Abstract:
A lapping slurry and method of making the lapping slurry are provided. The lapping slurry comprises abrasive grains dispersed in a carrier. The carrier comprises water, ethylene glycol and between about 0.5 wt % to about 60 wt % surfactant. Abrasive particles are positively charged when dispersed in ethylene glycol having a pH in a range of from 5 to 9, as evidenced by zeta potentials.
Abstract:
A superabrasive material and method of making the superabrasive material are provided. The superabrasive material may comprise a superabrasive crystal having an irregular surface. The superabrasive material further comprises a plurality of structure defects within the superabrasive crystal. The plurality of structure defects may cause micro-chipping when used as grinding materials.
Abstract:
A superabrasive material and method of making the superabrasive material are provided. The superabrasive material may comprise a superabrasive crystal having an irregular surface. The superabrasive material further comprises a plurality of structure defects within the superabrasive crystal. The plurality of structure defects may cause micro-chipping when used as grinding materials.
Abstract:
A lapping slurry and method of making the lapping slurry are provided. The lapping slurry comprises abrasive grains dispersed in a carrier. The carrier comprises water, ethylene glycol and between about 0.5 wt % to about 60 wt % surfactant. Abrasive particles are positively charged when dispersed in ethylene glycol having a pH in a range of from 5 to 9, as evidenced by zeta potentials.