公开(公告)号：US09243777B2

公开(公告)日：2016-01-26

申请号：US13837379

申请日：2013-03-15

Applicant: CREE, INC.

Inventor： Matthew Donofrio ,  Gerald Negley ,  Shaow B. Lin

IPC: C09K11/06 ,  F21V9/08 ,  G02B1/04

CPC classification number: F21V9/08 ,  C09K11/06 ,  C09K2211/182 ,  G02B1/04 ,  G02B5/206

Abstract: The present disclosure relates to optical elements and coatings comprising rare-earth element (REE) compounds for light wavelength attenuation of light emitting diode (LED) elements and lamps. More particularly, the present disclosure relates to LED elements and lamps comprising wavelength attenuating elements comprising REE compounds having at least a portion of non-crystalline, non-hydrate form, methods of preparing such elements, and LED elements, LED arrays, LED packages, optical elements, lamps and systems made with same.

Abstract translation: 本公开涉及包含用于发光二极管（LED）元件和灯的光波长衰减的稀土元素（REE）化合物的光学元件和涂层。 更具体地说，本公开涉及包括波长衰减元件的LED元件和灯，所述波长衰减元件包括具有至少一部分非结晶非水合物形式的REE化合物，制备这些元件的方法，以及LED元件，LED阵列，LED封装， 光学元件，制造的灯和系统。

公开(公告)号：US20140268794A1

公开(公告)日：2014-09-18

申请号：US13837379

申请日：2013-03-15

Applicant: CREE, INC.

Inventor： Matthew Donofrio ,  Gerald Negley ,  Shaow B. Lin

IPC: F21V9/08 ,  G02B1/04

CPC classification number: F21V9/08 ,  C09K11/06 ,  C09K2211/182 ,  G02B1/04 ,  G02B5/206

Abstract: The present disclosure relates to optical elements and coatings comprising rare-earth element (REE) compounds for light wavelength attenuation of light emitting diode (LED) elements and lamps. More particularly, the present disclosure relates to LED elements and lamps comprising wavelength attenuating elements comprising REE compounds having at least a portion of non-crystalline, non-hydrate form, methods of preparing such elements, and LED elements, LED arrays, LED packages, optical elements, lamps and systems made with same.

Abstract translation: 本公开涉及包含用于发光二极管（LED）元件和灯的光波长衰减的稀土元素（REE）化合物的光学元件和涂层。 更具体地说，本公开涉及包括波长衰减元件的LED元件和灯，所述波长衰减元件包括具有至少一部分非结晶非水合物形式的REE化合物，制备这些元件的方法，以及LED元件，LED阵列，LED封装， 光学元件，制造的灯和系统。

公开(公告)号：US09599291B2

公开(公告)日：2017-03-21

申请号：US14188094

申请日：2014-02-24

Applicant: CREE, INC.

Inventor： Antony Van De Ven ,  Gerald Negley ,  Paul Kenneth Pickard

IPC: F21K99/00 ,  F21V5/00 ,  F21V7/00 ,  F21V9/00 ,  F21V9/08 ,  F21V11/06 ,  F21V13/04 ,  F21V13/08 ,  F21V13/14 ,  F21V31/04 ,  H05B33/08 ,  G02B5/20 ,  F21Y101/00

CPC classification number: F21K9/233 ,  F21K9/60 ,  F21V5/002 ,  F21V7/0025 ,  F21V9/00 ,  F21V9/08 ,  F21V11/06 ,  F21V13/04 ,  F21V13/08 ,  F21V13/14 ,  F21V31/04 ,  F21Y2101/00 ,  F21Y2115/10 ,  G02B5/20 ,  H05B33/0857

Abstract: Solid state light sources, lighting devices and lamps arranged to provide emission with a warm temperature and high CRI. One embodiment of a solid state lighting device according to the present invention comprises a light emitting diode (LED) device capable of emitting light in an emission spectrum. A filter arranged so that at least some light from the LED light source passes through it, with the filter filtering at least some of one or more portions of the light source emission spectrum. The resulting light source light has a different temperature but substantially the same CRI after passing through the filter.

公开(公告)号：US09076940B2

公开(公告)日：2015-07-07

申请号：US13971547

申请日：2013-08-20

Applicant: CREE, INC.

Inventor： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC: H01L33/00 ,  H01L33/60 ,  H05B33/08 ,  H01L25/075 ,  H01L33/58

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

公开(公告)号：US20130341653A1

公开(公告)日：2013-12-26

申请号：US13971547

申请日：2013-08-20

Applicant: Cree, Inc.

Inventor： THOMAS YUAN ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Abstract translation: 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US09657922B2

公开(公告)日：2017-05-23

申请号：US13838198

申请日：2013-03-15

Applicant: CREE, INC.

Inventor： Gerald Negley ,  Praneet Athalye ,  Shaow B. Lin

IPC: H01J19/38 ,  F21V15/00 ,  F21K9/90 ,  F21V25/02 ,  F21K9/232 ,  F21K9/60 ,  C09D183/04 ,  C08L33/08 ,  C08L75/04 ,  C08L75/16 ,  H05K3/28 ,  F21Y115/10 ,  F21Y107/30

CPC classification number: F21V15/00 ,  C08L33/08 ,  C08L75/04 ,  C08L75/16 ,  C09D183/04 ,  F21K9/232 ,  F21K9/60 ,  F21K9/90 ,  F21V25/02 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/287 ,  H05K2201/10106 ,  Y10T29/49117 ,  Y10T29/49146 ,  H01L2924/00

Abstract: The present disclosure discloses a method for providing protective coatings onto an energizable LED component coupled to an electrical path. More particularly, the present disclosure relates to LED lamps comprising transparent dielectric coatings and LED lamps and devices made thereby.

公开(公告)号：US20140268819A1

公开(公告)日：2014-09-18

申请号：US13838198

申请日：2013-03-15

Applicant: CREE, INC.

Inventor： Gerald Negley ,  Praneet Athalye ,  Shaow B. Lin

IPC: F21V15/00 ,  F21V29/00 ,  F21K99/00

CPC classification number: F21V15/00 ,  C08L33/08 ,  C08L75/04 ,  C08L75/16 ,  C09D183/04 ,  F21K9/232 ,  F21K9/60 ,  F21K9/90 ,  F21V25/02 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/287 ,  H05K2201/10106 ,  Y10T29/49117 ,  Y10T29/49146 ,  H01L2924/00

Abstract: The present disclosure discloses a method for providing protective coatings onto an energizable LED component coupled to an electrical path. More particularly, the present disclosure relates to LED lamps comprising transparent dielectric coatings and LED lamps and devices made thereby.

Abstract translation: 本公开公开了一种用于在耦合到电路径的可激励LED组件上提供保护性涂层的方法。 更具体地，本公开涉及包括透明电介质涂层和由其制成的LED灯和器件的LED灯。

公开(公告)号：US20150129921A1

公开(公告)日：2015-05-14

申请号：US14600813

申请日：2015-01-20

Applicant: CREE, INC.

Inventor： Gerald Negley ,  Michael Leung ,  Maryanne Underwood ,  Eric Tarsa ,  Peter Andrews

IPC: H01L33/54 ,  H01L33/58 ,  H01L33/50 ,  H01L33/48

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

Abstract: An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

Abstract translation: 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。