公开(公告)号：US10960859B2

公开(公告)日：2021-03-30

申请号：US16086369

申请日：2017-01-16

Applicant: DENSO CORPORATION

Inventor： Tetsuichi Takeuchi ,  Takahiko Naruse ,  Tomoaki Mizuno ,  Toshiya Takeuchi ,  Takehito Teramae ,  Ichiro Yoshida ,  Takafumi Ito

IPC: B60T7/12 ,  G08G1/16 ,  A61B5/18 ,  B60T8/171 ,  A61B5/1455 ,  B60W40/08 ,  G06F3/01 ,  A61B5/01 ,  A61B5/00 ,  A61B5/021

Abstract: An automatic brake control apparatus controls a braking device of a vehicle to execute a brake operation at a brake operating timing. The automatic brake control apparatus includes a brain activity state acquirer unit configured to acquire an activity state of a brain of a driver of the vehicle; a change determiner unit configured to use the activity state of the brain of the driver acquired after the braking device has executed a brake operation at a brake operating timing to determine whether changing the brake operating timing is necessary or unnecessary; and a change controller configured to change the brake operating timing in response to that changing the brake operating timing is determined to be necessary.

公开(公告)号：US09723731B2

公开(公告)日：2017-08-01

申请号：US14784080

申请日：2014-04-03

Applicant: DENSO CORPORATION

Inventor： Hiroaki Ando ,  Kiminobu Inayoshi ,  Tetsuichi Takeuchi ,  Naoto Makino ,  Tetsuya Sueyoshi ,  Kenichi Katoh ,  Keisuke Nishio

IPC: H05K5/00 ,  H05K3/34 ,  H05K1/11 ,  H01L23/498 ,  H05K1/18 ,  H05K1/02 ,  H01L23/50

CPC classification number: H05K5/0013 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16013 ,  H01L2924/3512 ,  H05K1/0213 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09436 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/613

Abstract: A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.