公开(公告)号：US20210143302A1

公开(公告)日：2021-05-13

申请号：US17127154

申请日：2020-12-18

Applicant: Cree, Inc.

Inventor： Bernd Keller ,  Nicholas Medendorp, JR. ,  Thomas Yuan

IPC: H01L33/48 ,  H01L33/64 ,  H01L33/62 ,  H01L33/58

Abstract: An LED package comprising a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages comprising providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.

公开(公告)号：US09076940B2

公开(公告)日：2015-07-07

申请号：US13971547

申请日：2013-08-20

Applicant: CREE, INC.

Inventor： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC: H01L33/00 ,  H01L33/60 ,  H05B33/08 ,  H01L25/075 ,  H01L33/58

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.