公开(公告)号：US20240127637A1

公开(公告)日：2024-04-18

申请号：US18397364

申请日：2023-12-27

Applicant: DENSO CORPORATION

Inventor： Masatoshi Komiyama ,  Keisuke Nishio ,  Shigeru Kajioka ,  Makiko Tauchi

IPC: G07C5/00 ,  G06T7/70 ,  G06V20/58

CPC classification number: G07C5/008 ,  G06T7/70 ,  G06V20/58

Abstract: By a data processing method or a communication system, input data is acquired, first processing that is processing of reducing a data amount of the input data is performed, second processing of converting data obtained by the first processing into data having a preset format configured to be handled by an in-vehicle device unit is performed, third processing of converting data obtained by the second processing into normalization data configured to be handled by a cloud server is performed, and vehicle data is provided to the cloud server.

公开(公告)号：US09723731B2

公开(公告)日：2017-08-01

申请号：US14784080

申请日：2014-04-03

Applicant: DENSO CORPORATION

Inventor： Hiroaki Ando ,  Kiminobu Inayoshi ,  Tetsuichi Takeuchi ,  Naoto Makino ,  Tetsuya Sueyoshi ,  Kenichi Katoh ,  Keisuke Nishio

IPC: H05K5/00 ,  H05K3/34 ,  H05K1/11 ,  H01L23/498 ,  H05K1/18 ,  H05K1/02 ,  H01L23/50

CPC classification number: H05K5/0013 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16013 ,  H01L2924/3512 ,  H05K1/0213 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09436 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/613

Abstract: A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.