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公开(公告)号:US11848202B2
公开(公告)日:2023-12-19
申请号:US17456967
申请日:2021-11-30
Applicant: Applied Materials, Inc.
Inventor: Zhepeng Cong , Mostafa Baghbanzadeh , Tao Sheng , Enle Choo
CPC classification number: H01L21/02293 , C23C16/4412 , C23C16/455 , C23C16/463 , C23C16/52 , G01B17/02 , G01B17/025
Abstract: The present disclosure generally relates to process chambers for semiconductor processing. In one embodiment, a growth monitor for substrate processing is provided. The growth monitor includes a sensor holder and a crystal disposed in the sensor holder having a front side and a back side. An opening is formed in the sensor holder exposing a front side of the crystal. A gas inlet is disposed through the sensor holder to a plenum formed by the back side of the crystal and the sensor holder. A gas outlet is fluidly coupled to the plenum.
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公开(公告)号:US12196617B2
公开(公告)日:2025-01-14
申请号:US17609335
申请日:2020-06-29
Applicant: Applied Materials, Inc.
Inventor: Zuoming Zhu , Shu-Kwan Lau , Enle Choo , Ala Moradian , Flora Fong-Song Chang , Maxim D. Shaposhnikov , Bindusagar Marath Sankarathodi , Zhepeng Cong , Zhiyuan Ye , Vilen K. Nestorov , Surendra Singh Srivastava , Saurabh Chopra , Patricia M. Liu , Errol Antonio C. Sanchez , Jenny C. Lin , Schubert S. Chu
Abstract: An apparatus for controlling temperature profile of a substrate within an epitaxial chamber includes a bottom center pyrometer and a bottom outer pyrometer to respectively measure temperatures at a center location and an outer location of a first surface of a susceptor of an epitaxy chamber, a top center pyrometer and a top outer pyrometer to respectively measure temperatures at a center location and an outer location of a substrate disposed on a second surface of the susceptor opposite the first surface, a first controller to receive signals, from the bottom center pyrometer and the bottom outer pyrometer, and output a feedback signal to a first heating lamp module that heats the first surface based on the measured temperatures of the first surface, and a second controller to receive signals, from the top center pyrometer, the top outer pyrometer, the bottom center pyrometer, and the bottom outer pyrometer, and output a feedback signal to a second heating lamp module that heats the substrate based on the measured temperatures of a substrate and the measured temperatures of the first surface.
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公开(公告)号:US12165934B2
公开(公告)日:2024-12-10
申请号:US16938510
申请日:2020-07-24
Applicant: Applied Materials, Inc.
Inventor: Zuoming Zhu , Shu-Kwan Lau , Ala Moradian , Enle Choo , Flora Fong-Song Chang , Vilen K Nestorov , Zhiyuan Ye , Bindusagar Marath Sankarathodi , Maxim D. Shaposhnikov , Surendra Singh Srivastava , Zhepeng Cong , Patricia M. Liu , Errol C. Sanchez , Jenny C. Lin , Schubert S. Chu , Balakrishnam R. Jampana
Abstract: A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.
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公开(公告)号:US11261538B1
公开(公告)日:2022-03-01
申请号:US17027385
申请日:2020-09-21
Applicant: Applied Materials, Inc.
Inventor: Ala Moradian , Zuoming Zhu , Patricia M. Liu , Shu-Kwan Lau , Flora Fong-Song Chang , Enle Choo , Zhiyuan Ye
Abstract: The present invention provides methods and apparatus for processing semiconductor substrates in an epitaxy chamber configured to map a temperature profile for both substrates and interior chamber components. In one embodiment, the semiconductor processing chamber has a body having ceiling and a lower portion defining an interior volume. A substrate support is disposed in the interior volume. A mounting plate is coupled to the ceiling outside the interior volume. A movement assembly is coupled to the mounting plate. A sensor is coupled to the movement assembly and moveable relative to the ceiling. The sensor is configured to detect a temperature location in the interior volume.
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