Systems having fibers with antireflection coatings

    公开(公告)号:US11644617B1

    公开(公告)日:2023-05-09

    申请号:US17408300

    申请日:2021-08-20

    Applicant: Apple Inc.

    CPC classification number: G02B6/04 G02B6/102

    Abstract: A system may include one or more electronic devices. Fiber bundles may be provided to convey light. A fiber bundle may have a bend along its length. Fibers for the fiber bundle may be formed from polymer cores coated with polymer claddings. The fibers may have end faces coated with antireflection coatings. The antireflection coatings may be formed from amorphous fluoropolymer deposited from solution. The fluoropolymer may be applied to the end faces of the fibers by dipping, spraying, or by dispensing with a needle dispenser or other dispensing tool. An optical component such as a light-emitting device for a communications system, an illumination system, or a sensor system may provide infrared light that is guided through the fiber bundle.

    Electronic Devices with Switchable Diffusers

    公开(公告)号:US20190137333A1

    公开(公告)日:2019-05-09

    申请号:US16141183

    申请日:2018-09-25

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a display. An optical component window may be formed in the inactive area of the display. The optical component window may transmit infrared light from an infrared light source. The infrared light source may include a diffuser to allow the light source to operate in a flood illumination mode and a structured light mode. The diffuser may include liquid crystal material between first and second substrates. A sealant may surround the liquid crystal layer, and one or more spacer walls may be located between the sealant and the liquid crystal layer. An additional spacer wall may be used outside of the sealant to prevent metal from creating an electrical short between electrodes in the diffuser. Conductive material in the sealant may be used to couple a top electrode to a metal pad on a bottom substrate.

    Laser Processing of Electronic Device Structures

    公开(公告)号:US20170197868A1

    公开(公告)日:2017-07-13

    申请号:US15159067

    申请日:2016-05-19

    Applicant: Apple Inc.

    Abstract: Laser processing techniques may be used to form structures for electronic devices. A laser processing system may be provided with lasers and positioners for moving laser beams across a structure to be processed such as a layer of glass or other material. A laser such as a pulsed infrared laser may be move along a path across the layer of material. The laser may create a series of damaged regions along the path. A portion of the layer may be removed from other portions of the layer by breaking off the portion of the layer along the path. Laser-induced heating techniques and mechanical stress-inducing techniques may be used to impart stress to the layer of material to help break off the portion. The layer may include one or more sublayers such as layers of glass substrate material in a display.

    Electronic device displays with holes to accommodate components

    公开(公告)号:US10108222B2

    公开(公告)日:2018-10-23

    申请号:US15177252

    申请日:2016-06-08

    Applicant: Apple Inc.

    Abstract: An electronic device may have a display. The display may be mounted in a housing and may have a window to accommodate a camera or other electrical component. The display may have multiple substrate layers. A hole may be formed in one of the substrate layers to form additional space within the housing to accommodate the electrical component. The hole may be drilled partway through a substrate layer to form an annular thinned region. The annular thinned region may be cracked to release a disk-shaped portion of the substrate layer and form the hole. A ring of sealant may surround the hole to help cushion the display substrate layers during drilling operations. Column spacer structures may be formed on a portion of a display substrate that is overlapped by the hole.

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