公开(公告)号：US09978707B1

公开(公告)日：2018-05-22

申请号：US15467659

申请日：2017-03-23

Applicant: Delphi Technologies, Inc.

Inventor： David W. Zimmerman ,  Michael J. Pepples ,  David W. Ihms

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/66

CPC classification number: H01L24/17 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/06 ,  H01L24/32 ,  H01L24/73 ,  H01L2223/6605 ,  H01L2223/6683 ,  H01L2224/16227 ,  H01L2224/30179 ,  H01L2224/32227 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/1423 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/093 ,  H05K2201/10166

Abstract: A circuit-board-assembly includes a printed-circuit-board, an integrated-circuit-die, a ball-grid-array, a barrier-material, and an adhesive-material. The printed-circuit-board includes a mounting-surface that defines a plurality of contact-pads and a continuous-trace that interconnects a selected-group of the contact-pads. The integrated-circuit-die includes an electrical-circuit having a plurality of solder-pads. The ball-grid-array includes a plurality of solder-balls interposed between the contact-pads and the solder-pads. The plurality of solder-balls establish electrical communication between the electrical-circuit and the contact-pads. The barrier-material is located between a string of solder-balls that are attached to the selected-group of the contact-pads to create a barrier. The barrier segregates an underfill-region from a non-underfill-region between the printed-circuit-board and the integrated-circuit-die. The barrier is in direct-contact with the string of the solder-balls, the integrated-circuit-die, and the continuous-trace. The adhesive-material is in direct contact with a portion of the underfill-region and the barrier prevents the adhesive-material from encroaching upon the non-underfill-region.

公开(公告)号：US20180108968A1

公开(公告)日：2018-04-19

申请号：US15292824

申请日：2016-10-13

Applicant: Delphi Technologies, Inc.

Inventor： George J. Purden ,  Shawn Shi ,  David W. Zimmerman

IPC: H01P3/10 ,  H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01P5/08 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/16 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16227 ,  H01P3/10 ,  H01P3/121 ,  H01P5/107 ,  H05K1/0219 ,  H05K1/111 ,  H05K1/115

Abstract: A ball-grid-array printed-circuit-board assembly includes a die, a plurality of solder-balls, a substrate, a top-metal layer, and a bottom-metal layer. The die includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad. The top-metal layer, a plurality of vias in the substrate, and the bottom-metal layer cooperate to form a substrate-integrated-waveguide. The top-metal layer is configured to define a U-shaped-slot between a signal-portion of the top-metal layer aligned with the signal-out-pad and the substrate-integrated-waveguide, and a ground-portion of the top-metal layer aligned with the plurality of ground-pads. The U-shaped-slot is characterized by a slot-length that is selected based on the frequency of a signal, and a slot-width that is selected based on the via-height such that the signal generates an electric field directed across the U-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer into the substrate-integrated-waveguide.