利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

27 条记录 (耗时 0.022 秒)

    Method of forming an electrical contact
    2.
    发明授权
    Method of forming an electrical contact 有权
    形成电接点的方法

    公开(公告)号：US08966747B2

    公开(公告)日：2015-03-03

    申请号：US13105696

    申请日：2011-05-11

    申请人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Sean Timothy Fleming ,  Rudolph Mutter ,  Andrew T. D'Amico

    发明人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Sean Timothy Fleming ,  Rudolph Mutter ,  Andrew T. D'Amico

    IPC分类号： H05K3/30 ,  H05K7/20 ,  H01R43/24 ,  H05K5/06 ,  B29C45/14 ,  B29C45/00

    CPC分类号： H05K3/284 ,  B23P15/007 ,  B29C45/0055 ,  B29C45/14639 ,  B29C45/1679 ,  B29C2045/0058 ,  B29C2045/169 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/009 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01R43/24 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0065 ,  H05K5/0217 ,  H05K5/0247 ,  H05K5/04 ,  H05K5/064 ,  H05K7/1427 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155

    摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

    摘要翻译： 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。 提供散热鳍片或表面安装可焊接表面。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积 密封剂，间隙通道为互连提供安全机构间距和挫折。 封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。 外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。 互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

    PANEL-MOLDED ELECTRONIC ASSEMBLIES
    8.
    发明申请
    PANEL-MOLDED ELECTRONIC ASSEMBLIES 有权
    面板模制电子组件

    公开(公告)号：US20150181727A1

    公开(公告)日：2015-06-25

    申请号：US14635467

    申请日：2015-03-02

    申请人： VLT, Inc.

    发明人： Patrizio Vinciarelli ,  Michael B. LaFleur ,  Sean Timothy Fleming ,  Rudolph F. Mutter ,  Andrew T. D'Amico

    IPC分类号： H05K5/00 ,  H05K5/02 ,  H05K5/04 ,  B23P15/00 ,  H01F27/28 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H01F27/24 ,  B29C45/16 ,  H05K7/14

    CPC分类号： H05K3/284 ,  B23P15/007 ,  B29C45/0055 ,  B29C45/14639 ,  B29C45/1679 ,  B29C2045/0058 ,  B29C2045/169 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/009 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01R43/24 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0065 ,  H05K5/0217 ,  H05K5/0247 ,  H05K5/04 ,  H05K5/064 ,  H05K7/1427 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155

    摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

    摘要翻译： 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。 提供散热鳍片或表面安装可焊接表面。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积 密封剂，间隙通道为互连提供安全机构间距和挫折。 封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。 外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。 互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

    Methods of producing resin moldings
    9.
    发明授权
    Methods of producing resin moldings 失效
    生产树脂模制品的方法

    公开(公告)号：US06274070B1

    公开(公告)日：2001-08-14

    申请号：US09589068

    申请日：2000-06-08

    申请人： Tsuyoshi Tanigaki ,  Shogo Izawa ,  Akikazu Matsumoto ,  Tadahiko Kohama

    发明人： Tsuyoshi Tanigaki ,  Shogo Izawa ,  Akikazu Matsumoto ,  Tadahiko Kohama

    IPC分类号： B29C4516

    CPC分类号： B29C45/0013 ,  B29C45/16 ,  B29C70/882 ,  B29C2045/169 ,  H01H1/029 ,  H01H2011/0081 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2203/0113

    摘要： Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.

    摘要翻译： 提供对环境几乎没有负面影响的导电树脂组合物，包括导电树脂组合物的导电部分和绝缘部分的树脂模制品及其制备方法。 树脂成型的生产成本低。 导电树脂组合物通过将热塑性或热固性树脂与低熔点合金捏合而形成，其中低熔点合金可与树脂成型并且基本上由锡组成并且不含铅。 通过热塑性或热固性树脂的初级成型形成绝缘体，并通过二次成型与导电性树脂组合物的导电性部分一体化; 或者，通过导电树脂组合物的一次成型形成导电部件，并且通过二次成型与导电部件一体形成绝缘体。

    Resin compositions, resin moldings and their methods of production
    10.
    发明授权
    Resin compositions, resin moldings and their methods of production 有权
    树脂组合物，树脂模制品及其生产方法

    公开(公告)号：US6096245A

    公开(公告)日：2000-08-01

    申请号：US131337

    申请日：1998-08-07

    申请人： Tsuyoshi Tanigaki ,  Shogo Izawa ,  Akikazu Matsumoto ,  Tadahiko Kohama

    发明人： Tsuyoshi Tanigaki ,  Shogo Izawa ,  Akikazu Matsumoto ,  Tadahiko Kohama

    IPC分类号： B29C45/00 ,  B29C45/16 ,  C08K3/08 ,  H01B1/22 ,  H01H1/029 ,  H05K1/09 ,  H05K3/18 ,  H01B1/02

    CPC分类号： H05K3/182 ,  B29C45/0013 ,  B29C45/16 ,  C08K3/08 ,  H01B1/22 ,  H01H1/029 ,  B29C2045/169 ,  H01H2011/0081 ,  H05K1/095 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/24802 ,  Y10T428/24909

    摘要： Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.

    摘要翻译： 提供对环境几乎没有负面影响的导电树脂组合物，包括导电树脂组合物的导电部分和绝缘部分的树脂模制品及其制备方法。 树脂成型的生产成本低。 导电树脂组合物通过将热塑性或热固性树脂与低熔点合金捏合而形成，其中低熔点合金可与树脂成型并且基本上由锡组成并且不含铅。 通过热塑性或热固性树脂的初级成型形成绝缘体，并通过二次成型与导电性树脂组合物的导电性部分一体化; 或者，通过导电树脂组合物的一次成型形成导电部件，并且通过二次成型与导电部件一体形成绝缘体。