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公开(公告)号:US11538674B2
公开(公告)日:2022-12-27
申请号:US16950703
申请日:2020-11-17
Applicant: Duke University
Inventor: Geert Vrijsen , Jungsang Kim , Robert Spivey , Ismail Inlek , Yuhi Aikyo
Abstract: Systems and methods for loading microfabricated ion traps are disclosed. Photo-ablation via an ablation pulse is used to generate a flow of atoms from a source material, where the flow is predominantly populated with neutral atoms. As the neutral atoms flow toward the ion trap, two-photon photo-ionization is used to selectively ionize a specific isotope contained in the atom flow. The velocity of the liberated atoms, atom-generation rate, and/or heat load of the source material is controlled by controlling the fluence of the ablation pulse to provide high ion-trapping probability while simultaneously mitigating generation of heat in the ion-trapping system that can preclude cryogenic operation. In some embodiments, the source material is held within an ablation oven comprising an electrically conductive housing that is configured to restrict the flow of agglomerated neutral atoms generated during photo-ablation toward the ion trap.
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公开(公告)号:US12142473B2
公开(公告)日:2024-11-12
申请号:US18223246
申请日:2023-07-18
Applicant: Duke University
Inventor: Jungsang Kim , Kai Hudek , Geert Vrijsen , Robert Spivey , Peter Maunz
Abstract: A package-level, integrated high-vacuum ion-chip enclosure having improved thermal characteristics is disclosed. Enclosures in accordance with the present invention include first and second chambers that are located on opposite sides of a chip carrier, where the chambers are fluidically coupled via a conduit through the chip carrier. The ion trap is located in the first chamber and disposed on the chip carrier. A source for generating an atomic flux is located in the second chamber. The separation of the source and ion trap in different chambers affords thermal isolation between them, while the conduit between the chambers enables the ion trap to receive the atomic flux.
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公开(公告)号:US11749518B2
公开(公告)日:2023-09-05
申请号:US16913932
申请日:2020-06-26
Applicant: Duke University
Inventor: Jungsang Kim , Kai Hudek , Geert Vrijsen , Robert Spivey , Peter Maunz
CPC classification number: H01J49/422 , G06N10/00 , H01J49/16 , H01J49/24 , H01J49/42
Abstract: A package-level, integrated high-vacuum ion-chip enclosure having improved thermal characteristics is disclosed. Enclosures in accordance with the present invention include first and second chambers that are located on opposite sides of a chip carrier, where the chambers are fluidically coupled via a conduit through the chip carrier. The ion trap is located in the first chamber and disposed on the chip carrier. A source for generating an atomic flux is located in the second chamber. The separation of the source and ion trap in different chambers affords thermal isolation between them, while the conduit between the chambers enables the ion trap to receive the atomic flux.
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公开(公告)号:US20230037882A1
公开(公告)日:2023-02-09
申请号:US17883062
申请日:2022-08-08
Applicant: Duke University
Inventor: Robert Spivey , Kai Hedek , Ismail Inlek , Jungsang Kim , Zhubing Jia
IPC: G02B7/00
Abstract: Technologies for an optomechanical system include an intermediate plate having a top surface with multiple tapped holes arranged in a grid. A pair of dowel pin holes surround each tapped hole in a linear pattern. Multiple optical blocks are coupled to the intermediate plate using dowel pins positioned in the dowel pin holes and corresponding dowel pin holes defined in the bottom surface of the optical block. Each optical block includes multiple optical elements coupled to the top surface of the optical block with dowel pins. A cryostat may be coupled to the intermediate plate. A cryo-package assembly is mounted inside a cryo chamber of the cryostat. The cryo-package assembly includes a cryo device such as an ion trap covered by a machined copper lid. The lid includes a meandering passageway to allow for differential pumping in order to achieve ultra-high vacuum within the cryo-package assembly.
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公开(公告)号:US10923335B2
公开(公告)日:2021-02-16
申请号:US16357488
申请日:2019-03-19
Applicant: Duke University
Inventor: Geert Vrijsen , Jungsang Kim , Robert Spivey , Ismail Inlek , Yuhi Aikyo
Abstract: Systems and methods for loading microfabricated ion traps are disclosed. Photo-ablation via an ablation pulse is used to generate a flow of atoms from a source material, where the flow is predominantly populated with neutral atoms. As the neutral atoms flow toward the ion trap, two-photon photo-ionization is used to selectively ionize a specific isotope contained in the atom flow. The velocity of the liberated atoms, atom-generation rate, and/or heat load of the source material is controlled by controlling the fluence of the ablation pulse to provide high ion-trapping probability while simultaneously mitigating generation of heat in the ion-trapping system that can preclude cryogenic operation. In some embodiments, the source material is held within an ablation oven comprising an electrically conductive housing that is configured to restrict the flow of agglomerated neutral atoms generated during photo-ablation toward the ion trap.
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公开(公告)号:US10755913B2
公开(公告)日:2020-08-25
申请号:US15935312
申请日:2018-03-26
Applicant: Duke University
Inventor: Jungsang Kim , Kai Hudek , Geert Vrijsen , Robert Spivey , Peter Maunz
Abstract: A package-level, integrated high-vacuum ion-chip enclosure having improved thermal characteristics is disclosed. Enclosures in accordance with the present invention include first and second chambers that are located on opposite sides of a chip carrier, where the chambers are fluidically coupled via a conduit through the chip carrier. The ion trap is located in the first chamber and disposed on the chip carrier. A source for generating an atomic flux is located in the second chamber. The separation of the source and ion trap in different chambers affords thermal isolation between them, while the conduit between the chambers enables the ion trap to receive the atomic flux.
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