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公开(公告)号：US20230348679A1
公开(公告)日：2023-11-02
申请号：US18025687
申请日：2021-08-06
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke ARAMAKI , Yuma SATO , Yusuke KUBO
CPC classification number: C08J5/18 , C08K7/18 , C08K9/02 , C08J2383/04 , C08K2201/001 , C08K2201/013
Abstract: A thermally conductive sheet includes: a binder resin; and a first thermally conductive filler oriented in a thickness direction of the thermally conductive sheet. The thermally conductive sheet has a contact thermal resistance with regard to an adherend of 0.46° C.·cm2/W or less. The first thermally conductive filler is preferably a fibrous thermally conductive filler and/or a flaky thermally conductive filler. The thermally conductive sheet preferably further includes a second thermally conductive filler which is at least one selected from a group consisting of alumina, aluminum, zinc oxide, boron nitride, aluminum nitride, graphite, and a magnetic powder.
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Patent Agency Ranking
公开(公告)号：US20220262702A1
公开(公告)日：2022-08-18
申请号：US17617238
申请日：2021-04-23
Applicant: DEXERIALS CORPORATION
Inventor： Yuma SATO , Keisuke ARAMAKI , Yusuke KUBO
Abstract: A thermally conductive sheet having a binder resin, a first thermally conductive filler, and a second thermally conductive filler, wherein the first thermally conductive filler and the second thermally conductive filler are dispersed in the binder resin, and the specific permittivity and the thermal conductivity are different in the thickness direction B and the surface direction A of the thermally conductive sheet. A thermally conductive sheet includes step A of preparing a resin composition for forming a thermally conductive sheet by dispersing a first thermally conductive filler and a second thermally conductive filler in a binder resin, step B of forming a molded block from the resin composition for forming a thermally conductive sheet, and step C of slicing the molded block into a sheet and obtaining a thermally conductive sheet having different relative permittivity and thermal conductivity in the thickness direction and the surface direction.
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公开(公告)号：US20240117148A1
公开(公告)日：2024-04-11
申请号：US18275450
申请日：2022-01-28
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke ARAMAKI , Yuma SATO , Yusuke KUBO
IPC: C08K3/38 , C08L101/00
CPC classification number: C08K3/38 , C08L101/00 , C08K2003/385 , C08K2201/001 , C08L2203/20
Abstract: A thermally conductive sheet includes a binder resin and boron nitride flakes. The boron nitride flakes are oriented in a thickness direction of the thermally conductive sheet, and both surfaces of the thermally conductive sheet are tacky. A method for manufacturing a thermally conductive sheet includes preparing a thermally conductive composition containing a binder resin and boron nitride flakes. A molded block is formed from the thermally conductive composition. The molded block is sliced into a sheet shape to obtain a thermally conductive sheet precursor. The thermally conductive sheet precursor is pressed to obtain a thermally conductive sheet.
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公开(公告)号：US20240262979A1
公开(公告)日：2024-08-08
申请号：US18567857
申请日：2022-06-08
Applicant: DEXERIALS CORPORATION
Inventor： Yuma SATO , Yusuke KUBO
CPC classification number: C08K3/38 , C08J5/18 , C08K7/04 , C08L83/04 , C08K2003/385 , C08K2201/001 , C08L2203/206
Abstract: A thermally conductive sheet including: a cured material of a composition including: a binder resin, an anisotropically thermally conductive filler, and an additional thermally conductive filler other than the anisotropically thermally conductive filler. The thermally conductive sheet satisfies condition 1: a tack force of the thermally conductive sheet is 80 gf or higher; and condition 2: a bleed amount of the binder resin is 0.20 g or less after the thermally conductive sheet, which has a size of 25 mm×25 mm and a thickness of 1 mm, is left standing for 48 hours at 125° C. in a state of being compressed by 40%.
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公开(公告)号：US20240120254A1
公开(公告)日：2024-04-11
申请号：US18276509
申请日：2022-02-09
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke ARAMAKI , Yuma SATO , Yusuke KUBO
IPC: H01L23/373 , H01L23/00 , H01L23/367
CPC classification number: H01L23/3737 , H01L23/3672 , H01L24/32 , H01L2224/29291 , H01L2224/29318 , H01L2224/29324 , H01L2224/29386 , H01L2224/29393 , H01L2224/29399 , H01L2224/32245 , H01L2924/05032 , H01L2924/05432
Abstract: A thermally-conductive sheet includes: a binder; and an anisotropic thermally-conductive filler. The anisotropic thermally-conductive filler is oriented in a thickness direction of the thermally-conductive sheet An arithmetical mean height Sa is 5 μm or less and a maximum height Sz is 50 μm or less on either surface of the thermally-conductive sheet. A dielectric breakdown voltage of the thermally-conductive sheet is 0.5 kV/mm or higher.
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公开(公告)号：US20240010898A1
公开(公告)日：2024-01-11
申请号：US18021595
申请日：2021-08-03
Applicant: DEXERIALS CORPORATION
Inventor： Yuma SATO , Keisuke ARAMAKI , Yusuke KUBO
CPC classification number: C09K5/14 , C08K7/00 , C08L83/04 , C08K2201/001
Abstract: Provided is a thermally conductive sheet which is highly flexible and of which the thermal resistance value has small load dependency. A thermally conductive sheet 1 contains a curable resin composition 2, a flaky thermally conductive filler 3, and a non-flaky thermally conductive filler 4, wherein the amount of change between the thermal resistance value at load of 1 kgf/cm2 and the thermal resistance value at load in a range greater than 1 kgf/cm2 and not greater than 3 kgf/cm2 is not greater than 0.4° C.·cm2/W, and the amount of change between the compression rate at load of 3 kgf/cm2 and the compression rate at load of 1 kgf/cm2 is not less than 20%.
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