公开(公告)号：US20200299573A1

公开(公告)日：2020-09-24

申请号：US16086108

申请日：2016-03-30

Applicant: Dow Global Technologies LLC

Inventor： Bo Lv ,  Xiuyan Wang ,  Yan Huang ,  Xiaofan Ren ,  Jake Joo ,  Ping Zhu

IPC: C09K11/02 ,  C09K11/88 ,  C09K11/08 ,  C08G77/02 ,  C08K9/02 ,  C08K3/32

Abstract: A method of preparing a semiconductor nanocrystal-silicate composite without significantly reducing the quantum yield of the semiconductor nanocrystal, a composite prepared from the method, and a film and an electronic device comprising the composite.

公开(公告)号：US10424682B2

公开(公告)日：2019-09-24

申请号：US15032168

申请日：2013-11-04

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Company

Inventor： John A. Naumovitz ,  Hongyu Chen ,  Yan Huang ,  Ada Yu Zhang ,  Zhi Xu

IPC: H01L31/055 ,  B32B27/08 ,  C09K11/06 ,  H01L31/048 ,  C09K11/02 ,  B32B27/18 ,  B32B27/32 ,  B32B27/20 ,  B32B27/30 ,  H01L31/0296 ,  H01L31/032

Abstract: A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.

公开(公告)号：US20180355189A1

公开(公告)日：2018-12-13

申请号：US16060085

申请日：2015-12-30

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Company

Inventor： Yan Huang ,  Hongyu Chen ,  Xinyu Cao ,  Yu Zhang ,  Paul J. Popa ,  Yuteng Lin ,  John A. Roper ,  Gerald A. Vandezande

IPC: C09D5/16 ,  C09D163/00 ,  C08G59/56 ,  C08G59/66 ,  C08G77/26

CPC classification number: C09D5/1675 ,  C08G59/1494 ,  C08G59/504 ,  C08G59/56 ,  C08G59/66 ,  C08G77/26 ,  C09D5/16 ,  C09D5/1637 ,  C09D7/63 ,  C09D7/65 ,  C09D163/00

Abstract: Curable coating compositions for preventing biofouling include a) at least one epoxy resin; b) at least one amine-functional poly(dialkylsiloxane) polymer in an amount from 1 to 70% based on the combined weights of components a) and b); and c) at least one alkylene polyamine, polyalkylene polyamine or polymercaptan epoxy curing agent; wherein components b) and c) together provide about 0.75 to 1.5 equivalents of amine nitrogen atoms and/or thiol groups per equivalent of epoxy groups provided by component a). When cured to form an antifouling coating, the coating exhibits a water contact angle of at least 100° as measured using an optical contact angle meter at 22° C. The coating composition adheres well to many substrates, provides good anticorrosion protection and is an effective anti-biofouling measure.

公开(公告)号：US20160326339A1

公开(公告)日：2016-11-10

申请号：US15108794

申请日：2013-12-30

Applicant: DOW GLOBAL TECHNOLOGIES LLC ,  ROHM AND HASS COMPANY

Inventor： Wei Liu ,  Xiaomel Song ,  Hongyu Chen ,  Yan Huang ,  Yu Zhang

IPC: C08K3/28 ,  H01L23/373 ,  H01L33/64 ,  C08K5/435 ,  C08K3/22

CPC classification number: C08K3/28 ,  C08G59/245 ,  C08G59/5033 ,  C08K3/22 ,  C08K5/435 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005 ,  C08L63/00 ,  H01L23/3737 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0075 ,  H01L2924/00

Abstract: An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150° C. or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.

Abstract translation: 一种具有位于心脏源附近的热源和电绝缘热管理部件的物品。 热处理成分含有由含有（a）二缩水甘油基化合物的组合物形成的固化的热固性物质，其具有介晶结构，二缩水甘油基化合物的熔点为150℃以下，（b）固化剂和（c）无机填料 具有特定的导热性。 固化的热固性材料具有高导热性。

公开(公告)号：US20160260857A1

公开(公告)日：2016-09-08

申请号：US15032168

申请日：2013-11-04

Applicant: DOW GLOBAL TECHNOLOGIES LLC ,  ROHM AND HAAS COMPANY

Inventor： John A. Naumovitz ,  Hongyu Chen ,  Yan Huang ,  Ada Yu Zhang ,  Zhi Xu

IPC: H01L31/055 ,  B32B27/20 ,  H01L31/0296 ,  B32B27/30 ,  H01L31/048 ,  H01L31/032 ,  B32B27/08 ,  B32B27/32

Abstract: A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.

Abstract translation: 具有至少两层的多层包封膜包括包含密封剂树脂的第一层和包含密封剂树脂和至少一种下转换器如稀土有机金属络合物的第二层。 下转换器可以以基于密封剂膜的总重量的至少0.0001重量％的量存在。 多层密封剂膜的其它层可以包括或可以不包括下变频器。 优选地，多层密封剂膜包含至少一个具有至少一个下变换器的层和至少一个没有下变频器的层。 这种多层下转换膜可以用于诸如PV模块的电子设备中。

公开(公告)号：US09908988B2

公开(公告)日：2018-03-06

申请号：US15108794

申请日：2013-12-30

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Company

Inventor： Wei Liu ,  Xiaomei Song ,  Hongyu Chen ,  Yan Huang ,  Yu Zhang

IPC: C08K3/28 ,  C08L63/00 ,  H01L33/64 ,  H01L23/373 ,  C08K3/22 ,  C08K5/435 ,  C08G59/24 ,  C08G59/50

CPC classification number: C08K3/28 ,  C08G59/245 ,  C08G59/5033 ,  C08K3/22 ,  C08K5/435 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005 ,  C08L63/00 ,  H01L23/3737 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0075 ,  H01L2924/00

Abstract: An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150° C. or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.

公开(公告)号：US11370967B2

公开(公告)日：2022-06-28

申请号：US16340483

申请日：2016-10-14

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Yang Li ,  Xiuyan Wang ,  Yan Huang ,  Xiaofan Ren ,  Bo Lv

IPC: C09K11/06 ,  G02F1/13357 ,  H01L51/00

Abstract: A light emitting apparatus affording high quality colors and energy economy and an electronic device comprising the light emitting apparatus.

公开(公告)号：US20170130056A1

公开(公告)日：2017-05-11

申请号：US15317987

申请日：2014-07-04

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Company

Inventor： Tong Sun ,  Yang Liu ,  Yan Huang ,  Tao Wang

IPC: C09C3/04 ,  C09C3/10 ,  C09D7/12 ,  C09D133/12

CPC classification number: C09C3/043 ,  C08K9/08 ,  C09C3/10 ,  C09D7/61 ,  C09D133/12

Abstract: The present invention provides spray-dried powders comprising from 0.1% to 25% a hydrophobic polymer, from 75% to 99.9% inorganic particles, and less than 3% a dispersant. The Tg of the hydrophobic polymer is less than 105° C., the average particle size of the inorganic particles is from 5 nm to 100 um, and the average particle size of the spray-dried powders is from 1 um to 400 um. The hydrophobic polymer comprises, as polymerization units, an ethylenically unsaturated nonionic monomer. The present invention further provides a process for the preparation of the spray-dried powders comprising (a) preparing a solution comprising the hydrophobic polymer, the inorganic particles, and the dispersant; and (b) adding the solution into a spray dryer and preparing the spray-dried powders.