Reflection plate for semiconductor heat treatment and manufacturing method thereof
    10.
    发明授权
    Reflection plate for semiconductor heat treatment and manufacturing method thereof 失效
    半导体热处理用反射板及其制造方法

    公开(公告)号:US07336892B2

    公开(公告)日:2008-02-26

    申请号:US10391583

    申请日:2003-03-20

    IPC分类号: F21V7/00 G02F1/1335

    CPC分类号: H01L21/67115 H01L21/68757

    摘要: It is provided that a reflection plate of semiconductor heat treatment, which is resistant to cracks or deformations by controlling the adsorption of foreign materials and the production of reaction. Said reflection plate 1 for semiconductor heat treatment is composed of a disk-shaped or ring-shaped plate of optically transmissible material and a plate 2 of inorganic material hermetically enclosed in said disk-shaped or ring-shaped plate, in which said plate of inorganic material has at least one side in contact with said plate of optically transmissible material, said at least one side 2a having a surface roughness of Ra 0.1 to 10.0 μm, said at least one side 2a formed grooves 2c therein.

    摘要翻译: 提供了半导体热处理反射板,其通过控制异物的吸附和反应的产生而耐裂纹或变形。 用于半导体热处理的所述反射板1由光学可透射材料的盘形或环形板和密封在所述盘形或环形板上的无机材料板2组成,其中所述无机 材料具有至少一侧与光学可透射材料的所述板接触,所述至少一个侧面2a具有Ra 0.1至10.0μm的表面粗糙度,所述至少一个侧面2a在其中形成沟槽2c。