公开(公告)号：US11623376B2

公开(公告)日：2023-04-11

申请号：US16866431

申请日：2020-05-04

Applicant: DENSO CORPORATION

Inventor： Akifumi Kurita ,  Yohei Yoshimura ,  Ryota Tanabe ,  Tsuyoshi Arai

IPC: B29C45/14 ,  H01B1/20 ,  H01R13/52 ,  H02G5/06 ,  B29L31/34 ,  H01L25/16 ,  H02M7/5387

Abstract: Performed are an accommodation step of accommodating a pair of conductive members in a die, a sealing step of injecting a resin to seal the conductive members, and an extraction step of extracting a conductive member module. In the sealing step, the conductive members are sealed while a force is applied by the resin injected into the die to the individual conductive members in directions away from each other, and the individual conductive members are supported by support members disposed outside.

公开(公告)号：US10321611B2

公开(公告)日：2019-06-11

申请号：US15978507

申请日：2018-05-14

Applicant: DENSO CORPORATION

Inventor： Naoki Hirasawa ,  Ryota Tanabe ,  Taijiro Momose ,  Hiromi Ichijo

IPC: H05K7/20 ,  H02M7/00 ,  H05K7/14 ,  H05K5/02

Abstract: A power conversion apparatus includes a semiconductor module, an electronic component, a cooling member, a casing and a pressurizing member. The electronic component includes a load application part that receives a load caused by pressurizing force on a surface in a pressurizing member side with respect to the lamination direction; a load supporting part that comes into contact with a contact part of the casing on a surface opposite to the pressurizing member side with respect to the lamination direction; and a fastening part fastened to a casing fastening part. The load supporting part is disposed between the load application part and the fastening part; moment of force around the load supporting part is produced in the electronic component by the load applied to the load application part; and the moment causes the electronic component to be pressed towards a pressed part of the casing.

公开(公告)号：US11967867B2

公开(公告)日：2024-04-23

申请号：US17156903

申请日：2021-01-25

Applicant: DENSO CORPORATION

Inventor： Tomohisa Sano ,  Yuki Takahashi ,  Ryota Tanabe ,  Yuta Hashimoto ,  Wataru Funatsu ,  Norihiro Hayashi

IPC: H02K5/20 ,  B60K7/00 ,  H02K1/2791 ,  H02K5/22 ,  H02K7/00 ,  H02K11/33 ,  H02K21/22

CPC classification number: H02K11/33 ,  B60K7/0007 ,  H02K1/2791 ,  H02K5/20 ,  H02K5/203 ,  H02K5/225 ,  H02K7/006 ,  H02K21/22 ,  B60K2007/0092

Abstract: A rotating electric machine includes: a field element that includes a magnet portion that includes a plurality of magnetic poles; an armature that includes an armature winding of multiple phases; and a power converter that is electrically connected to the armature winding.
The rotating electric machine also includes: a plurality of electrical components that configure the power converter; and a housing member that includes a cylindrical portion that is provided on a radially inner side of a magnetic circuit portion that includes the magnet portion and the armature winding, and to which the plurality of electrical components are disposed. The cylindrical portion is provided with a coolant passage through which a coolant flows. The plurality of electrical components are arranged in the housing member on a radially inner side of the cylindrical portion, in a circumferential direction along the cylindrical portion.

公开(公告)号：US11524434B2

公开(公告)日：2022-12-13

申请号：US16866293

申请日：2020-05-04

Applicant: DENSO CORPORATION

Inventor： Akifumi Kurita ,  Yohei Yoshimura ,  Ryota Tanabe

IPC: B29C45/16 ,  B29C45/26

Abstract: A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part for sealing the pair of conductive members. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the sealing step, the conductive members are sealed with a resin injected into a die while a force is applied by the resin to the individual conductive members in directions to approach each other in a facing orientation of the pair of conductive members.

公开(公告)号：US10854589B2

公开(公告)日：2020-12-01

申请号：US16507240

申请日：2019-07-10

Applicant: DENSO CORPORATION

Inventor： Satoru Sugita ,  Ryota Tanabe ,  Shunsuke Arai

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/367 ,  H01L23/473 ,  H01L29/417 ,  H02M7/537

Abstract: A semiconductor device includes a first semiconductor module and a second semiconductor module. The first semiconductor module configures an upper arm, and includes first semiconductor elements connected in parallel to each other, a sealing resin body, and a positive electrode terminal. The second semiconductor module configures a lower arm, and includes second semiconductor elements connected in parallel to each other, a sealing resin body, and a negative electrode terminal. The first and second semiconductor modules are aligned in an alignment direction. At least one of the first and second semiconductor modules has a relay terminal for electrically relaying electrodes on a low potential side of the first semiconductor elements and electrodes on a high potential side of the second semiconductor elements.

公开(公告)号：US10512199B2

公开(公告)日：2019-12-17

申请号：US15695825

申请日：2017-09-05

Applicant: DENSO CORPORATION ,  TOKIN CORPORATION

Inventor： Naoki Hirasawa ,  Ryota Tanabe ,  Takashi Kawashima ,  Takashi Yanbe ,  Masahiro Kondou

IPC: H05K7/20 ,  H01L23/473 ,  B60L15/00

Abstract: A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction.

公开(公告)号：US11685087B2

公开(公告)日：2023-06-27

申请号：US16866373

申请日：2020-05-04

Applicant: DENSO CORPORATION

Inventor： Akifumi Kurita ,  Yohei Yoshimura ,  Ryota Tanabe

IPC: B29C45/14 ,  B29L31/34 ,  H01L25/16 ,  H02M7/5387

CPC classification number: B29C45/14467 ,  B29L2031/34 ,  H01L25/16 ,  H02M7/5387

Abstract: A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the accommodation step, the two individual conductive members are sandwiched in the facing orientation thereof by outer support members abutting outer surfaces of the conductive members, and inner support members abutting inner surfaces of the conductive members. Outer recesses are formed in the outer surfaces by the outer support members, and inner recesses are formed in the inner surfaces by the inner support members. The outer recesses are deeper in the Z direction than the inner recesses.

公开(公告)号：US11660793B2

公开(公告)日：2023-05-30

申请号：US17592830

申请日：2022-02-04

Applicant: DENSO CORPORATION

Inventor： Akifumi Kurita ,  Yohei Yoshimura ,  Ryota Tanabe

IPC: B29C45/16 ,  B29C45/26

CPC classification number: B29C45/2608 ,  B29C45/16 ,  B29C2045/169

Abstract: A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part for sealing the pair of conductive members. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the sealing step, the conductive members are sealed with a resin injected into a die while a force is applied by the resin to the individual conductive members in directions to approach each other in a facing orientation of the pair of conductive members.

公开(公告)号：US11239224B2

公开(公告)日：2022-02-01

申请号：US16785913

申请日：2020-02-10

Applicant: DENSO CORPORATION

Inventor： Kazuma Fukushima ,  Yuu Yamahira ,  Ryota Tanabe ,  Tetsuya Matsuoka ,  Kosuke Kamiya ,  Taijiro Momose

IPC: H05K1/14 ,  H01L25/18 ,  H01L23/50 ,  H02M7/00 ,  H02M3/158 ,  H02M7/5387 ,  H02P27/06

Abstract: A power conversion device provided with a switching circuit unit including a plurality of upper-arm switching elements connected to positive electrode wiring and a plurality of lower-arm switching elements connected to negative electrode wiring. The power conversion device includes a first semiconductor module incorporating a plurality of the upper-arm switching elements connected together in parallel, a second semiconductor module incorporating a plurality of the lower-arm switching elements connected together in parallel, and a third semiconductor module incorporating the upper-arm switching elements connected together in series and the lower-arm switching elements connected together in series.

公开(公告)号：US09735700B2

公开(公告)日：2017-08-15

申请号：US15013503

申请日：2016-02-02

Applicant: DENSO CORPORATION

Inventor： Kazuya Takeuchi ,  Tetsuya Matsuoka ,  Ryota Tanabe

IPC: H05K7/20 ,  H02M7/00

CPC classification number: H02M7/003 ,  H05K7/20263 ,  H05K7/20927

Abstract: A power conversion apparatus includes a capacitor and a heat dissipation member for cooling the capacitor. The capacitor and the heat dissipation member are pressed in an arranging direction in which the capacitor and the heat dissipation member are arranged. The capacitor includes a capacitor element which includes a dielectric body and a metal layer formed on a surface of the dielectric body, an electrode part connected to the metal layer and a bus bar connected to the electrode part. Part of the bus bar is interposed in the arranging direction between the heat dissipation member and the capacitor element.