A FLEXIBLE MODULE AND A METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20200233245A1

    公开(公告)日:2020-07-23

    申请号:US15760401

    申请日:2017-09-14

    发明人: Hong LI Pao Ming TSAI

    IPC分类号: G02F1/1333 G09F9/30

    摘要: The present disclosure discloses a flexible module and a method for fabricating the same. The method comprises: attaching a bottom film to a back surface of a flexible panel with an adhesive layer; at least removing the bottom film on the back surface of a bending area of the flexible panel; and bending the flexible panel so that the bending area of the flexible panel bends to complete the fabrication of the flexible module.

    SUBSTRATE, CHIP ON FILM AND ELECTRONIC EQUIPMENT

    公开(公告)号:US20180108682A1

    公开(公告)日:2018-04-19

    申请号:US15504628

    申请日:2016-05-18

    IPC分类号: H01L27/12

    摘要: The embodiments of the present invention provide a substrate, a chip on film and an electronic equipment. The substrate includes a plurality of first bonding pads arranged side by side along a first direction. Each first bonding pad has a first side edge and a second side edge arranged oppositely, which are arranged along the first direction. A third side edge and a fourth side edge of the first bonding pad are arranged oppositely and arranged along a second direction perpendicular to the first direction. The first side edge and second side edge of each first bonding pad are not parallel to each other.

    FLEXIBLE DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS

    公开(公告)号:US20200243779A1

    公开(公告)日:2020-07-30

    申请号:US16620559

    申请日:2018-10-12

    IPC分类号: H01L51/00 H01L51/56

    摘要: A flexible display substrate and a manufacturing method therefor, and a display apparatus, for relieving the problem that it is difficult to bend the flexible display substrate in a bending region to damage an upper circuit. The flexible display substrate comprises a back film, a first flexible base substrate located above the back film, and a second flexible base substrate located on one side of the first flexible base substrate facing away from the back film. The flexible display substrate has a bending region. An auxiliary layer is further provided between the first flexible base substrate and the second flexible base substrate. At least part of the auxiliary layer in the bending region can be decomposed in a preset condition, wherein the other film layers except the auxiliary layer are maintained at the original status in the preset condition.

    METHOD FOR MANUFACTURING FLEXIBLE DISPLAY DEVICE AND FLEXIBLE DISPLAY DEVICE

    公开(公告)号:US20180315804A1

    公开(公告)日:2018-11-01

    申请号:US15845689

    申请日:2017-12-18

    IPC分类号: H01L27/32 H01L51/56

    摘要: The disclosure provides a method for manufacturing a flexible display device and a flexible display device. The manufacturing method comprises: providing a bottom film to be treated, the bottom film being divided into a bezel bending area and a remaining area; surface treating the upper surface of the bottom film, such that an adhesive force between the bezel bending area and an adhesive layer to be laminated is less than an adhesive force between the remaining area and the adhesive layer to be laminated; providing a display panel to be laminated, and adhering the display panel to the upper surface of the bottom film via the adhesive layer; removing a portion of the bottom film that is located within the bezel bending area.

    CHIP ON FILM, FLEXIBLE DISPLAY PANEL AND DISPLAY DEVICE

    公开(公告)号:US20180047315A1

    公开(公告)日:2018-02-15

    申请号:US15540109

    申请日:2016-06-15

    发明人: Hong LI Liqiang CHEN

    摘要: A chip on film, including a base material provided with at least one row of output pads, wherein along an arranging direction of the output pads, an area where each row of output pads is located includes a first region, a second region and a third region, the second region is in the middle of the area where the row of output pads is located; the shape of each output pad located in the second region is different from the shape of each output pad located in the first region and the third region, and a maximum length spanned by each output pad located in the second region in the arranging direction is smaller than a minimum value among maximum lengths spanned by each output pad located in the first region and the third region in the arranging direction. A flexible display panel and a display device are further disclosed.

    COVER STRUCTURE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

    公开(公告)号:US20190051223A1

    公开(公告)日:2019-02-14

    申请号:US15991117

    申请日:2018-05-29

    摘要: The present disclosure discloses a cover structure, a manufacturing method thereof and a display device. The cover structure includes a first and a second transparent flexible film layer, a glass panel, and a first optical adhesive layer. The first transparent flexible film layer has a folded region and a non-folded region. The glass panel is disposed on the first transparent flexible film layer, and a projection of the glass panel on the first transparent flexible film layer is located inside the non-folded region. A part of the first optical adhesive layer is formed at a side of the glass panel facing away from the first transparent flexible film layer, and a part of the first optical adhesive layer covers the folded region of the first transparent flexible film layer. The second transparent flexible film layer is formed at a side of the first optical adhesive layer facing away from the first transparent flexible film layer.