公开(公告)号：US12263535B2

公开(公告)日：2025-04-01

申请号：US17272611

申请日：2019-10-15

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Corie Neufeld ,  Jeremy Willey ,  Brandon Bilyeu ,  Wayne Crowther ,  Chris Ryder

IPC: B23K26/12 ,  B23K26/08 ,  B23K26/142 ,  B23K26/70 ,  B23K37/00 ,  B23K37/006

Abstract: A frame for a laser processing module can be characterized as including a platform having an upper surface and a lower surface, an optics bridge spaced apart from, and extending over, the upper surface of the platform and a bridge support interposed between, and coupled to, the platform and the optics bridge. At least one selected from the group consisting of the platform and the optics bridge includes a sandwich panel. The sandwich panel can include a first plate, a second plate and a core interposed between the first plate and the second plate. The first plate and the second plate can be indirectly attached to one another by the core and the core can define at least one channel extending between the first plate and the second plate. The sandwich panel can also include a first port formed at an exterior of the sandwich panel and in fluid communication with the at least one channel, and a second port formed at the exterior of the sandwich panel and in fluid communication with the at least one channel.

公开(公告)号：US20210346985A1

公开(公告)日：2021-11-11

申请号：US17272611

申请日：2019-10-15

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Corie Neufeld ,  Jeremy Willey ,  Brandon Bilyeu ,  Wayne Crowther ,  Chris Ryder

IPC: B23K26/12 ,  B23K26/70 ,  B23K37/00

Abstract: A frame for a laser processing module can be characterized as including a platform having an upper surface and a lower surface, an optics bridge spaced apart from, and extending over, the upper surface of the platform and a bridge support interposed between, and coupled to, the platform and the optics bridge. At least one selected from the group consisting of the platform and the optics bridge includes a sandwich panel. The sandwich panel can include a first plate, a second plate and a core interposed between the first plate and the second plate. The first plate and the second plate can be indirectly attached to one another by the core and the core can define at least one channel extending between the first plate and the second plate. The sandwich panel can also include a first port formed at an exterior of the sandwich panel and in fluid communication with the at least one channel, and a second port formed at the exterior of the sandwich panel and in fluid communication with the at least one channel.

公开(公告)号：US20190001442A1

公开(公告)日：2019-01-03

申请号：US15750140

申请日：2016-09-08

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Mark Unrath ,  Chuan Yang ,  Jan Kleinert ,  Mark Peeples ,  Hugh Owens ,  Gwendolyn Byrne ,  Haibin Zhang ,  Justin Redd ,  Corie Neufeld ,  James D. Brookhyser ,  Yasu Osako ,  Mehmet Alpay ,  Zhibin Lin ,  Patrick Riechel ,  Tim Nuckolls ,  Hisashi Matsumoto ,  Chris Ryder

IPC: B23K26/382 ,  B23K26/082 ,  B23K26/70 ,  B23K26/0622

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.