公开(公告)号：US12077877B2

公开(公告)日：2024-09-03

申请号：US17900803

申请日：2022-08-31

申请人： Atlas Magnetics

发明人： John Othniel McDonald ,  Daniel Smallwood ,  Zach Zimits

IPC分类号： C25D3/20 ,  C25D3/12 ,  C25D3/44 ,  C25D5/10 ,  C25D7/00 ,  H01F3/00 ,  H01F41/26

CPC分类号： C25D3/12 ,  C25D3/20 ,  C25D3/44 ,  C25D5/10 ,  C25D7/001 ,  H01F3/00 ,  H01F41/26

摘要： An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.

公开(公告)号：US20240003041A1

公开(公告)日：2024-01-04

申请号：US18135660

申请日：2023-04-17

申请人： Atlas Magnetics Inc.

发明人： John Othniel McDonald ,  Zach Zimits

IPC分类号： C25D17/12 ,  H01B1/16 ,  C23C28/00

CPC分类号： C25D17/12 ,  H01B1/16 ,  C23C28/345 ,  C23C28/44 ,  C23C28/32 ,  C23C28/42

摘要： A hybrid conductive material comprising at least one conductive material having at least one internal porous insulative layer; and wherein, at least one of the conductive materials fills the voids of the internal porous insulative layer. The hybrid material blends conductive metals and porous insulation layers in a manner so that the resulting material operates as a single layer material with its own unique conductivity and skin depth; and a unique and strong directional impedance. By using a porous insulation layer, metal layers may be bonded together through insulation layers, and this allows rapid low-cost formation of the hybrid material. The hybrid material may be used to form thin wires or traces capable of handling high frequency applications.

公开(公告)号：US20230082177A1

公开(公告)日：2023-03-16

申请号：US17900803

申请日：2022-08-31

申请人： Atlas Magnetics

发明人： John Othniel McDonald ,  Daniel Smallwood ,  Zach Zimits

IPC分类号： C25D3/12 ,  C25D7/00 ,  H01F3/00 ,  C25D3/20 ,  C25D3/44

摘要： An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.