公开(公告)号：US20220363064A1

公开(公告)日：2022-11-17

申请号：US17647820

申请日：2022-01-12

Applicant: Applied Materials, Inc.

Inventor： Daihua ZHANG ,  Ludovic Godet ,  Michael David-Scott Kemp ,  Kang Luo ,  Kazuya Daito ,  Kenneth S. Ledford ,  Bahubali S. Upadhye ,  Hemantha Raju ,  John Rusconi ,  Elsa Massonneau ,  Mahendran Chidambaram ,  Alexey Stepanov ,  Visweswaren Sivaramakrishnan

IPC: B41J2/175

Abstract: Embodiments described herein relate to an inkjet printing platform. The inkjet printing platform is utilized for fabrication of optical films and optical device structures. The inkjet printing platform includes a transfer chamber, one or more inkjet chambers, a plurality of auxiliary modules, a substrate flipper, and load ports. The inkjet printing platform is operable to perform an inkjet printing process on a substrate to form an optical film and/or an optical device.

公开(公告)号：US11878532B2

公开(公告)日：2024-01-23

申请号：US17647820

申请日：2022-01-12

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Ludovic Godet ,  Michael David-Scott Kemp ,  Kang Luo ,  Kazuya Daito ,  Kenneth S. Ledford ,  Bahubali S. Upadhye ,  Hemantha Raju ,  John Rusconi ,  Elsa Massonneau ,  Mahendran Chidambaram ,  Alexey Stepanov ,  Visweswaren Sivaramakrishnan

IPC: B41J2/175 ,  H01L21/00

CPC classification number: B41J2/175 ,  H01L21/00

Abstract: Embodiments described herein relate to an inkjet printing platform. The inkjet printing platform is utilized for fabrication of optical films and optical device structures. The inkjet printing platform includes a transfer chamber, one or more inkjet chambers, a plurality of auxiliary modules, a substrate flipper, and load ports. The inkjet printing platform is operable to perform an inkjet printing process on a substrate to form an optical film and/or an optical device.

公开(公告)号：US20210053286A1

公开(公告)日：2021-02-25

申请号：US16546194

申请日：2019-08-20

Applicant: Applied Materials, Inc.

Inventor： Joseph Yudovsky ,  John Rusconi ,  Mahendran Chidambaram

IPC: B29C64/245 ,  B33Y30/00 ,  B29C64/295 ,  B22F3/105 ,  B28B1/00

Abstract: A build plate assembly for an additive manufacturing apparatus includes a build plate to support an object to be fabricated by successive delivery of a plurality of layers of powder, a support structure beneath the build plate and separated from the build plate by one or more supports, and a plurality of restraints securing an outer edge of the build plate to the support structure.

公开(公告)号：US11964343B2

公开(公告)日：2024-04-23

申请号：US17183777

申请日：2021-02-24

Applicant: Applied Materials, Inc.

Inventor： Mahendran Chidambaram ,  Shmuel Erez ,  Wei-Sheng Lei ,  John Rusconi

IPC: B23K26/362 ,  B23K26/06 ,  B23K103/00

CPC classification number: B23K26/362 ,  B23K26/0643 ,  B23K26/0648 ,  B23K2103/50

Abstract: A process of producing optical devices is provided including transferring a first substrate comprising one or more devices to a laser dicing tool, the laser dicing tool including a filamentation stage and a singulation stage. One or more device contours are created on the first substrate in the filamentation stage. The optical devices are singulated from the first substrate along the one or more device contours in the singulation stage. The devices are transferred to storage or for further backend processing.