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公开(公告)号：US09870856B2
公开(公告)日：2018-01-16
申请号：US14146989
申请日：2014-01-03
Applicant: Cooper Technologies Company
Inventor： Ahila Krishnamoorthy , Robert James Bogert , Yipeng Yan
IPC: H01F27/02 , H01F27/06 , H01F17/06 , H01F27/29 , H01F5/00 , H01F17/04 , H01F27/28 , H01F3/10 , H01F3/14 , H01F27/255 , H01F27/30
CPC classification number: H01F27/292 , H01F3/10 , H01F3/14 , H01F17/04 , H01F27/255 , H01F27/2847 , H01F27/306 , H01F2003/106 , H01F2017/048
Abstract: Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.
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公开(公告)号：US20160005528A1
公开(公告)日：2016-01-07
申请号：US14854822
申请日：2015-09-15
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Yipeng Yan , Robert James Bogert , Brent Elliot , Guo Ouyang
IPC: H01F27/29
CPC classification number: H01F27/292 , H01F27/2847 , H01F27/306
Abstract: An electromagnet component assembly includes a preformed conductive winding formed in at least first and second pieces for assembly with a single magnetic core with a simplified and relatively low cost manufacture. The assembly provides a power inductor operable at higher current, higher power levels with reduced direct current resistance.
Abstract translation: 电磁体部件组件包括形成在至少第一和第二部件中的预成型导电绕组，用于与简单且相对低成本制造的单个磁芯组装。 该组件提供可在更高电流，更高功率水平下工作的功率电感器，降低直流电阻。
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公开(公告)号：US20140266539A1
公开(公告)日：2014-09-18
申请号：US14146989
申请日：2014-01-03
Applicant: Cooper Technologies Company
Inventor： Ahila Krishnamoorthy , Robert James Bogert , Yipeng Yan
IPC: H01F27/29
CPC classification number: H01F27/292 , H01F3/10 , H01F3/14 , H01F17/04 , H01F27/255 , H01F27/2847 , H01F27/306 , H01F2003/106 , H01F2017/048
Abstract: Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.
Abstract translation: 用于电路板的磁性部件组件包括形成有物理间隙的单个形状的磁芯片，并且经由间隙组装到芯上的导电绕组。 芯中的物理间隙填充有磁性材料以增强磁性能。 磁性部件组件可以限定功率电感器。
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公开(公告)号：US20160276087A1
公开(公告)日：2016-09-22
申请号：US15054660
申请日：2016-02-26
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Yipeng Yan , Robert James Bogert
CPC classification number: H01F27/292 , H01F17/06 , H01F27/2828 , H01F27/306 , H01F2017/065
Abstract: A surface mount swing-type inductor component is configured to establish a non-uniform gap when assembled. The non-uniform gap produces swing-type inductor functionality in a compact package for higher current applications while being manufacturable at relatively low cost.
Abstract translation: 表面安装摆动式电感器部件被配置为在组装时建立不均匀的间隙。 非均匀间隙在紧凑型封装中产生摆动式电感器功能，用于更高电流应用，同时可以以相对较低的成本制造。
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5.发明授权Low profile, surface mount electromagnetic component assembly and methods of manufacture 有权薄型，表面贴装电磁元件组装及制造方法公开(公告)号：US09202617B2
公开(公告)日：2015-12-01
申请号：US14314625
申请日：2014-06-25
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Dengyan Zhou , Yipeng Yan , Robert James Bogert , Brent Alan Elliott
CPC classification number: H01F27/24 , H01F27/2847 , H01F27/292 , H01F27/306 , H01F41/00 , Y10T29/49073
Abstract: A low profile surface mount electromagnetic component such as a power inductor includes first and second core pieces arranged side by side and having longitudinal side walls facing one another. A preformed coil winding includes vertical legs that are received in vertical slots of the facing longitudinal sidewalls of the component. Inset depressed sections are provided in the top surfaces of the first and second magnetic core pieces and receive a main winding section of the coil winding. Surface mount terminal tabs extend on the bottom surfaces of both the first and second magnetic core pieces.
Abstract translation: 诸如功率电感器的薄型表面安装电磁元件包括并排布置的第一和第二芯片，并且具有彼此面对的纵向侧壁。 预成型的线圈绕组包括被接收在部件的相对的纵向侧壁的垂直狭槽中的垂直腿部。 在第一和第二磁芯片的顶表面上提供凹陷的凹陷部分并且接收线圈绕组的主绕组部分。 表面安装端子片在第一和第二磁芯片的底表面上延伸。
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Patent Agency Ranking
公开(公告)号：US20140266555A1
公开(公告)日：2014-09-18
申请号：US14146973
申请日：2014-01-03
Applicant: Cooper Technologies Company
Inventor： Ahila Krishnamoorthy , Robert James Bogert , Yipeng Yan
IPC: H01F3/10
CPC classification number: H01F27/292 , H01F3/10 , H01F3/14 , H01F17/04 , H01F27/255 , H01F27/2847 , H01F27/306 , H01F2003/106 , H01F2017/048
Abstract: Magnetic component assemblies for circuit boards include magnetic cores formed with a gap and preformed conductive windings sliding assembled to the cores via the gaps. The gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.
Abstract translation: 用于电路板的磁性部件组件包括形成有间隙的磁芯和预先形成的导电绕组，其通过间隙组装到芯上。 芯中的间隙填充有磁性材料以增强磁性能。 磁性部件组件可以限定功率电感器。
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公开(公告)号：US20130113591A1
公开(公告)日：2013-05-09
申请号：US13730142
申请日：2012-12-28
Applicant: Cooper Technologies Company
Inventor： Yipeng Yan , Robert James Bogert
IPC: H01F27/29 , H01F27/245
CPC classification number: H01F27/29 , H01F17/0013 , H01F17/0033 , H01F27/245 , H01F27/2847 , H01F27/2866 , H01F27/292 , H01F27/30 , H01F41/041 , H01F2017/006 , H01F2017/0066 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49075
Abstract: A magnetic component and a method for manufacturing a low profile, magnetic component. The method comprises the steps of providing at least one sheet, coupling at least a portion of at least one winding to the at least one sheet, and laminating the at least one sheet with at least a portion of the at least one winding. The magnetic component comprises at least one sheet and at least a portion of at least one winding coupled to the at least one sheet, wherein the at least one sheet is laminated to at least a portion of the at least one winding. The winding may comprise a clip, a preformed coil, a stamped conductive foil, or an etched trace using chemical or laser etching. The sheet may comprise any material capable of being laminated and/or rolled, including, but not limited to, flexible magnetic powder sheets.
Abstract translation: 磁性部件和制造低轮廓磁性部件的方法。 该方法包括以下步骤：提供至少一个片材，将至少一个绕组的至少一部分耦合到至少一个片材，以及将至少一个片材与至少一个绕组的至少一部分层压。 所述磁性部件包括至少一个片材和至少一个绕组的至少一部分，所述至少一个绕组连接到所述至少一个片材，其中所述至少一个片材层压到所述至少一个绕组的至少一部分。 绕组可以包括夹子，预成型线圈，冲压导电箔或使用化学或激光蚀刻的蚀刻迹线。 片材可以包括能够被层压和/或卷成的任何材料，包括但不限于柔性磁性粉末片材。
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公开(公告)号：US20130099886A1
公开(公告)日：2013-04-25
申请号：US13709793
申请日：2012-12-10
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Yipeng Yan , Robert James Bogert , Guo Ouyang , Zhigang Cheng
IPC: H01F27/30
CPC classification number: H01F27/303 , H01F3/14 , H01F17/04 , H01F17/043 , H01F27/255 , H01F27/2847 , H01F27/292 , H01F27/306 , H01F41/00 , H01F41/0246 , H01F2017/046 , Y10T29/49073
Abstract: Magnetic components including pre-formed clips are described that are more amenable to production on a miniaturized scale. Discrete core pieces can be assembled with pre-formed coils and physically gapped from one another with more efficient manufacturing techniques.
Abstract translation: 描述了包括预先形成的夹子的磁性部件，其更适于在小型化的尺度上生产。 分离的芯片可以用预先形成的线圈组装，并且通过更有效的制造技术彼此物理地间隙。
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9.发明申请公开(公告)号：US20170178794A1
公开(公告)日：2017-06-22
申请号：US15054794
申请日：2016-02-26
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Yipeng Yan , Jinliang Xu , Dengyan Zhou , John J. Janis
CPC classification number: H01F27/2847 , H01F3/10 , H01F27/263 , H01F27/292 , H01F27/306 , H01F41/02
Abstract: A surface mount, power inductor component assembly includes only two different shapes of modular core pieces and a set of windings having the same shape that can be assembled and arranged to have any desired number of non-magnetically coupled windings to accommodate electrical power systems having different numbers of phases of electrical power. The core pieces and windings are vertically elongated to reduce the component footprint on a circuit board yet provide higher power, higher current capability.
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10.发明申请LOW PROFILE, SURFACE MOUNT ELECTROMAGNETIC COMPONENT ASSEMBLY AND METHODS OF MANUFACTURE 有权低剖面，表面安装电磁元件组件及其制造方法公开(公告)号：US20150009004A1
公开(公告)日：2015-01-08
申请号：US14314625
申请日：2014-06-25
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Dengyan Zhou , Yipeng Yan , Robert James Bogert , Brent Alan Elliott
CPC classification number: H01F27/24 , H01F27/2847 , H01F27/292 , H01F27/306 , H01F41/00 , Y10T29/49073
Abstract: A low profile surface mount electromagnetic component such as a power inductor includes first and second core pieces arranged side by side and having longitudinal side walls facing one another. A preformed coil winding includes vertical legs that are received in vertical slots of the facing longitudinal sidewalls of the component. Inset depressed sections are provided in the top surfaces of the first and second magnetic core pieces and receive a main winding section of the coil winding. Surface mount terminal tabs extend on the bottom surfaces of both the first and second magnetic core pieces.
Abstract translation: 诸如功率电感器的薄型表面安装电磁元件包括并排布置的第一和第二芯片，并且具有彼此面对的纵向侧壁。 预成型的线圈绕组包括被接收在部件的相对的纵向侧壁的垂直狭槽中的垂直腿部。 在第一和第二磁芯片的顶表面上提供凹陷的凹陷部分并且接收线圈绕组的主绕组部分。 表面安装端子片在第一和第二磁芯片的底表面上延伸。
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