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公开(公告)号：US20250076601A1
公开(公告)日：2025-03-06
申请号：US18765891
申请日：2024-07-08
Inventor： Won-Bae KWON , Eun Kyu KANG , Jong Jin LEE , Soo Yong JUNG , Haechung KANG , Myunghwan KIM , Dae Woong MOON , Gye Sul CHO
Abstract: An optical receiving module assembly is provided. The optical receiving module assembly includes an electric sub-assembly including a printed circuit board (PCB) including an opening portion and an electronic device mounted on the PCB and an optical receiving module including a first optical component mounted on the PCB and a second optical component mounted on the mount which includes a transparent material and is disposed in the opening portion, wherein the electronic device and the second optical component are electrically connected to each other by a mount electrode formed on a surface of the mount.
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公开(公告)号：US20240106540A1
公开(公告)日：2024-03-28
申请号：US18328845
申请日：2023-06-05
Inventor： Eun Kyu KANG , Jong Jin LEE
CPC classification number: H04B10/40 , H05K1/118 , H05K2201/10121
Abstract: An optical transceiver is provided. A transceiver optical sub-assembly included in the optical transceiver includes a package body, accommodating optical devices and including a front surface coupled to an optical signal terminal, and a feed-through structure closing a rear surface of the package body and an open portion provided at both side surfaces adjacent to the rear surface. A disposition portion where one end of a flexible printed circuit board (FPCB) is disposed is provided at a front surface of the feed-through structure. Feed-through electrodes bonded to FPCB electrodes provided at the one end of the FPCB are provided on a surface of the disposition portion. For precise alignment of the FPCB electrodes and the feed-through electrodes, a protrusion portion is provided at the one end of the FPCB, and an insertion groove into which the protrusion portion is inserted is formed in a front surface of the feed-through structure.
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公开(公告)号：US20190041590A1
公开(公告)日：2019-02-07
申请号：US16042969
申请日：2018-07-23
Inventor： Soo Yong JUNG , Jong Jin LEE , Eun Kyu KANG , Won Bae KWON , Jeong Eun KIM
IPC: G02B6/42
CPC classification number: G02B6/4244 , G02B6/42 , G02B6/4204 , G02B6/4239 , G02B6/424 , G02B6/4245
Abstract: Provided are an optical module platform structure and a method of manufacturing the same. The optical module platform structure includes an optical module platform substrate, a light source device mounted on a light source mount attached on one upper side of the optical module platform substrate, a waveguide spaced apart from the light source device by a certain interval and mounted on a waveguide mount attached on the optical module platform substrate, a lens mount fixed between the light source mount and the waveguide mount, and a lens fixed to a top of the lens mount. Therefore, optical coupling efficiency between a light source and a waveguide is maximized by applying a lens mount, and an optical alignment error is minimized.
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公开(公告)号：US20170242208A1
公开(公告)日：2017-08-24
申请号：US15210476
申请日：2016-07-14
Inventor： Jong Jin LEE , Kwon-Seob LIM , Dae Seon KIM , Sun-Goo LEE
IPC: G02B6/42
CPC classification number: G02B6/4244 , G02B6/4204 , G02B6/4239 , G02B6/424 , G02B6/4245 , G02B6/425
Abstract: There is provided an optical module. The optical module includes a light source, a wave guide to which beam output from the light source is input, a lens system configured to optically combining the light source and the wave guide, a first lens mount positioned between the light source and the lens system in an optical axis of the light source, a first adhesive configured to fix the lens system to the first lens mount, a second lens mount positioned between the wave guide and the lens system in the optical axis of the light source, and a second adhesive configured to fix the lens system to the second lens mount. Therefore, it is possible to precisely align light, to manufacture the optical module with small expenses, and to simplify processes and equipment.
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公开(公告)号：US20160209609A1
公开(公告)日：2016-07-21
申请号：US14835134
申请日：2015-08-25
Inventor： Jong Jin LEE
CPC classification number: G02B6/4274 , G02B6/4245 , G02B6/4249 , G02B6/428 , G02B6/4281
Abstract: An optical module includes: a circuit board having a surface in which an electronic element is mounted; an optical waveguide array in which a plurality of optical waveguides are formed; an optical element in which an optical signal that is transmitted and received from and to the optical waveguide is input and that is mounted at a side surface of the circuit board; and a connection member that connects the optical element and the electronic element, wherein a connection portion of a side surface of the circuit board in which the connection member is received has a curved shape.
Abstract translation: 光学模块包括：具有安装有电子元件的表面的电路板; 形成多个光波导的光波导阵列; 其中输入从光波导传送和接收的光信号并安装在电路板的侧表面的光学元件; 以及连接所述光学元件和所述电子元件的连接部件，其中，所述电路基板的侧面的与所述连接部件接合的连接部具有弯曲形状。
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Patent Agency Ranking
公开(公告)号：US20220094138A1
公开(公告)日：2022-03-24
申请号：US17479496
申请日：2021-09-20
Inventor： Eun Kyu KANG , Jong Jin LEE , Dae Seon KIM , Eun Kyoung JEON , Sang Jin KWON , Won Bae KWON , Kwon Seob LIM , Soo Yong JUNG
IPC: H01S5/024 , G02B27/28 , H01S5/02257 , H01S5/02253 , H01S5/02255 , H04J14/02 , H04B10/40
Abstract: A structure and a manufacturing method of an optical transmission module, in which output light of each of a first optical transmission unit and a second optical transmission unit is combined into one and transmitted through an optical fiber. In order to manufacture the optical transmission module, the first optical transmission unit and the second optical transmission unit are separately manufactured using a wafer-level packaging process and then are stacked. As a result, emission of generated heat is divided into a first heat sink installed in the first optical transmission unit and a second heat sink installed in the second optical transmission unit so that better heat dissipation efficiency is achieved than a conventional optical transmission module. In addition, a mounting area may also be reduced to ½ of the conventional module.
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公开(公告)号：US20210125975A1
公开(公告)日：2021-04-29
申请号：US17081536
申请日：2020-10-27
Inventor： Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Soo Yong JUNG
Abstract: Provided is a cooled optical transmission module device including a silicon wafer having a plurality of platform mounting grooves, each of which serves as a space for mounting in which an optical transmission platform therein, a thermoelectric cooler bonded to the platform mounting groove to transfer heat to outside, the optical transmission platform provided on the thermoelectric cooler and configured to output an optical signal by generating and reflecting the optical signal, a dielectric sub-mount bonded to the platform mounting groove of the silicon wafer and electrically connected to the mounted optical transmission platform, and a cover configured to cover the platform mounting groove of the silicon wafer and seal the platform mounting groove while providing an electric path.
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公开(公告)号：US20180302636A1
公开(公告)日：2018-10-18
申请号：US15882352
申请日：2018-01-29
Inventor： Hong Yeon YU , Dae Seon KIM , Kwon-Seob LIM , Eun Kyoung JEON , Jong Jin LEE
Abstract: A method of mixing video bitstreams and an apparatus performing the method are disclosed. The method includes generating a mixed scalable video coding (SVC) bitstream by mixing a plurality of SVC bitstreams for each layer based on a screen configuration of a user device, extracting a single SVC bitstream corresponding to a single layer from the mixed SVC bitstream based on a reception environment of the user device, and transmitting the single SVC bitstream to the user device.
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公开(公告)号：US20170126317A1
公开(公告)日：2017-05-04
申请号：US15209399
申请日：2016-07-13
Inventor： Soo Yong JUNG , Jong Jin LEE , Hyun Seo KANG , Sei Hyoung LEE , Hee Seung KIM
CPC classification number: H04B10/2503 , H04B10/40 , H04B10/43 , H04B10/503
Abstract: Provided herein is a single module bi-directional optical transmitting and receiving system including a transmitter transmitting an optical signal by converting a down-signal, and obtaining an up-signal by converting y the optical signal that is received, and a receiver transmitting the optical signal by converting the up-signal, and obtaining the down-signal by converting the optical signal that is received, wherein the transmitter and the receiver include a single optical transmitting module including a monitor receiving module, transmit the optical signal through the single optical transmitting module, and receive the optical signal through the monitor receiving module.
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公开(公告)号：US20240126041A1
公开(公告)日：2024-04-18
申请号：US18485784
申请日：2023-10-12
Inventor： HAECHUNG KANG , Eun Kyu KANG , Jong Jin LEE
CPC classification number: G02B7/003 , G01B9/02089 , G02B6/25 , G02B27/0012
Abstract: An apparatus and method for performing optical alignment between optical waveguide elements in manufacturing a surface mountable optical module, in which a plurality of optical waveguide elements are mounted on a surface of a mounting substrate, is disclosed. A controller performs recognition of the interference pattern included in the image information received from the camera, observes parallelism between the substrate support and the mounting substrate and between the mounting substrate and the optical waveguide element using the recognized pattern, generates a control signal to control the transport device according to the observed parallelism, and transmits the control signal to the transport device to perform control of the optical waveguide element.
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