H01L24/32 ,  H01L24/73 ,  H01L24/80 ,  H01L24/82 ,  H01L29/84 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82105 ,  H01L2224/82138 ,  H05K1/00 ,  H05K1/0268 ,  H05K1/186 ,  H05K3/4611 ,  H05K2201/10674 ,  H05K2203/063

Abstract: Methods and devices for embedding semiconductors in printed circuit boards (PCBs) are provided. In one example, a method of manufacturing a PCB having a die assembly embedded therein includes removing a release film from an adhesive layer of the die assembly. The method also includes disposing the die assembly on a first layer of the PCB such that the adhesive layer contacts the first layer of the PCB. The method includes disposing a second layer of the PCB over the first layer such that the die assembly is within an intermediate portion between the first layer and the second layer. The method also includes filling the intermediate portion with resin and subjecting the PCB to a press cycle to cure the resin.

公开(公告)号：US20130141861A1

公开(公告)日：2013-06-06

申请号：US13678425

申请日：2012-11-15

Applicant: Apple Inc.

Inventor： Gloria Lin ,  Bryson Gardner ,  Joseph Fisher ,  Dave Goh ,  Barry Corlett ,  Dennis Pyper ,  Amir Salehi

IPC: G06F1/16

CPC classification number: G06F1/16 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10159 ,  H05K2201/10515

Abstract: This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in “bare die” form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board (“flex”). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.

Abstract translation: 这涉及用于提供衬底上系统的系统和方法。 在一些实施例中，整个系统（例如，处理器，存储器，加速度计，I / O电路或任何其它合适的部件）的必要组件可以以“裸模”形式制造在单个微芯片上。 例如，管芯可以通过基板和柔性印刷电路板（“挠曲”）耦合到合适的闪存。 在一些实施例中，柔性件可以延伸经过衬底，管芯或两者，以允许附加的相对较大的部件联接到弯曲部。 在一些实施例中，管芯可以通过弯曲而不与衬底耦合到闪存。 在一些实施例中，组件测试点可以放置在衬底的闪存侧。

公开(公告)号：US20130063914A1

公开(公告)日：2013-03-14

申请号：US13668692

申请日：2012-11-05

Applicant: Apple Inc.

Inventor： Gloria Lin ,  Bryson Gardner, JR. ,  Joseph Fisher, JR. ,  Dennis Pyper ,  Amir Salehi

IPC: H05K7/00

CPC classification number: H05K1/145 ,  H05K1/115 ,  H05K1/141 ,  H05K3/222 ,  H05K2201/0919 ,  H05K2201/09627 ,  H05K2201/10446 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.

Abstract translation: 这涉及用于通过电气系统的模块提供一个或多个通孔的系统和方法。 例如，在一些实施例中，模块可以包括电气系统的一个或多个无源元件和/或主动元件，其中包装已经被塑料模制。 该模块可以堆叠在电气系统的另一个部件下。 然后可以提供通过模块延伸的通孔。 通孔可以包括例如导电通路。 以这种方式，通孔可以提供用于将堆叠在模块顶部上的部件耦合到包括电气系统的电子设备的其他实体的电路径。 例如，组件可以耦合到诸如其他组件，其他模块，印刷电路板，其他电气系统或任何其他合适实体的其他实体。