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公开(公告)号:US20160148743A1
公开(公告)日:2016-05-26
申请号:US14550256
申请日:2014-11-21
Applicant: Cisco Technology, Inc.
Inventor: William Frank Edwards , Ki-Yuen Chau , Keith Frank Tharp , George Curtis , Kayan Lin
CPC classification number: H01F27/06 , H01F17/062 , H01F27/04 , H01F27/2823 , H01F27/2828 , H01F27/292 , H01F27/306 , H01F41/10 , H01F2017/0093 , H01F2027/065 , H01R4/023 , H01R4/027 , H01R13/00 , H01R13/719 , H01R24/64 , H01R43/01 , H01R43/0221 , H01R2107/00
Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.
Abstract translation: 在一个实施方式中,一种装置被配置成有助于电子表面贴装封装的制造或组装。 该装置包括被配置为支持共模扼流圈的共模扼流圈。 该装置包括联接到共模扼流圈的端子触点。 端子触点与连接到共模扼流圈的导线对齐。 该装置包括支撑构件,其包括与连接到共模扼流圈的导线对准的导线支撑部分和构造成支撑共模扼流器基座的中心部分。
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公开(公告)号:US09341794B1
公开(公告)日:2016-05-17
申请号:US14661375
申请日:2015-03-18
Applicant: Cisco Technology, Inc.
Inventor: George Edward Curtis , Keith Frank Tharp , Gary King Chan
CPC classification number: G02B6/4269
Abstract: A cage within a communication module may have a plurality of receptacles. A cover may cover at least a portion of the cage. A thermal conduction system may include a top wrap, a first side wrap, and a second side wrap. The top wrap may comprise a top wrap top portion covering at least a portion of the cover top side and a top wrap back portion covering at least a portion of the cover back side. The first side wrap may comprise a first side wrap back portion covering at least a portion of the top wrap back portion, a first side wrap side portion covering at least a portion of the cover first side, and first side fingers extending through a first slit in the cover into the cage. A heat sink may be attached to the first side wrap back portion.
Abstract translation: 通信模块内的笼可以具有多个插座。 盖可以覆盖笼的至少一部分。 热传导系统可以包括顶部包裹物,第一侧面包裹物和第二侧面包裹物。 顶部包装可以包括覆盖盖顶侧的至少一部分的顶部包覆顶部和覆盖盖背侧的至少一部分的顶部回卷部分。 第一侧包裹物可以包括覆盖顶部包裹部分的至少一部分的第一侧包裹部分,覆盖第一盖的至少一部分的第一侧包围侧部分和延伸穿过第一狭缝的第一侧指 在盖子进笼子里。 散热器可以附接到第一侧包裹部分。
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公开(公告)号:US20150003032A1
公开(公告)日:2015-01-01
申请号:US13930570
申请日:2013-06-28
Applicant: Cisco Technology, Inc.
Inventor: William Frank Edwards , George Edward Curtis , Ki Yuen Chau , Sandeep A. Patel , Keith Frank Tharp
IPC: H05K9/00
CPC classification number: H05K9/0052 , H01R12/722 , H01R13/6633 , H01R13/719 , H01R24/64
Abstract: An apparatus may be provided. The apparatus may comprise a circuit board. In addition, the apparatus may comprise an integrated connector mounted to the circuit board. A choke, external to the integrated connector, may be included in the apparatus. The choke may be electrically connected to the integrated connector through the circuit board.
Abstract translation: 可以提供一种装置。 该装置可以包括电路板。 此外,该装置可以包括安装到电路板的集成连接器。 集成连接器外部的扼流圈可以包括在设备中。 扼流器可以通过电路板电连接到集成连接器。
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公开(公告)号:US10200245B2
公开(公告)日:2019-02-05
申请号:US15075160
申请日:2016-03-20
Applicant: Cisco Technology, Inc.
Inventor: William Frank Edwards , Keith Frank Tharp , Ken Naumann , Amrik Bains , Clark Carty , Alan Yee , Arvind Kansal , Samir Bouadjel
IPC: H04L12/10 , H04L29/08 , H04L12/24 , G06F13/40 , H04L1/00 , H04L5/14 , H04L12/40 , H04L12/931 , H04L12/935
Abstract: Adjustable data rate data communications may be provided. First, a plurality of remote data rates at which a remote device is configured to operate may be received. Then, a plurality of local data rates at which a local device is configured to operate may be received. A greatest one of the plurality of local data rates may comprise a cable data rate comprising a greatest rate supported by a length of cable connecting the local device and the remote device. Next, an operating data rate may be determined. The operating data rate may comprise a highest one of the plurality of local data rates that has a corresponding equivalent within the plurality of remote data rates. The local device may then be operated at the operating data rate.
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公开(公告)号:US20170125149A1
公开(公告)日:2017-05-04
申请号:US15408063
申请日:2017-01-17
Applicant: Cisco Technology, Inc.
Inventor: William F. Edwards , George Edward Curtis , Ki Yuen Chau , Sandeep Arvindkumar Patel , Keith Frank Tharp , Robin Carol Johnson , Yu Liu , Billie Alton Hudson
IPC: H01F27/06 , H01R13/66 , H01F27/29 , H01R12/51 , H01F27/34 , H01F17/06 , H01R13/6461 , H01R13/719
Abstract: The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.
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公开(公告)号:US09620894B2
公开(公告)日:2017-04-11
申请号:US14933411
申请日:2015-11-05
Applicant: Cisco Technology, Inc.
Inventor: Jason Potterf , George Edward Curtis , William Frank Edwards , Gregory Scott Lovelace , Keith Frank Tharp
IPC: H01R13/58 , H01R13/621 , H01R12/70 , H01R13/504 , H01R24/60 , H04Q1/14
CPC classification number: H01R13/6215 , H01R12/7076 , H01R13/504 , H01R13/5808 , H01R13/5845 , H01R24/60 , H01R2201/04 , H04Q1/142 , Y10T29/49176
Abstract: Method, apparatus, and electrical cable for high-speed connections. The apparatus can include an electrical cable, a wire sorter, an electrical mating paddle, and a cable assembly. The wire sorter can be coupled to an end of the electrical cable, and configured to receive wires extending from the end of the electrical cable and position the wires relative to one another in a predetermined arrangement to yield sorted wires. The electrical mating paddle card can then be coupled to the sorted wires according to the predetermined arrangement. The cable assembly can be configured to house the wire sorter and at least a portion of the wires. Moreover, the cable assembly can include a hot-melt injection chamber configured to at least partially immobilize the wires relative to the cable assembly when hot-melt is injected into the hot-melt injection chamber.
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公开(公告)号:US20150172221A1
公开(公告)日:2015-06-18
申请号:US14297681
申请日:2014-06-06
Applicant: Cisco Technology, Inc.
Inventor: William Frank Edwards , Keith Frank Tharp , Ken Naumann , Amrik Bains , Clark Carty , Alan Yee , Arvind Kansal , Samir Bouadjel
IPC: H04L12/935 , H04L12/10
CPC classification number: H04L41/083 , G06F13/40 , H04L1/002 , H04L5/1446 , H04L12/10 , H04L12/4013 , H04L49/3054 , H04L49/40 , H04L69/323
Abstract: Power Over Ethernet (POE)/universal power over Ethernet (UPoE) may be enabled at multigigabit port-channel connections. This may allow for additional speed support in auto-negotiation messages while employing multigigabit speeds. An integrated connector module (referred to herein as a “ICM”) compatible with UPoE with a modified local physical layer (PHY) circuit may be capable of supporting multi-gigabit data rates (such as between 1 G to 10 G, e.g., 2.5 G and 5 G) as to not limit the data rates to 1 G. The ICM may provide multi-gig data transmission through a first plurality of pins comprising a multi-gig data pin area. Furthermore, the ICM may provide UPoE power to support the multi-gig transmission through a second plurality of pins comprising a UPoE power pin area.
Abstract translation: 以太网供电(POE)/通用以太网供电(UPoE)可能在千兆位端口通道连接时启用。 这可能允许在采用多千兆位速度时在自动协商消息中提供额外的速度支持。 与UPoE兼容的具有修改的本地物理层(PHY)电路的集成连接器模块(以下称为“ICM”)可能能够支持多吉比特数据速率(例如在1G至10G之间,例如2.5 G和5G),以便不将数据速率限制为1G。ICM可以通过包括多码头数据引脚区域的第一多个引脚提供多位数据传输。 此外,ICM可以提供UPoE电力来支持通过包括UPoE电源引脚区域的第二多个引脚的多吉达传输。
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公开(公告)号:US20200236825A1
公开(公告)日:2020-07-23
申请号:US16255229
申请日:2019-01-23
Applicant: Cisco Technology, Inc.
Inventor: Vic Hong Chia , George Edward Curtis , Adriana del Pilar Rangel , Keith Frank Tharp , Alpesh Umakant Bhobe
Abstract: An apparatus suitable for providing ventilation and electromagnetic interference (EMI) containment for a computing device includes a first strip and a second strip. The first strip is sized to span ventilation openings of a computing device covering. The second strip intersects the first strip while also spanning the ventilation openings. Thus, the first strip and the second strip cooperate to define airflow openings within the ventilation openings, the airflow openings being sized to inhibit EMI from exiting the computing device via the ventilation openings.
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公开(公告)号:US10285291B1
公开(公告)日:2019-05-07
申请号:US15898576
申请日:2018-02-17
Applicant: CISCO TECHNOLOGY, INC.
Inventor: Mandy Hin Lam , Vic Hong Chia , Keith Frank Tharp
IPC: H01R13/62 , H05K5/02 , H01R13/629 , G06K13/08 , G11B33/12
Abstract: In one embodiment, an apparatus includes a line card ejector configured to engage with a chassis to retain the line card within a slot in the chassis in a closed position, a locking member movable between a locked position in which the ejector is locked in its closed position and an unlocked position in which the ejector may be moved to an open position to remove the line card from the chassis, and an actuation device for moving the locking member from its locked position to its unlocked position. The locking member comprises an accessible release lever for moving the locking member from its locked position to its unlocked position without use of the actuation device for emergency release and removal of the line card. A method for emergency release of the line card is also disclosed herein.
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公开(公告)号:US09881725B2
公开(公告)日:2018-01-30
申请号:US14550256
申请日:2014-11-21
Applicant: Cisco Technology, Inc.
Inventor: William Frank Edwards , Ki-Yuen Chau , Keith Frank Tharp , George Curtis , Kayen Lin
IPC: H01F27/02 , H01F27/28 , H01F27/29 , H01F27/06 , H01F41/10 , H01F27/04 , H01F27/30 , H01R13/00 , H01R43/01 , H01R13/719 , H01F17/06 , H01F17/00 , H01R4/02 , H01R24/64 , H01R43/02 , H01R107/00
CPC classification number: H01F27/06 , H01F17/062 , H01F27/04 , H01F27/2823 , H01F27/2828 , H01F27/292 , H01F27/306 , H01F41/10 , H01F2017/0093 , H01F2027/065 , H01R4/023 , H01R4/027 , H01R13/00 , H01R13/719 , H01R24/64 , H01R43/01 , H01R43/0221 , H01R2107/00
Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.
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