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13 条记录 (耗时 0.035 秒)

    Signal transmission and reception system
    1.
    发明授权
    Signal transmission and reception system 失效
    信号发射和接收系统

    公开(公告)号：US4633511A

    公开(公告)日：1986-12-30

    申请号：US643834

    申请日：1984-08-23

    申请人： Daisuke Koga ,  Masahide Tamura ,  Yukio Naito

    发明人： Daisuke Koga ,  Masahide Tamura ,  Yukio Naito

    IPC分类号： H04B1/40 ,  H04B1/50

    CPC分类号： H04B1/50 ,  H04B1/408

    摘要： A duplex transmission and reception system wherein a local oscillator of the receiver is dispensed with by using the output of a modulated transmission oscillator, with its modulation cancelled, in lieu of a receiver local oscillator. The transmitter modulation signal is adjusted by appropriate level correction and phase inversion. The modulated output of the transmission oscillator is itself applied to a modulator, where it is modulated by the adjusted modulation signal. This results in substantially cancelling out the modulation component of the transmission oscillator output. This modulation-cancelled signal is supplied to the mixer of a superheterodyne receiver as a local oscillator signal.

    摘要翻译： 一种双工发送和接收系统，其中通过使用调制的发送振荡器的输出来取消接收机的本地振荡器，其调制被取消，代替接收机本地振荡器。 通过适当的电平校正和相位反转调整发射机调制信号。 传输振荡器的调制输出本身被应用于调制器，在调制器中调制输出被调制后的调制信号调制。 这导致基本上消除了发送振荡器输出的调制分量。 该调制解除信号作为本地振荡器信号提供给超外差接收机的混频器。

    Polishing apparatus
    2.
    发明申请
    Polishing apparatus 有权
    抛光设备

    公开(公告)号：US20050159082A1

    公开(公告)日：2005-07-21

    申请号：US11078495

    申请日：2005-03-14

    申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

    发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

    IPC分类号： B24B37/04 ,  H01L21/306 ,  B24B49/00

    CPC分类号： B24B37/345 ,  B24B37/042 ,  H01L21/30625

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

    摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构 在至少三个清洁装置之间。 抛光装置还包括旋转输送器，其设置在可由所述顶环接近的位置，并且具有从旋转运送器的旋转中心定位在预定圆周上的多个部分，用于保持工件。

    Substrate delivery mechanism
    5.
    发明授权
    Substrate delivery mechanism 失效
    基材输送机制

    公开(公告)号：US07645185B2

    公开(公告)日：2010-01-12

    申请号：US11826628

    申请日：2007-07-17

    申请人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

    发明人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

    IPC分类号： B24B7/00

    CPC分类号： B24B37/345 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/6838 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68792

    摘要： A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

    摘要翻译： 衬底传送机构包括顶环，用于装载衬底的衬底装载器和推动器机构，其中衬底装载器包括顶环引导件，并且推动器机构包括顶环引导升降台，顶环导向器和 顶部环形引导升降台在由基座装载机由推动机构向上移动的状态下由顶环保持的基板下方形成密封空间，其中基板通过在顶部环上排出密封空间而脱离，同时在 同时从设置在顶环的基板保持面的通孔注入流体。

    Substrate delivery mechanism
    10.
    发明授权
    Substrate delivery mechanism 失效
    基材输送机制

    公开(公告)号：US07160180B2

    公开(公告)日：2007-01-09

    申请号：US11418145

    申请日：2006-05-05

    申请人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

    发明人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

    IPC分类号： B24B7/22

    CPC分类号： B24B37/345 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/6838 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68792

    摘要： A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

    摘要翻译： 衬底传送机构包括顶环，用于装载衬底的衬底装载器和推动器机构，其中衬底装载器包括顶环引导件，并且推动器机构包括顶环引导升降台，顶环导向器和 顶部环形引导升降台在由基座装载机由推动机构向上移动的状态下由顶环保持的基板下方形成密封空间，其中，基板通过排出密封空间而与顶环分离，同时在 同时从设置在顶环的基板保持面的通孔注入流体。