Abstract:
An alternating current (AC) to direct current (DC) power converter may have a connector with a pair of power supply contacts and a pair of data contacts. An electronic device may be connected to the connector of the power converter. The power converter may supply DC power to the electronic device using the power supply contacts. The power converter may include control circuitry that has a resistor coupled across the data contacts. When the electronic device and the power converter are connected to each other, each may advertise to the other that capabilities are present that exceed industry standards. At the same time, standard-compliant discovery operations may be performed to probe the value of the resistance of the resistor that is coupled across the data contacts. When extended capabilities are discovered, extended functions may be performed including accelerated charging functions and data communications functions.
Abstract:
The disclosed architecture uses address mapping to map a block address on a host interface to an internal block address of a non-volatile memory (NVM) device. The block address is mapped to an internal chip select for selecting a Concurrently Addressable Unit (CAU) identified by the block address. The disclosed architecture supports generic NVM commands for read, write, erase and get status operations. The architecture also supports an extended command set for supporting read and write operations that leverage a multiple CAU architecture.
Abstract:
An alternating current (AC) to direct current (DC) power converter may have a connector with a pair of power supply contacts and a pair of data contacts. An electronic device may be connected to the connector of the power converter. The power converter may supply DC power to the electronic device using the power supply contacts. The power converter may include control circuitry that has a resistor coupled across the data contacts. When the electronic device and the power converter are connected to each other, each may advertise to the other that capabilities are present that exceed industry standards. At the same time, standard-compliant discovery operations may be performed to probe the value of the resistance of the resistor that is coupled across the data contacts. When extended capabilities are discovered, extended functions may be performed including accelerated charging functions and data communications functions.
Abstract:
A media processing system and device with improved power usage characteristics, improved audio functionality and improved media security is provided. Embodiments of the media processing system include an audio processing subsystem that operates independently of the host processor for long periods of time, allowing the host processor to enter a low power state while the audio data is being processed. Other aspects of the media processing system provide for enhanced audio effects such as mixing stored audio samples into real-time telephone audio. Still other aspects of the media processing system provide for improved media security due to the isolation of decrypted audio data from the host processor.
Abstract:
An alternating current (AC) to direct current (DC) power converter may have a connector with a pair of power supply contacts and a pair of data contacts. An electronic device may be connected to the connector of the power converter. The power converter may supply DC power to the electronic device using the power supply contacts. The power converter may include control circuitry that has a resistor coupled across the data contacts. When the electronic device and the power converter are connected to each other, each may advertise to the other that capabilities are present that exceed industry standards. At the same time, standard-compliant discovery operations may be performed to probe the value of the resistance of the resistor that is coupled across the data contacts. When extended capabilities are discovered, extended functions may be performed including accelerated charging functions and data communications functions.
Abstract:
The disclosed architecture uses address mapping to map a block address on a host interface to an internal block address of a non-volatile memory (NVM) device. The block address is mapped to an internal chip select for selecting a Concurrently Addressable Unit (CAU) identified by the block address. The disclosed architecture supports generic NVM commands for read, write, erase and get status operations. The architecture also supports an extended command set for supporting read and write operations that leverage a multiple CAU architecture.
Abstract:
An alternating current (AC) to direct current (DC) power converter may have a connector with a pair of power supply contacts and a pair of data contacts. An electronic device may be connected to the connector of the power converter. The power converter may supply DC power to the electronic device using the power supply contacts. The power converter may include control circuitry that has a resistor coupled across the data contacts. When the electronic device and the power converter are connected to each other, each may advertise to the other that capabilities are present that exceed industry standards. At the same time, standard-compliant discovery operations may be performed to probe the value of the resistance of the resistor that is coupled across the data contacts. When extended capabilities are discovered, extended functions may be performed including accelerated charging functions and data communications functions.
Abstract:
This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in “bare die” form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board (“flex”). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.