公开(公告)号：US09723731B2

公开(公告)日：2017-08-01

申请号：US14784080

申请日：2014-04-03

Applicant: DENSO CORPORATION

Inventor： Hiroaki Ando ,  Kiminobu Inayoshi ,  Tetsuichi Takeuchi ,  Naoto Makino ,  Tetsuya Sueyoshi ,  Kenichi Katoh ,  Keisuke Nishio

IPC: H05K5/00 ,  H05K3/34 ,  H05K1/11 ,  H01L23/498 ,  H05K1/18 ,  H05K1/02 ,  H01L23/50

CPC classification number: H05K5/0013 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16013 ,  H01L2924/3512 ,  H05K1/0213 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09436 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/613

Abstract: A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.